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IP4252CZ16-8,118
Electronics Part Number
IP4252CZ16-8,118-WXManufacturer
Nexperia
IP4252CZ16-8,118
Description
Pi-Pattern Filter: 40Ω and 12pF, SMD (Surface Mount Device)Inventory
940 Pcs New Original In Stock
16-XFDFN exposed pad | 8-channel 2nd-order low-pass R=40Ω C=12pF | RC Pi EMI filter | Signal-line EMI suppression
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Basic cost: USD 70.00
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Technical Specifications
Category
EMI/RFI Filters (LC, RC Networks)
Manufacturer
Nexperia
Packaging
Tape & Reel (TR)
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-UFDFN Exposed Pad
Series
-
Base Product Number
IP4252
Product Status
Active
Type
Low Pass
Voltage - Rated
-
Number of Channels
4
Filter Order
2nd
Height
0.022" (0.55mm)
Applications
LAN, WAN
Size / Dimension
0.067" L x 0.053" W (1.70mm x 1.35mm)
Technology
RC (Pi)
Center / Cutoff Frequency
-
Attenuation Value
12dB @ 800MHz ~ 3GHz
Resistance - Channel (Ohms)
40
Values
R = 40Ohms, C = 12pF (Total)
ESD Protection
Yes
Data Sheet Document (D)
Datasheets
Download IP4252CZ8-4-TTL,13 Product Specification (PDF)
HTML Datasheet
IP4252CZ8-4-TTL,13-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8548.00.0000
Additional Information
Other Names
568-10480-2 5202-IP4252CZ8-4-TTL,13TR NEXIP4252CZ8-4-TTL13 568-10480-1 934064754132 IP4252CZ8-4-TTL,13-DG 1727-1267-2 568-10480-2-DG 1727-1267-1 568-10480-6 568-10480-6-DG 1727-1267-6 2156-IP4252CZ8-4-TTL,13-NEX 568-10480-1-DG
Standard Package
4,000
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Frequently Asked Questions (FAQ)
When designing in the IP4252CZ8-4-TTL,13 for high-speed data lines in a compact IoT gateway, what ar
When integrating the IP4252CZ8-4-TTL,13 into high-speed LAN/WAN signal paths, keep trace lengths as short as possible—ideally under 2 mm—to minimize parasitic inductance and maintain the effectiveness of its 2nd-order RC (Pi) filter topology. Use controlled impedance routing if the signal rise times are fast (e.g., >100 Mbps), and ensure solid ground vias near the exposed pad for proper RF grounding. Avoid routing other noisy signals nearby to prevent coupling into the filtered channels. The small 1.70mm x 1.35mm footprint demands precision layout, so follow IPC standards for SMT thermal relief and stencil design to prevent tombstoning during reflow.
Can the IP4252CZ8-4-TTL,13 be used as a drop-in replacement for the TDK MLF1820P40R in a space-const
The IP4252CZ8-4-TTL,13 is not a direct pin-to-pin replacement for the TDK MLF1820P40R due to differences in package size (UFDFN vs. 1812) and internal RC configuration, though both provide ~40Ω series resistance with similar capacitance. However, the IP4252CZ8-4-TTL,13 offers ESD protection up to ±8kV (IEC 61000-4-2) and better high-frequency attenuation (12dB @ 800MHz–3GHz) in a much smaller 1.7mm package, making it superior for modern compact designs. To use it as a substitute, redesign the layout to accommodate the 8-UFDFN footprint and verify signal rise time degradation due to the Pi-filter effect on edge-sensitive Ethernet signals.
What are the risks of using the IP4252CZ8-4-TTL,13 on a 2.5V LVCMOS signal line with fast edge rates
Using the IP4252CZ8-4-TTL,13 on fast 2.5V LVCMOS signals introduces RC-induced rise/fall time delays due to its 40Ω series resistor and 12pF total shunt capacitance per channel. This can degrade edge rates and tighten timing budgets, especially in clocked or synchronous interfaces. Estimate rise time increase using τ ≈ R × C (~480ps), which may be acceptable for signals below 50MHz but could violate setup/hold times at higher speeds. To mitigate risk, simulate the channel using IBIS models if available, or prototype with series test points to bypass channels if timing margins are too tight.
How does the ESD protection in the IP4252CZ8-4-TTL,13 compare to discrete TVS diodes like the SP1203
The IP4252CZ8-4-TTL,13 integrates ESD protection rated to ±8kV contact discharge (IEC 61000-4-2), which is effective for handling typical electrostatic events in handled environments, but it is not a substitute for robust transient protection in harsh industrial or outdoor applications. Unlike dedicated TVS arrays such as the SP1203-04UTG—which can handle higher surge currents (e.g., IEC 61000-4-5)—the ESD function in the IP4252CZ8-4-TTL,13 is optimized for board-level, low-energy transients. For full robustness, use the IP4252CZ8-4-TTL,13 as a front-end filter in conjunction with a primary TVS clamp, especially when connecting to external ports.
What long-term reliability concerns should be evaluated when deploying the IP4252CZ8-4-TTL,13 in an
While the IP4252CZ8-4-TTL,13 is rated for operation up to 85°C and is AEC-Q100 not qualified, prolonged exposure to high ambient temperatures in automotive environments may accelerate aging of the internal RC elements and increase drift in resistance or capacitance values. Since the device lacks formal automotive qualification, use it only in non-safety-critical infotainment zones with adequate thermal derating. Ensure the PCB design includes thermal relief and avoids heat stacking from adjacent power components. Prefer alternatives with AEC-Q200 compliance (e.g., AVX’s eSMB series) if long-term reliability under thermal cycling is critical.
When designing in the IP4252CZ8-4-TTL,13 for high-speed data lines in a compact IoT gateway, what ar
When integrating the IP4252CZ8-4-TTL,13 into high-speed LAN/WAN signal paths, keep trace lengths as short as possible—ideally under 2 mm—to minimize parasitic inductance and maintain the effectiveness of its 2nd-order RC (Pi) filter topology. Use controlled impedance routing if the signal rise times are fast (e.g., >100 Mbps), and ensure solid ground vias near the exposed pad for proper RF grounding. Avoid routing other noisy signals nearby to prevent coupling into the filtered channels. The small 1.70mm x 1.35mm footprint demands precision layout, so follow IPC standards for SMT thermal relief and stencil design to prevent tombstoning during reflow.
Can the IP4252CZ8-4-TTL,13 be used as a drop-in replacement for the TDK MLF1820P40R in a space-const
The IP4252CZ8-4-TTL,13 is not a direct pin-to-pin replacement for the TDK MLF1820P40R due to differences in package size (UFDFN vs. 1812) and internal RC configuration, though both provide ~40Ω series resistance with similar capacitance. However, the IP4252CZ8-4-TTL,13 offers ESD protection up to ±8kV (IEC 61000-4-2) and better high-frequency attenuation (12dB @ 800MHz–3GHz) in a much smaller 1.7mm package, making it superior for modern compact designs. To use it as a substitute, redesign the layout to accommodate the 8-UFDFN footprint and verify signal rise time degradation due to the Pi-filter effect on edge-sensitive Ethernet signals.
What are the risks of using the IP4252CZ8-4-TTL,13 on a 2.5V LVCMOS signal line with fast edge rates
Using the IP4252CZ8-4-TTL,13 on fast 2.5V LVCMOS signals introduces RC-induced rise/fall time delays due to its 40Ω series resistor and 12pF total shunt capacitance per channel. This can degrade edge rates and tighten timing budgets, especially in clocked or synchronous interfaces. Estimate rise time increase using τ ≈ R × C (~480ps), which may be acceptable for signals below 50MHz but could violate setup/hold times at higher speeds. To mitigate risk, simulate the channel using IBIS models if available, or prototype with series test points to bypass channels if timing margins are too tight.
How does the ESD protection in the IP4252CZ8-4-TTL,13 compare to discrete TVS diodes like the SP1203
The IP4252CZ8-4-TTL,13 integrates ESD protection rated to ±8kV contact discharge (IEC 61000-4-2), which is effective for handling typical electrostatic events in handled environments, but it is not a substitute for robust transient protection in harsh industrial or outdoor applications. Unlike dedicated TVS arrays such as the SP1203-04UTG—which can handle higher surge currents (e.g., IEC 61000-4-5)—the ESD function in the IP4252CZ8-4-TTL,13 is optimized for board-level, low-energy transients. For full robustness, use the IP4252CZ8-4-TTL,13 as a front-end filter in conjunction with a primary TVS clamp, especially when connecting to external ports.
What long-term reliability concerns should be evaluated when deploying the IP4252CZ8-4-TTL,13 in an
While the IP4252CZ8-4-TTL,13 is rated for operation up to 85°C and is AEC-Q100 not qualified, prolonged exposure to high ambient temperatures in automotive environments may accelerate aging of the internal RC elements and increase drift in resistance or capacitance values. Since the device lacks formal automotive qualification, use it only in non-safety-critical infotainment zones with adequate thermal derating. Ensure the PCB design includes thermal relief and avoids heat stacking from adjacent power components. Prefer alternatives with AEC-Q200 compliance (e.g., AVX’s eSMB series) if long-term reliability under thermal cycling is critical.
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Sep 15 2026
