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NCP1380BDR2G
Electronics Part Number
NCP1380BDR2G-WXManufacturer
NXP Semiconductors
NCP1380BDR2G
Description
8-SOIC offline flyback switch deviceInventory
707 Pcs New Original In Stock
Offline flyback switching regulator, 8-SOIC. High-voltage start-up, low EMI. For consumer and industrial power conversion.
Quantity
Minimum 1
Minimum 1
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Freight
Basic cost: USD 70.00
Actual cost may vary depending on weight and destination
Shipping method
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Delivery Time
In-stock items: Ready to ship in 1-2 days
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Technical Specifications
Category
Power Management (PMIC), Motor Drivers, Controllers
Manufacturer
NXP Semiconductors
Packaging
-
Operating Temperature
-40°C ~ 150°C (TJ)
Mounting Type
Surface Mount
Package / Case
54-SSOP (0.295", 7.50mm Width) Exposed Pad
Series
-
Base Product Number
MCZ33887
Product Status
Obsolete
Applications
General Purpose
Voltage - Supply
5V ~ 28V
Function
Driver - Fully Integrated, Control and Power Stage
Technology
Power MOSFET
Supplier Device Package
54-SOIC-EP
Voltage - Load
5V ~ 28V
Current - Output
5A
Interface
Parallel
Output Configuration
Half Bridge (2)
Motor Type - Stepper
-
Motor Type - AC, DC
Brushed DC
Step Resolution
-
Data Sheet Document (D)
Datasheets
Download MCZ33887EKR2 Product Specification (PDF)
HTML Datasheet
MCZ33887EKR2-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.31.0001
Additional Information
Other Names
MCZ33887EKR2CT MCZ33887EKR2-DG MCZ33887EKR2TR MCZ33887EKR2DKR
Standard Package
1,000
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Frequently Asked Questions (FAQ)
Is the MCZ33887EKR2 still a viable choice for new brushed DC motor designs given its obsolete status
No, the MCZ33887EKR2 is not recommended for new designs due to its obsolete status from NXP. While it remains functional and RoHS3 compliant, ongoing supply chain uncertainty and lack of future support increase long-term risk. If you're already in prototyping, consider qualifying one of its listed substitutes—such as the DRV8832DRCR or DRV8828PWP—early to avoid last-time buy scenarios and ensure lifecycle continuity. Always verify pin compatibility, thermal performance, and control interface requirements before committing to a drop-in replacement.
Can the MCZ33887EKR2 safely drive a 12V brushed DC motor drawing peak currents near 5A in an industr
Yes, the MCZ33887EKR2 can drive a 12V brushed DC motor at up to 5A peak current, but thermal derating above 85°C ambient is essential due to its exposed pad 54-SOIC-EP package. With junction-to-ambient thermal resistance (RθJA) typically around 35–40°C/W without adequate copper area, sustained 5A operation may require a large thermal pad, forced airflow, or a heatsink. Monitor junction temperature using the thermal shutdown feature and ensure PCB layout maximizes copper pour under the exposed pad to avoid premature thermal shutdown or reduced MTBF.
What are the main differences between the MCZ33887EKR2 and the DRV8832DRCR when replacing it in a ha
The MCZ33887EKR2 uses a parallel logic interface with direct IN1/IN2 inputs and built-in dead-time control, while the DRV8832DRCR employs a simpler IN/IN logic scheme with no integrated dead-time, requiring external microcontroller management to prevent shoot-through. Additionally, the DRV8832 offers nFAULT output for overcurrent, overtemperature, and undervoltage lockout (UVLO) diagnostics—features not explicitly signaled on the MCZ33887EKR2. When substituting, ensure your MCU can handle fault monitoring and adjust dead-time timing in software to maintain safe half-bridge operation.
How does the MCZ33887EKR2’s Power MOSFET technology impact efficiency and switching losses compared
The MCZ33887EKR2’s integrated Power MOSFETs are optimized for moderate switching frequencies and provide good conduction efficiency at 5A, but they lack the ultra-low RDS(on) and advanced gate drive of newer devices like the SIP2100DY-T1-GE3. In low-duty-cycle or PWM-controlled applications (e.g., <10 kHz), the MCZ33887EKR2 may exhibit higher conduction losses and slower turn-off times, increasing heat generation. For battery-powered or thermally constrained systems, the SIP2100DY-T1-GE3 offers better overall efficiency, though it may require additional external components for full functionality—evaluate total system BOM and thermal envelope before switching.
What reliability concerns should I consider when using the MCZ33887EKR2 in automotive or harsh indus
The MCZ33887EKR2 has an MSL 3 rating (168 hours floor life), meaning it must be baked or used within strict time limits after exposure to ambient humidity to avoid popcorning during reflow. In high-vibration or thermal-cycling environments (e.g., under-hood automotive applications), the 54-SOIC-EP package’s exposed pad demands excellent solder wetting and sufficient anchor vias to prevent pad lifting or crack propagation. Implement conformal coating if used in humid or corrosive settings, and perform thermal cycle testing early in validation to catch solder joint fatigue. Given its obsolete status, also secure inventory with traceable lot codes to mitigate counterfeit risks in long-life applications.
Is the MCZ33887EKR2 still a viable choice for new brushed DC motor designs given its obsolete status
No, the MCZ33887EKR2 is not recommended for new designs due to its obsolete status from NXP. While it remains functional and RoHS3 compliant, ongoing supply chain uncertainty and lack of future support increase long-term risk. If you're already in prototyping, consider qualifying one of its listed substitutes—such as the DRV8832DRCR or DRV8828PWP—early to avoid last-time buy scenarios and ensure lifecycle continuity. Always verify pin compatibility, thermal performance, and control interface requirements before committing to a drop-in replacement.
Can the MCZ33887EKR2 safely drive a 12V brushed DC motor drawing peak currents near 5A in an industr
Yes, the MCZ33887EKR2 can drive a 12V brushed DC motor at up to 5A peak current, but thermal derating above 85°C ambient is essential due to its exposed pad 54-SOIC-EP package. With junction-to-ambient thermal resistance (RθJA) typically around 35–40°C/W without adequate copper area, sustained 5A operation may require a large thermal pad, forced airflow, or a heatsink. Monitor junction temperature using the thermal shutdown feature and ensure PCB layout maximizes copper pour under the exposed pad to avoid premature thermal shutdown or reduced MTBF.
What are the main differences between the MCZ33887EKR2 and the DRV8832DRCR when replacing it in a ha
The MCZ33887EKR2 uses a parallel logic interface with direct IN1/IN2 inputs and built-in dead-time control, while the DRV8832DRCR employs a simpler IN/IN logic scheme with no integrated dead-time, requiring external microcontroller management to prevent shoot-through. Additionally, the DRV8832 offers nFAULT output for overcurrent, overtemperature, and undervoltage lockout (UVLO) diagnostics—features not explicitly signaled on the MCZ33887EKR2. When substituting, ensure your MCU can handle fault monitoring and adjust dead-time timing in software to maintain safe half-bridge operation.
How does the MCZ33887EKR2’s Power MOSFET technology impact efficiency and switching losses compared
The MCZ33887EKR2’s integrated Power MOSFETs are optimized for moderate switching frequencies and provide good conduction efficiency at 5A, but they lack the ultra-low RDS(on) and advanced gate drive of newer devices like the SIP2100DY-T1-GE3. In low-duty-cycle or PWM-controlled applications (e.g., <10 kHz), the MCZ33887EKR2 may exhibit higher conduction losses and slower turn-off times, increasing heat generation. For battery-powered or thermally constrained systems, the SIP2100DY-T1-GE3 offers better overall efficiency, though it may require additional external components for full functionality—evaluate total system BOM and thermal envelope before switching.
What reliability concerns should I consider when using the MCZ33887EKR2 in automotive or harsh indus
The MCZ33887EKR2 has an MSL 3 rating (168 hours floor life), meaning it must be baked or used within strict time limits after exposure to ambient humidity to avoid popcorning during reflow. In high-vibration or thermal-cycling environments (e.g., under-hood automotive applications), the 54-SOIC-EP package’s exposed pad demands excellent solder wetting and sufficient anchor vias to prevent pad lifting or crack propagation. Implement conformal coating if used in humid or corrosive settings, and perform thermal cycle testing early in validation to catch solder joint fatigue. Given its obsolete status, also secure inventory with traceable lot codes to mitigate counterfeit risks in long-life applications.
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Sep 15 2026
