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BK/GLD-10
Electronics Part Number
BK/GLD-10-WXManufacturer
NXP Semiconductors
BK/GLD-10
Description
Cartridge Fuse 10A 50VAC/VDC CylindricalInventory
545 Pcs New Original In Stock
Cartridge fuse, 10A, 50VAC/DC, requires holder; fast-acting overcurrent protection for low-voltage circuits and equipment.
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Minimum 1
Minimum 1
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Freight
Basic cost: USD 70.00
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Shipped from Hong Kong via FedEx/DHL/UPS/TNT
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Technical Specifications
Category
RFID, RF Access, Monitoring ICs
Manufacturer
NXP Semiconductors
Packaging
Cut Tape (CT) & Digi-Reel®
Operating Temperature
-40°C ~ 95°C
Mounting Type
Surface Mount
Package / Case
8-XFQFN Exposed Pad
Series
-
Base Product Number
NT3H1101
Product Status
Obsolete
Type
RFID Transponder
Frequency
13.56MHz
Voltage - Supply
1.7V ~ 3.6V
Supplier Device Package
8-XQFN (1.6x1.6)
Standards
ISO 14443
Interface
I2C
Data Sheet Document (D)
Datasheets
Download NT3H1101W0FHKH Product Specification (PDF)
HTML Datasheet
NT3H1101W0FHKH-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
568-12152-6 568-12152-1 568-12152-2 935302842125
Standard Package
4,000
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Frequently Asked Questions (FAQ)
How can I mitigate supply voltage instability risks when integrating the NT3H1101W0FHKH in low-power
When using the NT3H1101W0FHKH in low-power systems near 1.7V, ensure stable supply by adding a low-quiescent-current LDO with tight load regulation and bypassing the VDD pin with a 100nF ceramic capacitor placed within 2mm of the supply pin. Voltage droops during RF field coupling can cause unintended resets; consider monitoring supply integrity through the I2C interface and reapplying power sequencing if communication errors occur. Additionally, verify performance across temperature extremes, especially at cold starts where battery voltage sags may push below 1.7V despite nominal charge.
Is the NT3H1101W0FHKH a reliable drop-in replacement for the STMicroelectronics ST25TB512-A in secur
The NT3H1101W0FHKH is not a direct drop-in replacement for the ST25TB512-A due to differences in memory organization, I2C addressing, and RF parameter tuning. While both support ISO 14443 and operate at 13.56MHz, the NT3H1101W0FHKH uses a different I2C slave address scheme requiring firmware updates. Additionally, its dynamic locking and password protection features differ in implementation—ensure access control logic accounts for these variations. Always verify antenna matching network compatibility, as the NT3H1101W0FHKH may require minor adjustments to tuning capacitors compared to ST-based designs.
What are the key thermal and mechanical considerations when routing high-density PCBs with the NT3H1
For automotive applications approaching 95°C, proper thermal management of the NT3H1101W0FHKH’s exposed pad is critical. Use a thermal via array (at least 4 vias) under the pad connected to an internal ground plane to dissipate heat and avoid localized solder joint stress. Ensure solder stencil aperture design delivers sufficient paste volume to prevent voiding, which can degrade thermal conductivity and long-term reliability under thermal cycling. Avoid placing sensitive analog traces beneath the IC due to potential EMI coupling during field activation.
How does the obsolete status of the NT3H1101W0FHKH impact long-term availability and recommended las
The obsolete status of the NT3H1101W0FHKH means NXP Semiconductors no longer guarantees production runs, increasing supply chain risk for long-lifecycle medical devices. For compliance and continuity, evaluate last-time buy quantities based on full product lifecycle demand forecasts, including service and replacement needs. Consider transitioning to the pin- and function-compatible NT3H1201 series, which offers extended availability and enhanced security features. Secure authenticated inventory from franchised distributors now to reduce counterfeit risks post-obsolescence.
What EMI filtering and layout strategies prevent false wake-up events in the NT3H1101W0FHKH when dep
To prevent false wake-ups in noisy industrial settings, implement a shielded antenna layout with guarded ground rings around the NT3H1101W0FHKH’s RF input traces, keeping trace lengths symmetric and under 15mm. Add small ferrite beads (e.g., 600Ω @ 100MHz) in series with the antenna feed and use 0.5pF–1pF tuning capacitors with high-Q ceramic dielectrics (C0G/NP0) to improve selectivity. Keep digital I2C lines away from antenna paths, route over solid ground planes, and enable the IC's internal field detection hysteresis via configuration registers to improve noise immunity.
How can I mitigate supply voltage instability risks when integrating the NT3H1101W0FHKH in low-power
When using the NT3H1101W0FHKH in low-power systems near 1.7V, ensure stable supply by adding a low-quiescent-current LDO with tight load regulation and bypassing the VDD pin with a 100nF ceramic capacitor placed within 2mm of the supply pin. Voltage droops during RF field coupling can cause unintended resets; consider monitoring supply integrity through the I2C interface and reapplying power sequencing if communication errors occur. Additionally, verify performance across temperature extremes, especially at cold starts where battery voltage sags may push below 1.7V despite nominal charge.
Is the NT3H1101W0FHKH a reliable drop-in replacement for the STMicroelectronics ST25TB512-A in secur
The NT3H1101W0FHKH is not a direct drop-in replacement for the ST25TB512-A due to differences in memory organization, I2C addressing, and RF parameter tuning. While both support ISO 14443 and operate at 13.56MHz, the NT3H1101W0FHKH uses a different I2C slave address scheme requiring firmware updates. Additionally, its dynamic locking and password protection features differ in implementation—ensure access control logic accounts for these variations. Always verify antenna matching network compatibility, as the NT3H1101W0FHKH may require minor adjustments to tuning capacitors compared to ST-based designs.
What are the key thermal and mechanical considerations when routing high-density PCBs with the NT3H1
For automotive applications approaching 95°C, proper thermal management of the NT3H1101W0FHKH’s exposed pad is critical. Use a thermal via array (at least 4 vias) under the pad connected to an internal ground plane to dissipate heat and avoid localized solder joint stress. Ensure solder stencil aperture design delivers sufficient paste volume to prevent voiding, which can degrade thermal conductivity and long-term reliability under thermal cycling. Avoid placing sensitive analog traces beneath the IC due to potential EMI coupling during field activation.
How does the obsolete status of the NT3H1101W0FHKH impact long-term availability and recommended las
The obsolete status of the NT3H1101W0FHKH means NXP Semiconductors no longer guarantees production runs, increasing supply chain risk for long-lifecycle medical devices. For compliance and continuity, evaluate last-time buy quantities based on full product lifecycle demand forecasts, including service and replacement needs. Consider transitioning to the pin- and function-compatible NT3H1201 series, which offers extended availability and enhanced security features. Secure authenticated inventory from franchised distributors now to reduce counterfeit risks post-obsolescence.
What EMI filtering and layout strategies prevent false wake-up events in the NT3H1101W0FHKH when dep
To prevent false wake-ups in noisy industrial settings, implement a shielded antenna layout with guarded ground rings around the NT3H1101W0FHKH’s RF input traces, keeping trace lengths symmetric and under 15mm. Add small ferrite beads (e.g., 600Ω @ 100MHz) in series with the antenna feed and use 0.5pF–1pF tuning capacitors with high-Q ceramic dielectrics (C0G/NP0) to improve selectivity. Keep digital I2C lines away from antenna paths, route over solid ground planes, and enable the IC's internal field detection hysteresis via configuration registers to improve noise immunity.
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Sep 15 2026
