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SI4755-A10-AMR
Electronics Part Number
SI4755-A10-AMR-WXManufacturer
Skyworks Solutions
SI4755-A10-AMR
Description
AM/FM RF Receiver with 520 kHz-1.71 MHz Range, 32-QFN for Radio ApplicationsInventory
809 Pcs New Original In Stock
Surface-mount AM/FM receiver, frequency range 520k-1.71M and 64-108M, 32-QFN 5x5, PCB.
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Technical Specifications
Category
RF Front End (LNA + PA)
Manufacturer
Skyworks Solutions
Packaging
Tape & Reel (TR)
Package / Case
24-VFQFN Exposed Pad
Series
SiGe
Features
-
Base Product Number
SE5502
Product Status
Active
Frequency
2.4GHz ~ 2.5GHz, 4.9GHz ~ 5.875GHz
Supplier Device Package
24-QFN (4x4)
RF Type
802.11a/b/g/n
Data Sheet Document (D)
Datasheets
Download SE5502L-R Product Specification (PDF)
HTML Datasheet
SE5502L-R-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN
5A991G
HTSUS
8542.39.0001
Additional Information
Other Names
863-1381-2 863-1381-6 1287-SE5502L-R 863-1381-1
Standard Package
3,000
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Frequently Asked Questions (FAQ)
What are the key design constraints when integrating the SE5502L-R into a compact 2.4/5 GHz Wi-Fi mo
The SE5502L-R, with its dual-band 802.11a/b/g/n support in a 4x4 mm 24-QFN package, demands strict RF layout discipline to avoid insertion loss and harmonic distortion. Critical constraints include maintaining a continuous ground plane beneath the exposed pad, minimizing trace lengths to antennas, and using 50-ohm controlled impedance for RF paths. Poor grounding or proximity to digital lines can cause desense or spurious emissions. To mitigate risk, follow Skyworks’ reference design, isolate the RF section with ground stitching vias, and avoid routing high-speed digital signals near the RF input/output pins.
Can the SE5502L-R be used as a drop-in replacement for the Qorvo RF5602 in existing 802.11n designs,
While the SE5502L-R and Qorvo RF5602 both support dual-band 802.11n operation, they are not direct drop-in replacements due to differences in pinout, bias requirements, and matching networks. The SE5502L-R uses a different control interface and has a lower quiescent current, which may affect power sequencing. You’ll likely need to redesign the input/output matching circuits and update the PCB footprint to accommodate the 24-QFN (4x4) package. Always validate with network analyzer tuning and EVM testing to ensure compliance with IEEE 802.11n spectral masks.
What are the reliability risks of operating the SE5502L-R near its upper frequency limit (5.875 GHz)
Operating the SE5502L-R at 5.875 GHz under elevated temperatures (e.g., >85°C ambient) increases the risk of gain compression and long-term parametric drift due to SiGe junction heating. The exposed pad helps dissipate heat, but insufficient copper area or poor via stitching can lead to localized hot spots. To enhance reliability, connect the exposed pad to a large thermal ground plane with multiple vias and ensure adequate airflow. Monitor junction temperature using thermal modeling; sustained operation above 105°C Tj may accelerate electromigration and reduce MTBF.
How does the SE5502L-R compare to the Broadcom BCM43362 in terms of integration level and BOM cost f
The SE5502L-R is an RF front-end module (FEM) that requires an external SoC/baseband processor, whereas the Broadcom BCM43362 integrates Wi-Fi MAC, baseband, and RF in a single chip. For cost-sensitive IoT designs, the BCM43362 reduces BOM by eliminating the need for a separate FEM and microcontroller, but offers less RF front-end flexibility. The SE5502L-R provides higher linearity and better coexistence performance in dense RF environments, making it preferable when paired with a high-performance AP SoC. Choose the SE5502L-R when RF performance outweighs integration benefits.
What are the common failure modes of the SE5502L-R during ESD events, and what protection circuitry
The SE5502L-R, despite being MSL 1 and ROHS3 compliant, is susceptible to ESD damage at its RF input pins during handling or antenna exposure, especially in dry environments. Common failure modes include degraded noise figure or complete RF path failure after repeated ±8 kV contact discharges. To protect the SE5502L-R, place a low-capacitance TVS diode (e.g., Littelfuse SP3022) as close as possible to the antenna connector, and ensure the ground return path has minimal inductance. Additionally, implement proper chassis grounding and avoid floating antenna traces on the PCB to reduce ESD coupling risk.
What are the key design constraints when integrating the SE5502L-R into a compact 2.4/5 GHz Wi-Fi mo
The SE5502L-R, with its dual-band 802.11a/b/g/n support in a 4x4 mm 24-QFN package, demands strict RF layout discipline to avoid insertion loss and harmonic distortion. Critical constraints include maintaining a continuous ground plane beneath the exposed pad, minimizing trace lengths to antennas, and using 50-ohm controlled impedance for RF paths. Poor grounding or proximity to digital lines can cause desense or spurious emissions. To mitigate risk, follow Skyworks’ reference design, isolate the RF section with ground stitching vias, and avoid routing high-speed digital signals near the RF input/output pins.
Can the SE5502L-R be used as a drop-in replacement for the Qorvo RF5602 in existing 802.11n designs,
While the SE5502L-R and Qorvo RF5602 both support dual-band 802.11n operation, they are not direct drop-in replacements due to differences in pinout, bias requirements, and matching networks. The SE5502L-R uses a different control interface and has a lower quiescent current, which may affect power sequencing. You’ll likely need to redesign the input/output matching circuits and update the PCB footprint to accommodate the 24-QFN (4x4) package. Always validate with network analyzer tuning and EVM testing to ensure compliance with IEEE 802.11n spectral masks.
What are the reliability risks of operating the SE5502L-R near its upper frequency limit (5.875 GHz)
Operating the SE5502L-R at 5.875 GHz under elevated temperatures (e.g., >85°C ambient) increases the risk of gain compression and long-term parametric drift due to SiGe junction heating. The exposed pad helps dissipate heat, but insufficient copper area or poor via stitching can lead to localized hot spots. To enhance reliability, connect the exposed pad to a large thermal ground plane with multiple vias and ensure adequate airflow. Monitor junction temperature using thermal modeling; sustained operation above 105°C Tj may accelerate electromigration and reduce MTBF.
How does the SE5502L-R compare to the Broadcom BCM43362 in terms of integration level and BOM cost f
The SE5502L-R is an RF front-end module (FEM) that requires an external SoC/baseband processor, whereas the Broadcom BCM43362 integrates Wi-Fi MAC, baseband, and RF in a single chip. For cost-sensitive IoT designs, the BCM43362 reduces BOM by eliminating the need for a separate FEM and microcontroller, but offers less RF front-end flexibility. The SE5502L-R provides higher linearity and better coexistence performance in dense RF environments, making it preferable when paired with a high-performance AP SoC. Choose the SE5502L-R when RF performance outweighs integration benefits.
What are the common failure modes of the SE5502L-R during ESD events, and what protection circuitry
The SE5502L-R, despite being MSL 1 and ROHS3 compliant, is susceptible to ESD damage at its RF input pins during handling or antenna exposure, especially in dry environments. Common failure modes include degraded noise figure or complete RF path failure after repeated ±8 kV contact discharges. To protect the SE5502L-R, place a low-capacitance TVS diode (e.g., Littelfuse SP3022) as close as possible to the antenna connector, and ensure the ground return path has minimal inductance. Additionally, implement proper chassis grounding and avoid floating antenna traces on the PCB to reduce ESD coupling risk.
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Sep 15 2026
