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S-8337ACIA-P8T1G
Electronics Part Number
S-8337ACIA-P8T1G-WXManufacturer
Microchip Technology
S-8337ACIA-P8T1G
Description
8-Pin SON Boost Regulator ControllerInventory
744 Pcs New Original In Stock
8-SON boost controller (2.9x2.8); high-frequency operation, low profile, and robust protection for space-constrained power modules.
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Freight
Basic cost: USD 70.00
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Technical Specifications
Category
Specialized ICs
Manufacturer
Microchip Technology
Packaging
-
Mounting Type
Surface Mount
Package / Case
208-BFQFP
Series
-
Base Product Number
KS8695
Product Status
Discontinued at Digi-Key
Type
10/100 Integrated Switch
Applications
Networking and Communications
Supplier Device Package
208-PQFP (28x28)
DiGi-Electronics Programmable
Not Verified
Data Sheet Document (D)
Datasheets
Download KS8695X Product Specification (PDF)
HTML Datasheet
KS8695X-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
3A001A3
HTSUS
8542.39.0001
Additional Information
Standard Package
24
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Frequently Asked Questions (FAQ)
Can the KS8695X be safely used in new network switch designs despite being discontinued at Digi-Key,
While the KS8695X is still available in limited original stock (3,887 units), its discontinued status at Digi-Key signals an end-of-life trajectory. Using it in new designs carries significant supply chain risk beyond initial production runs. For long-term reliability, consider engineering a drop-in replacement or second-sourcing strategy. Evaluate inventory providers with extended availability, but prioritize redesign for sustained manufacturing. Consider alternatives like the Marvell 88E6321 for similar 10/100 switching functionality with active supply support.
What are the critical thermal design considerations when integrating the KS8695X in a 208-PQFP (28x2
The KS8695X’s 208-PQFP package has a large thermal pad requiring proper PCB land pattern and thermal vias to dissipate heat under sustained traffic loads. Ensure at least 4x4 array of thermal vias under the exposed pad connected to internal ground planes. Avoid placing temperature-sensitive components nearby. Monitor junction temperature in enclosed environments, as inadequate copper pour can lead to thermal throttling or reliability degradation. Use a thermal relief design during reflow to prevent tombstoning.
How does the KS8695X compare to the Broadcom BCM5325E for 10/100 embedded switching in terms of firm
The KS8695X offers direct register-level control via its integrated processor interface, enabling fine-grained traffic management without external CPU dependency—advantageous for custom firmware. In contrast, the BCM5325E relies more on integrated logic with limited register access. However, the BCM5325E benefits from active support and reference designs. Designers choosing KS8695X must account for discontinued status and lack of updated SDKs, making the BCM5325E preferable for new designs requiring long-term maintainability.
What are the reliability implications of MSL 3 (168 hours) for the KS8695X during manufacturing, and
With MSL 3 rating, the KS8695X must be used within 168 hours after moisture barrier bag opening unless stored in a dry cabinet (<10% RH). Exceeding this exposure risks ‘popcorning’ during reflow due to internal moisture vaporization. For low-volume production, split reels or vacuum-seal unused portions with desiccant. Bake at 125°C for 24 hours if exposed beyond limit. This is critical for yield assurance, especially in high-humidity assembly environments.
Is the KS8695X suitable for industrial networking applications requiring extended temperature operat
The KS8695X is specified for commercial temperature ranges (0°C to 70°C), limiting its use in industrial environments (typically -40°C to 85°C). While it may function beyond spec in mild conditions, long-term reliability diminishes due to clock drift, signal integrity loss, and thermal stress. If deploying in harsh environments, implement active cooling, conformal coating, and rigorous burn-in testing. Prefer industrial-grade switches like the Microchip LAN9355 for extended temperature and deterministic performance.
Can the KS8695X be safely used in new network switch designs despite being discontinued at Digi-Key,
While the KS8695X is still available in limited original stock (3,887 units), its discontinued status at Digi-Key signals an end-of-life trajectory. Using it in new designs carries significant supply chain risk beyond initial production runs. For long-term reliability, consider engineering a drop-in replacement or second-sourcing strategy. Evaluate inventory providers with extended availability, but prioritize redesign for sustained manufacturing. Consider alternatives like the Marvell 88E6321 for similar 10/100 switching functionality with active supply support.
What are the critical thermal design considerations when integrating the KS8695X in a 208-PQFP (28x2
The KS8695X’s 208-PQFP package has a large thermal pad requiring proper PCB land pattern and thermal vias to dissipate heat under sustained traffic loads. Ensure at least 4x4 array of thermal vias under the exposed pad connected to internal ground planes. Avoid placing temperature-sensitive components nearby. Monitor junction temperature in enclosed environments, as inadequate copper pour can lead to thermal throttling or reliability degradation. Use a thermal relief design during reflow to prevent tombstoning.
How does the KS8695X compare to the Broadcom BCM5325E for 10/100 embedded switching in terms of firm
The KS8695X offers direct register-level control via its integrated processor interface, enabling fine-grained traffic management without external CPU dependency—advantageous for custom firmware. In contrast, the BCM5325E relies more on integrated logic with limited register access. However, the BCM5325E benefits from active support and reference designs. Designers choosing KS8695X must account for discontinued status and lack of updated SDKs, making the BCM5325E preferable for new designs requiring long-term maintainability.
What are the reliability implications of MSL 3 (168 hours) for the KS8695X during manufacturing, and
With MSL 3 rating, the KS8695X must be used within 168 hours after moisture barrier bag opening unless stored in a dry cabinet (<10% RH). Exceeding this exposure risks ‘popcorning’ during reflow due to internal moisture vaporization. For low-volume production, split reels or vacuum-seal unused portions with desiccant. Bake at 125°C for 24 hours if exposed beyond limit. This is critical for yield assurance, especially in high-humidity assembly environments.
Is the KS8695X suitable for industrial networking applications requiring extended temperature operat
The KS8695X is specified for commercial temperature ranges (0°C to 70°C), limiting its use in industrial environments (typically -40°C to 85°C). While it may function beyond spec in mild conditions, long-term reliability diminishes due to clock drift, signal integrity loss, and thermal stress. If deploying in harsh environments, implement active cooling, conformal coating, and rigorous burn-in testing. Prefer industrial-grade switches like the Microchip LAN9355 for extended temperature and deterministic performance.
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Sep 15 2026
