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UCC5619MWPTR
Electronics Part Number
UCC5619MWPTR-WXManufacturer
Microchip Technology
UCC5619MWPTR
Description
SCSI Terminator IC, 27 Lines, 36-SSOPInventory
564 Pcs New Original In Stock
"27-termination SCSI terminator, 36-SSOP. Provides stable impedance matching, minimizes signal distortion. For reliable SCSI bus operation.",
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Technical Specifications
Category
Interface, Drivers, Receivers, Transceivers
Manufacturer
Microchip Technology
Packaging
Cut Tape, MouseReel, Reel
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-VDFN Exposed Pad
Series
-
Base Product Number
MCP2021
Product Status
Obsolete
Type
Transceiver
Voltage - Supply
6V ~ 18V
Supplier Device Package
8-DFN (4x4)
Data Rate
-
Protocol
LINbus
Number of Drivers/Receivers
1/1
Duplex
Half
Receiver Hysteresis
175 mV
Data Sheet Document (D)
Datasheets
Download MCP2021-330E/MD Product Specification (PDF)
HTML Datasheet
MCP2021-330E/MD-DG
Manuals
Development Tools Catalog
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Standard Package
91
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Frequently Asked Questions (FAQ)
Can the MCP2021-330E/MD be used as a drop-in replacement for the MCP2025-500E/MD in an existing LIN
The MCP2021-330E/MD is not a direct drop-in replacement for the MCP2025-500E/MD due to differences in supply voltage thresholds and wake-up functionality. The MCP2021-330E/MD is designed for 3.3V logic-level wake-up and operates with a 6V to 18V supply, while the MCP2025-500E/MD supports 5V logic wake-up and has enhanced EMI filtering. Using the MCP2021-330E/MD instead may lead to unreliable wake-up behavior in systems relying on 5V signaling. Additionally, the MCP2025 includes improved fault protection. If replacing, verify compatibility of the logic interface and consider adding level shifting or external wake-up conditioning to mitigate risks in automotive applications where wake-up reliability is critical.
What design challenges arise when integrating the MCP2021-330E/MD in high-temperature automotive env
While the MCP2021-330E/MD is rated for operation up to 125°C, sustained use at temperature extremes can impact signal integrity and long-term reliability. At high temperatures, LIN driver rise/fall times may drift, increasing susceptibility to timing errors in daisy-chained sensors. To mitigate risk, ensure proper PCB thermal design: use thermal vias under the exposed pad to improve heat dissipation and avoid placing near high-power components. Additionally, validate LIN bus signal integrity across temperature with oscilloscope eye pattern testing in situ, especially in engine compartment applications where thermal cycling accelerates package stress.
How does the obsolescence of the MCP2021-330E/MD affect long-term production, and what are the best
The MCP2021-330E/MD is marked as obsolete, which poses supply chain and long-term reliability support risks for new designs or extended production runs. For replacement, consider the MCP2021P-330E/MD or MCP2021T-330E/MD, which offer improved ESD protection and extended qualification for automotive use. For higher robustness, evaluate the MCP2025-500E/MD (5V-compatible) or SPCAK-L9637D (STMicroelectronics) for systems needing wake-up filter programmability. Always check cross-supplier availability and perform full qualification testing, especially for functional safety (ISO 26262) systems where qualification data is required.
What are the implications of using the MCP2021-330E/MD in a half-duplex LIN bus with long cable runs
Using the MCP2021-330E/MD in LIN bus designs with cable runs over 10 meters increases the risk of signal reflection and ground potential differences, especially in noisy automotive harnesses. The transceiver lacks internal slew-rate control, so long lines may cause EMI and bit errors. To reduce risk, add a small series resistor (10–22 Ω) at the driver output and ensure a single-point ground connection. Use twisted-pair wiring with LIN-GND to minimize loop area. For runs beyond 15 meters, consider adding a LIN repeater or upgrading to a transceiver with controlled rise time, like the TCAN4550-Q1, in gateway applications.
What PCB layout practices should be followed when designing in the MCP2021-330E/MD to ensure LIN bus
For reliable operation of the MCP2021-330E/MD, follow strict PCB layout guidelines: (1) Connect the exposed thermal pad to a solid ground plane using multiple vias to enhance thermal dissipation and reduce noise coupling. (2) Keep the LIN bus trace as short and direct as possible, minimizing stubs. (3) Route LIN away from high-speed digital signals to prevent crosstalk. (4) Use a 3.3nF external capacitor from VDD to GND close to the supply pin to decouple noise. (5) Maintain a continuous ground plane beneath the transceiver to reduce EMI. Poor layout can degrade receiver hysteresis effectiveness (175mV) and increase susceptibility to false wake-up, especially in 12V automotive systems with high ripple.
Can the MCP2021-330E/MD be used as a drop-in replacement for the MCP2025-500E/MD in an existing LIN
The MCP2021-330E/MD is not a direct drop-in replacement for the MCP2025-500E/MD due to differences in supply voltage thresholds and wake-up functionality. The MCP2021-330E/MD is designed for 3.3V logic-level wake-up and operates with a 6V to 18V supply, while the MCP2025-500E/MD supports 5V logic wake-up and has enhanced EMI filtering. Using the MCP2021-330E/MD instead may lead to unreliable wake-up behavior in systems relying on 5V signaling. Additionally, the MCP2025 includes improved fault protection. If replacing, verify compatibility of the logic interface and consider adding level shifting or external wake-up conditioning to mitigate risks in automotive applications where wake-up reliability is critical.
What design challenges arise when integrating the MCP2021-330E/MD in high-temperature automotive env
While the MCP2021-330E/MD is rated for operation up to 125°C, sustained use at temperature extremes can impact signal integrity and long-term reliability. At high temperatures, LIN driver rise/fall times may drift, increasing susceptibility to timing errors in daisy-chained sensors. To mitigate risk, ensure proper PCB thermal design: use thermal vias under the exposed pad to improve heat dissipation and avoid placing near high-power components. Additionally, validate LIN bus signal integrity across temperature with oscilloscope eye pattern testing in situ, especially in engine compartment applications where thermal cycling accelerates package stress.
How does the obsolescence of the MCP2021-330E/MD affect long-term production, and what are the best
The MCP2021-330E/MD is marked as obsolete, which poses supply chain and long-term reliability support risks for new designs or extended production runs. For replacement, consider the MCP2021P-330E/MD or MCP2021T-330E/MD, which offer improved ESD protection and extended qualification for automotive use. For higher robustness, evaluate the MCP2025-500E/MD (5V-compatible) or SPCAK-L9637D (STMicroelectronics) for systems needing wake-up filter programmability. Always check cross-supplier availability and perform full qualification testing, especially for functional safety (ISO 26262) systems where qualification data is required.
What are the implications of using the MCP2021-330E/MD in a half-duplex LIN bus with long cable runs
Using the MCP2021-330E/MD in LIN bus designs with cable runs over 10 meters increases the risk of signal reflection and ground potential differences, especially in noisy automotive harnesses. The transceiver lacks internal slew-rate control, so long lines may cause EMI and bit errors. To reduce risk, add a small series resistor (10–22 Ω) at the driver output and ensure a single-point ground connection. Use twisted-pair wiring with LIN-GND to minimize loop area. For runs beyond 15 meters, consider adding a LIN repeater or upgrading to a transceiver with controlled rise time, like the TCAN4550-Q1, in gateway applications.
What PCB layout practices should be followed when designing in the MCP2021-330E/MD to ensure LIN bus
For reliable operation of the MCP2021-330E/MD, follow strict PCB layout guidelines: (1) Connect the exposed thermal pad to a solid ground plane using multiple vias to enhance thermal dissipation and reduce noise coupling. (2) Keep the LIN bus trace as short and direct as possible, minimizing stubs. (3) Route LIN away from high-speed digital signals to prevent crosstalk. (4) Use a 3.3nF external capacitor from VDD to GND close to the supply pin to decouple noise. (5) Maintain a continuous ground plane beneath the transceiver to reduce EMI. Poor layout can degrade receiver hysteresis effectiveness (175mV) and increase susceptibility to false wake-up, especially in 12V automotive systems with high ripple.
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Sep 15 2026
