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CW1300-1
Electronics Part Number
CW1300-1-WXManufacturer
Silicon Labs
CW1300-1
Description
Vibration Tilt Switch, 60V, 0.25AInventory
637 Pcs New Original In Stock
Advanced motion sensor transducers offering stable performance for vibration, tilt, and velocity measurement in harsh environments.
Quantity
Minimum 1
Minimum 1
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Freight
Basic cost: USD 70.00
Actual cost may vary depending on weight and destination
Shipping method
Shipped from Hong Kong via FedEx/DHL/UPS/TNT
Delivery Time
In-stock items: Ready to ship in 1-2 days
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Technical Specifications
Category
Optical Sensors, Ambient Light, IR, UV Sensors
Manufacturer
Silicon Labs
Packaging
-
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
10-WFQFN
Series
-
Product Status
Obsolete
Type
Ambient
Output Type
I2C
Voltage - Supply
1.71V ~ 3.6V
Supplier Device Package
10-QFN (2x2)
Wavelength
-
Proximity Detection
Yes
Data Sheet Document (D)
Datasheets
Download SI1141-A10-GMR Product Specification (PDF)
HTML Datasheet
SI1141-A10-GMR-DG
Design Resources
SI114x Designer Guide
Environmental & Export Classification
Moisture Sensitivity Level (MSL)
4 (72 Hours)
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
336-1968-1 336-1968 336-1968-2 SI1141A10GMR 336-1968-DG 336-1968-6
Standard Package
2,500
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Frequently Asked Questions (FAQ)
Can the SI1141-A10-GMR be used as a drop-in replacement for the VEML6030 in low-light ambient sensin
The SI1141-A10-GMR is not a direct drop-in replacement for the VEML6030 due to differences in I2C address schemes, register mapping, and optical filtering characteristics. While both support I2C and operate in similar voltage ranges (1.71V–3.6V), the SI1141-A10-GMR includes proximity detection but has less granular lux resolution in very low-light conditions compared to the VEML6030. Design-in risks include incorrect ambient light calibration and false proximity triggers if the interrupt thresholds are not redesigned. Always validate optical window compatibility and IR interference from nearby LEDs when migrating designs.
How does the obsolescence of the SI1141-A10-GMR impact long-term reliability and production lifecycl
Since the SI1141-A10-GMR is marked as obsolete, ongoing production designs face supply chain risks despite current inventory availability (3292 pcs). Relying on this part increases end-of-life exposure, especially for products with long manufacturing cycles. For long-term reliability, consider redesigning with active-pin-compatible successors like the Si1143-A10-GMR or Si1153-A11-GMR, which offer improved UV index calculation and better I2C clock stretching handling. Mitigate risk by securing last-time buy quantities and validating second sources early.
What are the critical layout considerations when integrating the SI1141-A10-GMR in high-noise indust
To maintain signal integrity with the SI1141-A10-GMR in noisy environments, minimize trace lengths between the sensor and the microcontroller, especially for SCL/SDA lines, which should be routed away from switching regulators or RF sources. Use a dedicated ground plane under the 10-QFN (2x2) package and ensure proper decoupling with a 0.1µF ceramic capacitor close to VDD. Avoid placing the sensor near heat-generating components, as thermal gradients can alter ambient readings. Shielding the optical path from stray IR sources prevents false proximity detection, a common integration pitfall.
Is the SI1141-A10-GMR suitable for wearable health devices requiring continuous ambient light adjust
The SI1141-A10-GMR can be used in wearable devices for ambient light adjustment but requires careful power management due to its higher active current versus modern alternatives like the LTR-390UI-01. While it operates within the 1.71V–3.6V range suitable for battery-powered systems, its lack of autonomous low-power polling modes increases MCU intervention and power draw. For continuous operation, implement periodic I2C wake-up cycles and disable proximity sensing when unused. Monitor die temperature via I2C registers to compensate for drift under prolonged operation, especially in sealed enclosures.
What are the reliability concerns when reflow soldering the SI1141-A10-GMR given its MSL 4 rating, a
The SI1141-A10-GMR has an MSL 4 rating, meaning it must be reflowed within 72 hours of exposure to ambient conditions unless stored in dry packaging or baked per J-STD-033. To maximize yield, use a moisture barrier bag with desiccant for storage and follow a strict floor-time tracking process. Use a JEDEC-compliant reflow profile with a maximum peak temperature of 260°C. Pre-baking at 125°C for 24 hours is recommended for components exposed beyond the 72-hour threshold. Poor humidity control during assembly is a major cause of delamination and early field failure, particularly in humid climates.
Can the SI1141-A10-GMR be used as a drop-in replacement for the VEML6030 in low-light ambient sensin
The SI1141-A10-GMR is not a direct drop-in replacement for the VEML6030 due to differences in I2C address schemes, register mapping, and optical filtering characteristics. While both support I2C and operate in similar voltage ranges (1.71V–3.6V), the SI1141-A10-GMR includes proximity detection but has less granular lux resolution in very low-light conditions compared to the VEML6030. Design-in risks include incorrect ambient light calibration and false proximity triggers if the interrupt thresholds are not redesigned. Always validate optical window compatibility and IR interference from nearby LEDs when migrating designs.
How does the obsolescence of the SI1141-A10-GMR impact long-term reliability and production lifecycl
Since the SI1141-A10-GMR is marked as obsolete, ongoing production designs face supply chain risks despite current inventory availability (3292 pcs). Relying on this part increases end-of-life exposure, especially for products with long manufacturing cycles. For long-term reliability, consider redesigning with active-pin-compatible successors like the Si1143-A10-GMR or Si1153-A11-GMR, which offer improved UV index calculation and better I2C clock stretching handling. Mitigate risk by securing last-time buy quantities and validating second sources early.
What are the critical layout considerations when integrating the SI1141-A10-GMR in high-noise indust
To maintain signal integrity with the SI1141-A10-GMR in noisy environments, minimize trace lengths between the sensor and the microcontroller, especially for SCL/SDA lines, which should be routed away from switching regulators or RF sources. Use a dedicated ground plane under the 10-QFN (2x2) package and ensure proper decoupling with a 0.1µF ceramic capacitor close to VDD. Avoid placing the sensor near heat-generating components, as thermal gradients can alter ambient readings. Shielding the optical path from stray IR sources prevents false proximity detection, a common integration pitfall.
Is the SI1141-A10-GMR suitable for wearable health devices requiring continuous ambient light adjust
The SI1141-A10-GMR can be used in wearable devices for ambient light adjustment but requires careful power management due to its higher active current versus modern alternatives like the LTR-390UI-01. While it operates within the 1.71V–3.6V range suitable for battery-powered systems, its lack of autonomous low-power polling modes increases MCU intervention and power draw. For continuous operation, implement periodic I2C wake-up cycles and disable proximity sensing when unused. Monitor die temperature via I2C registers to compensate for drift under prolonged operation, especially in sealed enclosures.
What are the reliability concerns when reflow soldering the SI1141-A10-GMR given its MSL 4 rating, a
The SI1141-A10-GMR has an MSL 4 rating, meaning it must be reflowed within 72 hours of exposure to ambient conditions unless stored in dry packaging or baked per J-STD-033. To maximize yield, use a moisture barrier bag with desiccant for storage and follow a strict floor-time tracking process. Use a JEDEC-compliant reflow profile with a maximum peak temperature of 260°C. Pre-baking at 125°C for 24 hours is recommended for components exposed beyond the 72-hour threshold. Poor humidity control during assembly is a major cause of delamination and early field failure, particularly in humid climates.
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Sep 15 2026
