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SI823H4BB-IS1

Electronics Part Number

SI823H4BB-IS1-WX

Manufacturer

SI823H4BB-IS1

Description

16-SOIC Digital Isolator, 2.5kV, 2-Channel Gate Driver

Inventory

539 Pcs New Original In Stock
6A gate driver with capacitive coupling, 2500Vrms isolation, 2-channel output in 16-SOIC for high-side and low-side switching.
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Basic cost: USD 70.00

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Technical Specifications

Category Color Sensors

Manufacturer

Packaging -

Operating Temperature -40°C ~ 85°C

Package / Case 6-BGA

Series -

Features Gain Control, Interrupt, Sync Input

Product Status Obsolete

Voltage - Supply 2.7 V ~ 3.6 V

Output I2C

Current - Supply (Max) 11mA @ 3.6V

Resolution (Bits) 16 b

Data Sheet Document (D)

Datasheets Download TCS3414CS Product Specification (PDF)

HTML Datasheet TCS3414CS-DG

Design Resources Development Tool Selector

Environmental & Export Classification

Moisture Sensitivity Level (MSL) 2 (1 Year)

REACH Status REACH Unaffected

ECCN EAR99

HTSUS 8542.39.0001

Additional Information

Other Names TCS3414-CSTR 300120002 TCS3414-CS TCS3414-CSCT TCS3414-CSDKR

Standard Package 3,500

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Frequently Asked Questions (FAQ)

FAQ Icon

What are the key design risks when replacing the TCS3414CS with a modern color sensor like the AMS A

Replacing the TCS3414CS with the AS7341 introduces several design risks despite functional overlap. The AS7341 operates at a lower supply voltage (1.8 V typical vs. 2.7–3.6 V for the TCS3414CS), requiring level-shifting on I2C lines if interfaced with existing 3.3 V logic. Additionally, the AS7341 uses a different spectral channel configuration (11 channels vs. 6), which may invalidate existing calibration curves. The TCS3414CS’s sync input for external timing control is absent in the AS7341, potentially disrupting synchronized multi-sensor arrays. Always validate timing compatibility and re-derive color transformation matrices before deployment.
FAQ Icon

Can the TCS3414CS be safely used in outdoor automotive applications near engine compartments, given

While the TCS3414CS is rated for -40°C to 85°C, this does not guarantee reliability in harsh automotive environments. Under-hood temperatures can exceed 105°C during peak loads, pushing the sensor beyond its absolute maximum ratings and accelerating dark current drift. Furthermore, the 6-BGA package lacks conformal coating and is susceptible to thermal cycling fatigue and moisture ingress (MSL 2). For automotive use, consider hermetically sealed or AEC-Q100 qualified alternatives like the Hamamatsu S11059-09NT. If the TCS3414CS must be used, implement active thermal management and environmental sealing to mitigate failure risk.
FAQ Icon

How does the TCS3414CS’s 6-channel spectral response compare to the widely used TAOS TCS34725, and w

The TCS3414CS uses six discrete photodiodes with custom spectral filters optimized for specific color spaces, whereas the TCS34725 employs four channels (clear, red, green, blue) with a standard RGB response. This difference means direct substitution will yield inconsistent colorimetric results, especially under non-standard illuminants like LEDs or fluorescents. The TCS3414CS also lacks an integrated IR-blocking filter, increasing susceptibility to ambient IR noise—unlike the TCS34725. When migrating, recalibrate the entire color pipeline and verify signal-to-noise performance under target lighting conditions to avoid inaccurate hue detection.
FAQ Icon

Is it safe to operate the TCS3414CS continuously at 3.6 V and 85°C, and what long-term reliability c

Operating the TCS3414CS at both maximum voltage (3.6 V) and temperature (85°C) simultaneously significantly accelerates aging mechanisms. At this stress point, dark current increases exponentially, degrading signal integrity and requiring frequent recalibration. The 6-BGA package’s solder joints are also prone to thermomechanical fatigue under sustained high temperature, risking intermittent connections. To ensure longevity, derate the supply voltage to ≤3.3 V and maintain junction temperature below 75°C via PCB thermal vias or airflow. Monitor baseline drift over time and implement software-based offset compensation to maintain accuracy.
FAQ Icon

What precautions are necessary when designing a PCB for the TCS3414CS given its 6-BGA package and MS

The TCS3414CS’s 6-BGA package demands careful PCB design to prevent moisture-related failures and soldering defects. Due to MSL 2 (1-year floor life), store unmounted devices in dry cabinets (<10% RH) and limit exposure to ambient air to under 168 hours. Use a reflow profile compliant with J-STD-020, ensuring peak temperature stays within 245–250°C to avoid package delamination. Include a grounded thermal pad beneath the BGA with multiple vias to manage heat and reduce warpage. Avoid placing high-speed digital traces near analog sensor outputs to prevent crosstalk, and use guard rings around sensitive nodes to minimize leakage currents that could corrupt 16-bit readings.
FAQ Icon

What are the key design risks when replacing the TCS3414CS with a modern color sensor like the AMS A

Replacing the TCS3414CS with the AS7341 introduces several design risks despite functional overlap. The AS7341 operates at a lower supply voltage (1.8 V typical vs. 2.7–3.6 V for the TCS3414CS), requiring level-shifting on I2C lines if interfaced with existing 3.3 V logic. Additionally, the AS7341 uses a different spectral channel configuration (11 channels vs. 6), which may invalidate existing calibration curves. The TCS3414CS’s sync input for external timing control is absent in the AS7341, potentially disrupting synchronized multi-sensor arrays. Always validate timing compatibility and re-derive color transformation matrices before deployment.
FAQ Icon

Can the TCS3414CS be safely used in outdoor automotive applications near engine compartments, given

While the TCS3414CS is rated for -40°C to 85°C, this does not guarantee reliability in harsh automotive environments. Under-hood temperatures can exceed 105°C during peak loads, pushing the sensor beyond its absolute maximum ratings and accelerating dark current drift. Furthermore, the 6-BGA package lacks conformal coating and is susceptible to thermal cycling fatigue and moisture ingress (MSL 2). For automotive use, consider hermetically sealed or AEC-Q100 qualified alternatives like the Hamamatsu S11059-09NT. If the TCS3414CS must be used, implement active thermal management and environmental sealing to mitigate failure risk.
FAQ Icon

How does the TCS3414CS’s 6-channel spectral response compare to the widely used TAOS TCS34725, and w

The TCS3414CS uses six discrete photodiodes with custom spectral filters optimized for specific color spaces, whereas the TCS34725 employs four channels (clear, red, green, blue) with a standard RGB response. This difference means direct substitution will yield inconsistent colorimetric results, especially under non-standard illuminants like LEDs or fluorescents. The TCS3414CS also lacks an integrated IR-blocking filter, increasing susceptibility to ambient IR noise—unlike the TCS34725. When migrating, recalibrate the entire color pipeline and verify signal-to-noise performance under target lighting conditions to avoid inaccurate hue detection.
FAQ Icon

Is it safe to operate the TCS3414CS continuously at 3.6 V and 85°C, and what long-term reliability c

Operating the TCS3414CS at both maximum voltage (3.6 V) and temperature (85°C) simultaneously significantly accelerates aging mechanisms. At this stress point, dark current increases exponentially, degrading signal integrity and requiring frequent recalibration. The 6-BGA package’s solder joints are also prone to thermomechanical fatigue under sustained high temperature, risking intermittent connections. To ensure longevity, derate the supply voltage to ≤3.3 V and maintain junction temperature below 75°C via PCB thermal vias or airflow. Monitor baseline drift over time and implement software-based offset compensation to maintain accuracy.
FAQ Icon

What precautions are necessary when designing a PCB for the TCS3414CS given its 6-BGA package and MS

The TCS3414CS’s 6-BGA package demands careful PCB design to prevent moisture-related failures and soldering defects. Due to MSL 2 (1-year floor life), store unmounted devices in dry cabinets (<10% RH) and limit exposure to ambient air to under 168 hours. Use a reflow profile compliant with J-STD-020, ensuring peak temperature stays within 245–250°C to avoid package delamination. Include a grounded thermal pad beneath the BGA with multiple vias to manage heat and reduce warpage. Avoid placing high-speed digital traces near analog sensor outputs to prevent crosstalk, and use guard rings around sensitive nodes to minimize leakage currents that could corrupt 16-bit readings.

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