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SM2001
Electronics Part Number
SM2001-WXManufacturer
Texas Instruments
SM2001
Description
F-Series Magnetic-Inductive Flow Meter for Accurate Conductive Liquid Flow Rate MeasurementInventory
392 Pcs New Original In Stock
High-reliability transducer sensor; robust mechanical design; consistent signal accuracy; for factory automation and OEM equipment.
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Technical Specifications
Category
Humidity, Moisture Sensors
Manufacturer
Texas Instruments
Packaging
Cut Tape (CT) & Digi-Reel®
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
6-WDFN Exposed Pad
Series
-
Base Product Number
HDC2080
Sensor Type
Humidity, Temperature
Product Status
Obsolete
Output Type
I2C
Voltage - Supply
1.62V ~ 3.6V
Output
14b
Sensitivity
-
Supplier Device Package
6-WSON (3x3)
Response Time
8 s
Accuracy
±2% RH
Humidity Range
0 ~ 100% RH
Data Sheet Document (D)
Datasheets
Download HDC2080DMBT Product Specification (PDF)
HTML Datasheet
HDC2080DMBT-DG
Manufacturer Product Page
HDC2080DMBT Specifications
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
296-49482-1 296-49482-2 HDC2080DMBT-DG 296-49482-6
Standard Package
250
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Frequently Asked Questions (FAQ)
Can the HDC2080DMBT be used in battery-powered IoT devices, and what design considerations should I
Yes, the HDC2080DMBT is well-suited for battery-powered IoT applications due to its wide supply voltage range (1.62V–3.6V) and low active current consumption. To minimize power, use its built-in programmable interrupt and low-power measurement modes. Design your firmware to trigger measurements only when needed and keep the sensor in sleep mode otherwise. Note its 8-second response time—schedule readings with sufficient settling time to avoid stale data. Given its Obsolete status, ensure sufficient long-term stock or consider early redesign to a replacement like the HDC2010 for future production.
Is the HDC2080DMBT pin-compatible with the HDC2010 or other TI humidity sensors for drop-in replacem
The HDC2080DMBT (6-WSON) shares footprint compatibility with the HDC2010, allowing for a pin-to-pin drop-in replacement in most cases. However, verify register map differences through firmware—HDC2010 offers enhanced accuracy (±1.5% RH) and faster response. Also confirm I2C address consistency (both use 0x40 by default) and check supply rail stability, as HDC2010 has tighter decoupling requirements. Given HDC2080DMBT’s Obsolete status, initiate redesign toward HDC2010 or Si7020 for long-term reliability and supply assurance.
What are the risks of using the HDC2080DMBT in a high-humidity industrial environment near condensat
While the HDC2080DMBT supports 0–100% RH operation, sustained exposure to near-condensation conditions (e.g., >90% RH at low temperatures) risks long-term drift or contamination. Avoid condensation by implementing air baffles, hydrophobic membranes, or conformal coating. Ensure the exposed thermal pad is grounded to improve thermal conductivity and reduce dew formation. Monitor calibration drift over time through system-level checks, and consider periodic reconditioning cycles. Due to its Obsolete status, prioritize end-of-life planning and environmental protections in field deployments.
How does the HDC2080DMBT handle I2C bus conflicts in multi-sensor systems, and what pull-up resistor
The HDC2080DMBT uses standard I2C with a dedicated address (typically 0x40), minimizing conflicts in multi-sensor designs. To ensure signal integrity, limit total bus capacitance to ≤400 pF and use 2.2kΩ to 10kΩ pull-up resistors depending on supply voltage and trace length—lower values (e.g., 2.2kΩ) improve rise time but increase power in active systems. For multi-drop layouts, isolate high-noise devices and consider using I2C buffers. Validate timing with oscilloscope measurements, especially with long traces, to avoid read errors due to slow fall times or noise coupling.
What are the thermal design implications of the HDC2080DMBT’s exposed pad, and how should it be sold
The HDC2080DMBT’s exposed pad (6-WSON) must be soldered to a grounded copper thermal pad on the PCB to ensure mechanical stability, optimal thermal conduction, and accurate temperature readings. Use a thermal via array under the pad to connect to internal ground planes, improving heat dissipation and minimizing thermal lag. Avoid placing power traces or heat-generating components nearby to prevent thermal coupling errors. Confirm MSL1 rating allows for reflow without prebaking, but follow IPC/JEDEC J-STD-020 guidelines to prevent popcorning in high-moisture environments during assembly.
Can the HDC2080DMBT be used in battery-powered IoT devices, and what design considerations should I
Yes, the HDC2080DMBT is well-suited for battery-powered IoT applications due to its wide supply voltage range (1.62V–3.6V) and low active current consumption. To minimize power, use its built-in programmable interrupt and low-power measurement modes. Design your firmware to trigger measurements only when needed and keep the sensor in sleep mode otherwise. Note its 8-second response time—schedule readings with sufficient settling time to avoid stale data. Given its Obsolete status, ensure sufficient long-term stock or consider early redesign to a replacement like the HDC2010 for future production.
Is the HDC2080DMBT pin-compatible with the HDC2010 or other TI humidity sensors for drop-in replacem
The HDC2080DMBT (6-WSON) shares footprint compatibility with the HDC2010, allowing for a pin-to-pin drop-in replacement in most cases. However, verify register map differences through firmware—HDC2010 offers enhanced accuracy (±1.5% RH) and faster response. Also confirm I2C address consistency (both use 0x40 by default) and check supply rail stability, as HDC2010 has tighter decoupling requirements. Given HDC2080DMBT’s Obsolete status, initiate redesign toward HDC2010 or Si7020 for long-term reliability and supply assurance.
What are the risks of using the HDC2080DMBT in a high-humidity industrial environment near condensat
While the HDC2080DMBT supports 0–100% RH operation, sustained exposure to near-condensation conditions (e.g., >90% RH at low temperatures) risks long-term drift or contamination. Avoid condensation by implementing air baffles, hydrophobic membranes, or conformal coating. Ensure the exposed thermal pad is grounded to improve thermal conductivity and reduce dew formation. Monitor calibration drift over time through system-level checks, and consider periodic reconditioning cycles. Due to its Obsolete status, prioritize end-of-life planning and environmental protections in field deployments.
How does the HDC2080DMBT handle I2C bus conflicts in multi-sensor systems, and what pull-up resistor
The HDC2080DMBT uses standard I2C with a dedicated address (typically 0x40), minimizing conflicts in multi-sensor designs. To ensure signal integrity, limit total bus capacitance to ≤400 pF and use 2.2kΩ to 10kΩ pull-up resistors depending on supply voltage and trace length—lower values (e.g., 2.2kΩ) improve rise time but increase power in active systems. For multi-drop layouts, isolate high-noise devices and consider using I2C buffers. Validate timing with oscilloscope measurements, especially with long traces, to avoid read errors due to slow fall times or noise coupling.
What are the thermal design implications of the HDC2080DMBT’s exposed pad, and how should it be sold
The HDC2080DMBT’s exposed pad (6-WSON) must be soldered to a grounded copper thermal pad on the PCB to ensure mechanical stability, optimal thermal conduction, and accurate temperature readings. Use a thermal via array under the pad to connect to internal ground planes, improving heat dissipation and minimizing thermal lag. Avoid placing power traces or heat-generating components nearby to prevent thermal coupling errors. Confirm MSL1 rating allows for reflow without prebaking, but follow IPC/JEDEC J-STD-020 guidelines to prevent popcorning in high-moisture environments during assembly.
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Sep 15 2026
