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SP2525A-2EN-L
Electronics Part Number
SP2525A-2EN-L-WXManufacturer
Powerex
SP2525A-2EN-L
Description
N-Channel Power Switch IC, 1:1 Ratio, SOIC-8Inventory
548 Pcs New Original In Stock
N-channel 1:1 driver in 8-SOIC, 500mA; reliable switching for battery-powered devices and minimal heat generation at full load.
Quantity
Minimum 1
Minimum 1
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Freight
Basic cost: USD 70.00
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Shipped from Hong Kong via FedEx/DHL/UPS/TNT
Delivery Time
In-stock items: Ready to ship in 1-2 days
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Technical Specifications
Category
Power Management (PMIC), Full Half-Bridge (H Bridge) Drivers
Manufacturer
Powerex
Packaging
-
Operating Temperature
-20°C ~ 125°C (TJ)
Mounting Type
Surface Mount
Package / Case
16-SOIC (0.209", 5.30mm Width)
Series
-
Features
-
Base Product Number
M81700
Product Status
Discontinued at Digi-Key
Applications
AC Loads, Bulbs, General Purpose
Voltage - Supply
5V ~ 20V
Technology
Power MOSFET
Supplier Device Package
16-SOP
Voltage - Load
500V (Max)
Interface
Logic
Output Configuration
Half Bridge (2)
Current - Output / Channel
2A
Current - Peak Output
2.5A
Fault Protection
-
Rds On (Typ)
2.5Ohm LS, 10Ohm HS
Load Type
Inductive, Capacitive, Resistive
Data Sheet Document (D)
Datasheets
Download M81700FP Product Specification (PDF)
HTML Datasheet
M81700FP-DG
Environmental & Export Classification
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Standard Package
1
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Frequently Asked Questions (FAQ)
What are the key design-in risks when using the M81700FP in high-temperature industrial environments
When designing the M81700FP into high-temperature applications, the primary risk is exceeding the 125°C junction temperature under sustained load due to its relatively high Rds(on) (10Ω HS, 2.5Ω LS), which increases power dissipation. To mitigate, ensure aggressive PCB thermal management—use thick copper layers, thermal vias under the exposed pad, and derate current above 85°C ambient. Monitor TJ during burn-in testing, especially in enclosed fixtures driving AC loads.
How does the M81700FP compare to the IR2110 when driving inductive AC loads in a half-bridge topolog
The M81700FP and IR2110 both support 5V–20V supplies and drive half-bridge MOSFETs, but the M81700FP lacks built-in bootstrap diode and shoot-through protection, unlike the IR2110. This increases design complexity with external components and risk of MOSFET failure during fast switching. For inductive AC loads, the IR2110 offers better protection, but the M81700FP may still be viable if dead-time control and external clamping are rigorously implemented.
Can the M81700FP safely replace the discontinued IRS21844 in a 400V AC resistive heating control cir
The M81700FP is not a direct replacement for the IRS21844 in 400V heating circuits due to missing integrated level-shifting and fault protection. While both support up to 500V load voltage, the IRS21844 includes UVLO and cycle-by-cycle control logic. Using the M81700FP requires adding external logic and careful gate drive timing to prevent shoot-through, increasing system risk in safety-critical heating applications.
What are the reliability concerns when driving capacitive loads like long cable runs with the M81700
Driving capacitive loads with the M81700FP risks high inrush current during switching, potentially exceeding its 2.5A peak output and causing localized heating or latch-up. When driving long cables or bus bars, add gate resistors (e.g., 10–47Ω) to dampen rise/fall times and include TVS diodes on driver outputs. Simulate switching behavior with the actual parasitic capacitance to avoid instability or device degradation over time.
How should I address the discontinuation risk of the M81700FP in a new production design?
Given the M81700FP is discontinued at Digi-Key, relying on it poses long-term supply chain risk despite current stock availability. Secure extended inventory and qualify a second-source alternative early—consider the ON Semiconductor FAN7382 or Infineon 1ED020I12-F2, which offer comparable 2A drive, higher integration, and active support. Redesign effort now avoids costly revisions or end-of-life production halts later.
What are the key design-in risks when using the M81700FP in high-temperature industrial environments
When designing the M81700FP into high-temperature applications, the primary risk is exceeding the 125°C junction temperature under sustained load due to its relatively high Rds(on) (10Ω HS, 2.5Ω LS), which increases power dissipation. To mitigate, ensure aggressive PCB thermal management—use thick copper layers, thermal vias under the exposed pad, and derate current above 85°C ambient. Monitor TJ during burn-in testing, especially in enclosed fixtures driving AC loads.
How does the M81700FP compare to the IR2110 when driving inductive AC loads in a half-bridge topolog
The M81700FP and IR2110 both support 5V–20V supplies and drive half-bridge MOSFETs, but the M81700FP lacks built-in bootstrap diode and shoot-through protection, unlike the IR2110. This increases design complexity with external components and risk of MOSFET failure during fast switching. For inductive AC loads, the IR2110 offers better protection, but the M81700FP may still be viable if dead-time control and external clamping are rigorously implemented.
Can the M81700FP safely replace the discontinued IRS21844 in a 400V AC resistive heating control cir
The M81700FP is not a direct replacement for the IRS21844 in 400V heating circuits due to missing integrated level-shifting and fault protection. While both support up to 500V load voltage, the IRS21844 includes UVLO and cycle-by-cycle control logic. Using the M81700FP requires adding external logic and careful gate drive timing to prevent shoot-through, increasing system risk in safety-critical heating applications.
What are the reliability concerns when driving capacitive loads like long cable runs with the M81700
Driving capacitive loads with the M81700FP risks high inrush current during switching, potentially exceeding its 2.5A peak output and causing localized heating or latch-up. When driving long cables or bus bars, add gate resistors (e.g., 10–47Ω) to dampen rise/fall times and include TVS diodes on driver outputs. Simulate switching behavior with the actual parasitic capacitance to avoid instability or device degradation over time.
How should I address the discontinuation risk of the M81700FP in a new production design?
Given the M81700FP is discontinued at Digi-Key, relying on it poses long-term supply chain risk despite current stock availability. Secure extended inventory and qualify a second-source alternative early—consider the ON Semiconductor FAN7382 or Infineon 1ED020I12-F2, which offer comparable 2A drive, higher integration, and active support. Redesign effort now avoids costly revisions or end-of-life production halts later.
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Sep 15 2026
