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T920N06TOFXPSA1

Electronics Part Number

T920N06TOFXPSA1-WX

Manufacturer

Texas Instruments
T920N06TOFXPSA1

Description

600V 1500A SCR module, DO200AA

Inventory

166 Pcs New Original In Stock
SCR module, DO-200AA A-PUK, 600V, 1500A, single clamp. High surge capacity. For power switching, welding, industrial drives.
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Minimum 1

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Technical Specifications

Category Power Management (PMIC), Voltage Regulators - DC DC Switching Regulators

Manufacturer Texas Instruments

Packaging Tape & Reel (TR)

Operating Temperature -40°C ~ 125°C (TJ)

Mounting Type Surface Mount

Package / Case TO-263-6, D2PAK (5 Leads + Tab), TO-263BA

Series -

Base Product Number TL2575

Product Status Active

Output Type Fixed

Number of Outputs 1

Voltage - Input (Min) 4.75V

Voltage - Input (Max) 60V

Topology Buck

Function Step-Down

Supplier Device Package TO-263 (DDPAK-5)

Voltage - Output (Max) -

Grade Automotive

Qualification AEC-Q100

Current - Output 1A

Output Configuration Positive

Frequency - Switching 52kHz

Voltage - Output (Min/Fixed) 5V

Synchronous Rectifier No

Data Sheet Document (D)

Datasheets Download TL2575HV-05QKTTRQ1 Product Specification (PDF)

HTML Datasheet TL2575HV-05QKTTRQ1-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant

Moisture Sensitivity Level (MSL) 3 (168 Hours)

REACH Status REACH Unaffected

ECCN EAR99

HTSUS 8542.39.0001

Additional Information

Other Names 296-TL2575HV-05QKTTRQ1DKR 296-36738-6-DG 296-TL2575HV-05QKTTRQ1TR TEXTISTL2575HV-05QKTTRQ1 296-36738-2 296-36738-6 296-TL2575HV-05QKTTRQ1CT 2156-TL2575HV-05QKTTRQ1 296-36738-1 -296-36738-1 TL2575HV-05QKTTRQ1-DG 296-36738-2-DG -296-36738-1-DG 296-36738-1-DG

Standard Package 500

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Frequently Asked Questions (FAQ)

FAQ Icon

What are the key design-in risks when using the TL2575HV-05QKTTRQ1 in a high-voltage automotive appl

When designing the TL2575HV-05QKTTRQ1 into automotive systems prone to load dumps (e.g., 60V transients), ensure input transient protection is implemented beyond the device's 60V absolute maximum rating. Even brief overvoltage events can degrade long-term reliability, especially given the part's non-synchronous topology, which lacks low-side FET clamping. Consider adding a transient voltage suppression (TVS) diode on the input and verify PCB creepage/clearance around the DDPAK-5 package. The AEC-Q100 qualification supports robustness, but external protection is critical for field reliability in 12V and 24V vehicle architectures.
FAQ Icon

Can the TL2575HV-05QKTTRQ1 reliably replace the LM2575HV-5.0 in an existing design, and what layout

Yes, the TL2575HV-05QKTTRQ1 can replace the LM2575HV-5.0, especially for automotive-grade reliability (both are AEC-Q100 qualified), but thermal performance must be reassessed due to the TO-263 (DDPAK-5) package variation. The TI version typically has slightly higher RθJA—ensure at least 1 in² of copper pour for thermal dissipation. Also, TI recommends shorter catch diode and input capacitor traces to minimize ringing due to the 52kHz switching frequency. Verify feedback divider loading, as bias currents may differ slightly between manufacturers.
FAQ Icon

How does the non-synchronous rectification in the TL2575HV-05QKTTRQ1 affect efficiency in continuous

The TL2575HV-05QKTTRQ1's non-synchronous design uses an external Schottky diode for rectification, leading to higher conduction losses compared to synchronous regulators—especially below 20% load. At light loads in continuous conduction mode (CCM), diode reverse recovery and forward voltage drop (Vf) degrade efficiency by 8–12% versus synchronous alternatives like the TPS54331. To mitigate, select a low-Vf, fast-recovery diode (e.g., 1N5819 or SB160) and minimize PCB trace inductance in the return path to reduce ringing and EMI.
FAQ Icon

What PCB layout practices minimize thermal stress in the TL2575HV-05QKTTRQ1 under full 1A continuous

To manage thermal stress in the TL2575HV-05QKTTRQ1 under full 1A load—particularly in sealed enclosures—maximize thermal vias (6–8 plated-through holes) beneath the DDPAK-5 tab connected to a solid ground plane. Use wide traces (≥3mm) for VIN, GND, and VOUT to reduce resistive heating. Avoid placing temperature-sensitive components nearby, and confirm junction temperature remains below 110°C with derating. For ambient temperatures above 85°C, consider forced airflow or pulse-skipping operation to reduce average power dissipation.
FAQ Icon

What reliability concerns should be addressed when using the TL2575HV-05QKTTRQ1 in a 48V hybrid powe

In 48V hybrid systems, the TL2575HV-05QKTTRQ1 faces accelerated thermal fatigue due to CTE mismatch between the DDPAK-5 package and PCB. Operate within the -40°C to 125°C junction range, but limit thermal swings to <20°C per cycle by managing load transients. Use lead-free assembly with proper reflow profiling (MSL3, 168-hour floor life) and conformal coating to prevent moisture ingress. Monitor solder joint integrity over time—especially at the high-current tab connection—since thermal cycling can crack joints and increase RDS(on) over time, leading to premature failure.
FAQ Icon

What are the key design-in risks when using the TL2575HV-05QKTTRQ1 in a high-voltage automotive appl

When designing the TL2575HV-05QKTTRQ1 into automotive systems prone to load dumps (e.g., 60V transients), ensure input transient protection is implemented beyond the device's 60V absolute maximum rating. Even brief overvoltage events can degrade long-term reliability, especially given the part's non-synchronous topology, which lacks low-side FET clamping. Consider adding a transient voltage suppression (TVS) diode on the input and verify PCB creepage/clearance around the DDPAK-5 package. The AEC-Q100 qualification supports robustness, but external protection is critical for field reliability in 12V and 24V vehicle architectures.
FAQ Icon

Can the TL2575HV-05QKTTRQ1 reliably replace the LM2575HV-5.0 in an existing design, and what layout

Yes, the TL2575HV-05QKTTRQ1 can replace the LM2575HV-5.0, especially for automotive-grade reliability (both are AEC-Q100 qualified), but thermal performance must be reassessed due to the TO-263 (DDPAK-5) package variation. The TI version typically has slightly higher RθJA—ensure at least 1 in² of copper pour for thermal dissipation. Also, TI recommends shorter catch diode and input capacitor traces to minimize ringing due to the 52kHz switching frequency. Verify feedback divider loading, as bias currents may differ slightly between manufacturers.
FAQ Icon

How does the non-synchronous rectification in the TL2575HV-05QKTTRQ1 affect efficiency in continuous

The TL2575HV-05QKTTRQ1's non-synchronous design uses an external Schottky diode for rectification, leading to higher conduction losses compared to synchronous regulators—especially below 20% load. At light loads in continuous conduction mode (CCM), diode reverse recovery and forward voltage drop (Vf) degrade efficiency by 8–12% versus synchronous alternatives like the TPS54331. To mitigate, select a low-Vf, fast-recovery diode (e.g., 1N5819 or SB160) and minimize PCB trace inductance in the return path to reduce ringing and EMI.
FAQ Icon

What PCB layout practices minimize thermal stress in the TL2575HV-05QKTTRQ1 under full 1A continuous

To manage thermal stress in the TL2575HV-05QKTTRQ1 under full 1A load—particularly in sealed enclosures—maximize thermal vias (6–8 plated-through holes) beneath the DDPAK-5 tab connected to a solid ground plane. Use wide traces (≥3mm) for VIN, GND, and VOUT to reduce resistive heating. Avoid placing temperature-sensitive components nearby, and confirm junction temperature remains below 110°C with derating. For ambient temperatures above 85°C, consider forced airflow or pulse-skipping operation to reduce average power dissipation.
FAQ Icon

What reliability concerns should be addressed when using the TL2575HV-05QKTTRQ1 in a 48V hybrid powe

In 48V hybrid systems, the TL2575HV-05QKTTRQ1 faces accelerated thermal fatigue due to CTE mismatch between the DDPAK-5 package and PCB. Operate within the -40°C to 125°C junction range, but limit thermal swings to <20°C per cycle by managing load transients. Use lead-free assembly with proper reflow profiling (MSL3, 168-hour floor life) and conformal coating to prevent moisture ingress. Monitor solder joint integrity over time—especially at the high-current tab connection—since thermal cycling can crack joints and increase RDS(on) over time, leading to premature failure.

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