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G16-A-0394-25-008

Electronics Part Number

G16-A-0394-25-008-WX
G16-A-0394-25-008

Description

1.005" Round Cylindrical Magnet, 0.210"

Inventory

346 Pcs New Original In Stock
Magnalox magnet disc, 25.53mm x 5.33mm, offering stable magnetic field strength for position sensing and actuation in industrial systems.
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Technical Specifications

Category Motion Sensors, IMUs (Inertial Measurement Units)

Manufacturer STMicroelectronics

Packaging -

Operating Temperature -40°C ~ 85°C (TA)

Mounting Type Surface Mount

Package / Case 28-VFLGA Module

Series -

Base Product Number LSM303

Sensor Type Accelerometer, Magnetometer, 6 Axis

Product Status Obsolete

Output Type I2C

Supplier Device Package 28-LGA (5x5)

Data Sheet Document (D)

Datasheets Download LSM303DLMTR Product Specification (PDF)

HTML Datasheet LSM303DLMTR-DG

Design Resources Development Tool Selector

Environmental & Export Classification

RoHS Status ROHS3 Compliant

Moisture Sensitivity Level (MSL) 3 (168 Hours)

REACH Status REACH Unaffected

ECCN EAR99

HTSUS 8542.39.0001

Additional Information

Other Names 497-11240-6 497-11240-2 497-11240-1

Standard Package 3,000

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Frequently Asked Questions (FAQ)

FAQ Icon

Can the LSM303DLMTR still be used in new designs despite being marked as obsolete by STMicroelectron

While the LSM303DLMTR remains electrically functional and supported by existing design documentation, its 'obsolete' status from STMicroelectronics means it is no longer recommended for new designs and may face end-of-life (EOL) supply constraints. Designing in this part introduces significant long-term risks, including sudden last-time buy notices, price volatility, and potential counterfeit exposure due to dwindling stock. If you must use it for legacy compatibility or rapid prototyping, secure a multi-year inventory commitment from authorized distributors and implement a qualified second-source strategy using modern alternatives like the LSM6DSL (accelerometer) paired with the LIS3MDL (magnetometer), which offer similar 6-axis functionality in a more future-proof package.
FAQ Icon

What are the critical layout and grounding considerations when integrating the LSM303DLMTR on a dens

The LSM303DLMTR’s magnetometer is highly sensitive to magnetic interference, including that generated by nearby high-frequency digital signals such as I2C clock lines. To minimize noise, route I2C traces (SCL/SDA) at least 3x the trace width away from the sensor, avoid running them parallel to the sensor’s analog output paths, and use a solid ground plane beneath the entire 28-LGA footprint with multiple vias to chassis ground. Additionally, place a 100nF decoupling capacitor as close as possible to the VDD pin and isolate the I2C pull-up resistors (typically 4.7kΩ) on a separate net to reduce transient current coupling. Failure to follow these practices may result in heading inaccuracies or erratic compass behavior in navigation applications.
FAQ Icon

How does the LSM303DLMTR compare to the Bosch BMX055 for eCompass applications in terms of magnetic

The LSM303DLMTR offers lower typical power consumption (≈150 µA in combo mode) compared to the BMX055 (≈500 µA), making it preferable for ultra-low-power wearable designs. However, the BMX055 integrates a more advanced magnetic interference compensation algorithm and better hard-iron calibration support, which improves heading accuracy in environments with ferrous materials or EMI sources like motors or speakers. If your application involves dynamic magnetic environments—such as drones, industrial handhelds, or smartwatches near charging coils—the BMX055 provides superior robustness. For static or controlled environments where power budget is critical, the LSM303DLMTR remains viable, but consider migrating to newer ST parts like the LSM6DSO + LIS3MDL combo for better long-term support and performance.
FAQ Icon

Is it safe to operate the LSM303DLMTR near strong external magnetic fields, such as those generated

The LSM303DLMTR’s magnetometer can experience temporary saturation or permanent offset shifts when exposed to magnetic fields exceeding ±1000 µT, commonly found near neodymium magnets, speakers, or Qi chargers. This can corrupt heading data for minutes after exposure. To mitigate risk, maintain a minimum 15–20 mm clearance from known magnetic sources, use mu-metal shielding if space allows, and implement real-time software compensation using accelerometer-based tilt correction and dynamic calibration routines. Additionally, monitor the magnetometer’s Z-axis output for sudden spikes—sudden deviations >500 µT often indicate field saturation. In high-risk applications, consider replacing the LSM303DLMTR with a shielded alternative like the AK09918C from Asahi Kasei, which includes built-in magnetic anomaly detection.
FAQ Icon

What are the reflow soldering risks with the LSM303DLMTR given its MSL 3 rating, and how should I ha

With an MSL 3 (168-hour floor life) rating, the LSM303DLMTR is susceptible to moisture absorption, which can lead to 'popcorning' or delamination during reflow if not handled properly. Components must be baked at 125°C for 24 hours if exposed to ambient conditions beyond 168 hours post-bagging. Always store unopened reels in moisture barrier bags with desiccant and use a reflow profile that stays within the peak temperature of 260°C ±5°C with a time above liquidus (TAL) of 40–60 seconds. Avoid nitrogen-assisted reflow unless validated, as rapid thermal gradients may stress the 28-LGA package. Implementing a controlled bake-and-assembly workflow is essential—failure to do so may result in latent field failures due to internal cracking or bond wire damage.
FAQ Icon

Can the LSM303DLMTR still be used in new designs despite being marked as obsolete by STMicroelectron

While the LSM303DLMTR remains electrically functional and supported by existing design documentation, its 'obsolete' status from STMicroelectronics means it is no longer recommended for new designs and may face end-of-life (EOL) supply constraints. Designing in this part introduces significant long-term risks, including sudden last-time buy notices, price volatility, and potential counterfeit exposure due to dwindling stock. If you must use it for legacy compatibility or rapid prototyping, secure a multi-year inventory commitment from authorized distributors and implement a qualified second-source strategy using modern alternatives like the LSM6DSL (accelerometer) paired with the LIS3MDL (magnetometer), which offer similar 6-axis functionality in a more future-proof package.
FAQ Icon

What are the critical layout and grounding considerations when integrating the LSM303DLMTR on a dens

The LSM303DLMTR’s magnetometer is highly sensitive to magnetic interference, including that generated by nearby high-frequency digital signals such as I2C clock lines. To minimize noise, route I2C traces (SCL/SDA) at least 3x the trace width away from the sensor, avoid running them parallel to the sensor’s analog output paths, and use a solid ground plane beneath the entire 28-LGA footprint with multiple vias to chassis ground. Additionally, place a 100nF decoupling capacitor as close as possible to the VDD pin and isolate the I2C pull-up resistors (typically 4.7kΩ) on a separate net to reduce transient current coupling. Failure to follow these practices may result in heading inaccuracies or erratic compass behavior in navigation applications.
FAQ Icon

How does the LSM303DLMTR compare to the Bosch BMX055 for eCompass applications in terms of magnetic

The LSM303DLMTR offers lower typical power consumption (≈150 µA in combo mode) compared to the BMX055 (≈500 µA), making it preferable for ultra-low-power wearable designs. However, the BMX055 integrates a more advanced magnetic interference compensation algorithm and better hard-iron calibration support, which improves heading accuracy in environments with ferrous materials or EMI sources like motors or speakers. If your application involves dynamic magnetic environments—such as drones, industrial handhelds, or smartwatches near charging coils—the BMX055 provides superior robustness. For static or controlled environments where power budget is critical, the LSM303DLMTR remains viable, but consider migrating to newer ST parts like the LSM6DSO + LIS3MDL combo for better long-term support and performance.
FAQ Icon

Is it safe to operate the LSM303DLMTR near strong external magnetic fields, such as those generated

The LSM303DLMTR’s magnetometer can experience temporary saturation or permanent offset shifts when exposed to magnetic fields exceeding ±1000 µT, commonly found near neodymium magnets, speakers, or Qi chargers. This can corrupt heading data for minutes after exposure. To mitigate risk, maintain a minimum 15–20 mm clearance from known magnetic sources, use mu-metal shielding if space allows, and implement real-time software compensation using accelerometer-based tilt correction and dynamic calibration routines. Additionally, monitor the magnetometer’s Z-axis output for sudden spikes—sudden deviations >500 µT often indicate field saturation. In high-risk applications, consider replacing the LSM303DLMTR with a shielded alternative like the AK09918C from Asahi Kasei, which includes built-in magnetic anomaly detection.
FAQ Icon

What are the reflow soldering risks with the LSM303DLMTR given its MSL 3 rating, and how should I ha

With an MSL 3 (168-hour floor life) rating, the LSM303DLMTR is susceptible to moisture absorption, which can lead to 'popcorning' or delamination during reflow if not handled properly. Components must be baked at 125°C for 24 hours if exposed to ambient conditions beyond 168 hours post-bagging. Always store unopened reels in moisture barrier bags with desiccant and use a reflow profile that stays within the peak temperature of 260°C ±5°C with a time above liquidus (TAL) of 40–60 seconds. Avoid nitrogen-assisted reflow unless validated, as rapid thermal gradients may stress the 28-LGA package. Implementing a controlled bake-and-assembly workflow is essential—failure to do so may result in latent field failures due to internal cracking or bond wire damage.

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