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LMP90079MH/NOPB
Electronics Part Number
LMP90079MH/NOPB-WXManufacturer
Lattice Semiconductor
LMP90079MH/NOPB
Description
Precision AFE IC, Single Channel, 16-Bit, TSSOP-28Inventory
480 Pcs New Original In Stock
"Compact 28-TSSOP AFE, one channel, 16-bit resolution. Accurate low-noise signal conditioning, low-power. For medical, industrial, IoT sensing.",
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Technical Specifications
Category
Embedded, CPLDs (Complex Programmable Logic Devices)
Manufacturer
Lattice Semiconductor
Packaging
Tray
Operating Temperature
0°C ~ 90°C (TJ)
Mounting Type
Surface Mount
Package / Case
100-LQFP
Series
ispMACH® 4000ZE
Base Product Number
LC4256
Product Status
Active
Programmable Type
In System Programmable
Supplier Device Package
100-TQFP (14x14)
DiGi-Electronics Programmable
Not Verified
Number of I/O
64
Number of Macrocells
256
Delay Time tpd(1) Max
7.5 ns
Voltage Supply - Internal
1.7V ~ 1.9V
Number of Logic Elements/Blocks
16
Data Sheet Document (D)
Datasheets
Download LC4256ZE-7TN100C Product Specification (PDF)
HTML Datasheet
LC4256ZE-7TN100C-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
220-1375 LC4256ZE7TN100C LC4256ZE-7TN100C-DG
Standard Package
90
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Frequently Asked Questions (FAQ)
What are the key reliability risks when designing a high-density PCB with the LC4256ZE-7TN100C CPLD
The LC4256ZE-7TN100C has a Moisture Sensitivity Level (MSL) of 3, meaning it can absorb moisture during storage that may cause popcorning during reflow. To avoid this, follow IPC/JEDEC J-STD-033 guidelines: store the device in dry conditions (<10% RH), limit floor life to 168 hours after opening the dry pack, and bake at 125°C for 24 hours if exposure exceeds limits. Additionally, the 100-TQFP (14x14 mm) package has limited thermal dissipation; ensure adequate copper pour and thermal vias under the pad to manage junction temperature, especially near the upper end of its 0°C to 90°C operating range. Poor thermal design can lead to timing drift or premature failure in sustained high-load applications.
Can the LC4256ZE-7TN100C be directly replaced with a Xilinx XC95288XL-7PQG208C in a legacy industria
Direct replacement of the LC4256ZE-7TN100C with the XC95288XL-7PQG208C is not recommended due to critical architectural and interface differences. The Lattice device operates at 1.8V core voltage and uses in-system programmable (ISP) flash-based logic, while the Xilinx part uses 3.3V I/Os and a different JTAG programming protocol. Even if pin counts were compatible (208 vs. 100 pins), voltage level mismatches, timing skew (7.5 ns vs. 7 ns tpd), and I/O banking constraints would require significant board-level changes. If migration is necessary, consider pin-compatible alternatives like the LC4256V-75TN100I (industrial temp grade) or evaluate a full redesign using a modern FPGA with soft-core CPLD functionality.
How should I handle I/O bank voltage compatibility when integrating the LC4256ZE-7TN100C into a mixe
The LC4256ZE-7TN100C supports 3.3V LVTTL/LVCMOS I/O standards despite its 1.8V internal core, making it suitable for interfacing with 3.3V logic. However, ensure that all I/O banks are powered by a clean 3.3V supply and that input signals do not exceed VCCIO + 0.5V to avoid latch-up. Use series termination resistors (22–33 Ω) on high-speed lines to reduce ringing, and avoid connecting 5V-tolerant inputs without level-shifting circuitry. Since the device lacks true 5V tolerance, any legacy TTL interface must include a voltage translator like the TXB0108 to prevent damage and ensure reliable signal integrity.
What design constraints should be considered when using the LC4256ZE-7TN100C in a battery-powered em
While the LC4256ZE-7TN100C is optimized for low-power operation, its static current can increase significantly near the upper end of its temperature range (up to 90°C). In battery-powered designs, minimize leakage by disabling unused macrocells via software configuration and using the global clock gating feature to reduce dynamic power. Also, ensure the 1.8V core supply is regulated with a low-quiescent-current LDO (e.g., TPS7A20) to avoid wasting energy in regulation. Avoid operating near the 90°C limit, as junction temperature rise can double static current—consider derating or adding thermal relief if ambient temperatures exceed 70°C.
Is the LC4256ZE-7TN100C suitable for safety-critical automotive applications, and what qualification
The LC4256ZE-7TN100C is not qualified for automotive use—it lacks AEC-Q100 certification, extended temperature range (-40°C to +125°C), and documentation for functional safety (e.g., FMEDA reports). Its operating range tops at 90°C junction temperature, which is insufficient for under-hood environments. For ASIL-compliant systems, consider automotive-grade alternatives such as the LC4256V-75TN100I (industrial temp, -40°C to +85°C) or migrate to an FPGA with ISO 26262 support like the Lattice Certus™-NX series. Always perform a full FMEDA and fault injection analysis if deploying in safety-relevant functions, even with industrial-grade parts.
What are the key reliability risks when designing a high-density PCB with the LC4256ZE-7TN100C CPLD
The LC4256ZE-7TN100C has a Moisture Sensitivity Level (MSL) of 3, meaning it can absorb moisture during storage that may cause popcorning during reflow. To avoid this, follow IPC/JEDEC J-STD-033 guidelines: store the device in dry conditions (<10% RH), limit floor life to 168 hours after opening the dry pack, and bake at 125°C for 24 hours if exposure exceeds limits. Additionally, the 100-TQFP (14x14 mm) package has limited thermal dissipation; ensure adequate copper pour and thermal vias under the pad to manage junction temperature, especially near the upper end of its 0°C to 90°C operating range. Poor thermal design can lead to timing drift or premature failure in sustained high-load applications.
Can the LC4256ZE-7TN100C be directly replaced with a Xilinx XC95288XL-7PQG208C in a legacy industria
Direct replacement of the LC4256ZE-7TN100C with the XC95288XL-7PQG208C is not recommended due to critical architectural and interface differences. The Lattice device operates at 1.8V core voltage and uses in-system programmable (ISP) flash-based logic, while the Xilinx part uses 3.3V I/Os and a different JTAG programming protocol. Even if pin counts were compatible (208 vs. 100 pins), voltage level mismatches, timing skew (7.5 ns vs. 7 ns tpd), and I/O banking constraints would require significant board-level changes. If migration is necessary, consider pin-compatible alternatives like the LC4256V-75TN100I (industrial temp grade) or evaluate a full redesign using a modern FPGA with soft-core CPLD functionality.
How should I handle I/O bank voltage compatibility when integrating the LC4256ZE-7TN100C into a mixe
The LC4256ZE-7TN100C supports 3.3V LVTTL/LVCMOS I/O standards despite its 1.8V internal core, making it suitable for interfacing with 3.3V logic. However, ensure that all I/O banks are powered by a clean 3.3V supply and that input signals do not exceed VCCIO + 0.5V to avoid latch-up. Use series termination resistors (22–33 Ω) on high-speed lines to reduce ringing, and avoid connecting 5V-tolerant inputs without level-shifting circuitry. Since the device lacks true 5V tolerance, any legacy TTL interface must include a voltage translator like the TXB0108 to prevent damage and ensure reliable signal integrity.
What design constraints should be considered when using the LC4256ZE-7TN100C in a battery-powered em
While the LC4256ZE-7TN100C is optimized for low-power operation, its static current can increase significantly near the upper end of its temperature range (up to 90°C). In battery-powered designs, minimize leakage by disabling unused macrocells via software configuration and using the global clock gating feature to reduce dynamic power. Also, ensure the 1.8V core supply is regulated with a low-quiescent-current LDO (e.g., TPS7A20) to avoid wasting energy in regulation. Avoid operating near the 90°C limit, as junction temperature rise can double static current—consider derating or adding thermal relief if ambient temperatures exceed 70°C.
Is the LC4256ZE-7TN100C suitable for safety-critical automotive applications, and what qualification
The LC4256ZE-7TN100C is not qualified for automotive use—it lacks AEC-Q100 certification, extended temperature range (-40°C to +125°C), and documentation for functional safety (e.g., FMEDA reports). Its operating range tops at 90°C junction temperature, which is insufficient for under-hood environments. For ASIL-compliant systems, consider automotive-grade alternatives such as the LC4256V-75TN100I (industrial temp, -40°C to +85°C) or migrate to an FPGA with ISO 26262 support like the Lattice Certus™-NX series. Always perform a full FMEDA and fault injection analysis if deploying in safety-relevant functions, even with industrial-grade parts.
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Sep 15 2026
