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NB3N108KMNG
Electronics Part Number
NB3N108KMNG-WXManufacturer
NXP Semiconductors
NB3N108KMNG
Description
1:8 clock buffer for 400MHz in 32-pin QFN.Inventory
569 Pcs New Original In Stock
"Pkg: 8-TSSOP; Elec: 1:4 clock fanout; Func: 140MHz signaling; App: industrial controllers.",
Quantity
Minimum 1
Minimum 1
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Basic cost: USD 70.00
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Technical Specifications
Category
Embedded, Microprocessors
Manufacturer
NXP Semiconductors
Packaging
-
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
620-BBGA Exposed Pad
Series
MPC83xx
Base Product Number
MPC83
Product Status
Obsolete
Supplier Device Package
620-HBGA (29x29)
Core Processor
PowerPC e300
Speed
266MHz
Number of Cores/Bus Width
1 Core, 32-Bit
Co-Processors/DSP
-
RAM Controllers
DDR, DDR2
Graphics Acceleration
No
Display & Interface Controllers
-
Ethernet
10/100/1000Mbps (3)
SATA
-
USB
USB 2.0 + PHY (2)
Voltage - I/O
1.8V, 2.5V, 3.3V
Security Features
-
Additional Interfaces
DUART, I2C, PCI, SPI
Data Sheet Document (D)
Datasheets
Download MPC8343CZQADDB Product Specification (PDF)
HTML Datasheet
MPC8343CZQADDB-DG
Environmental & Export Classification
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
3A991A2
HTSUS
8542.31.0001
Additional Information
Other Names
2156-MPC8343CZQADDB-NX 935319165557 NXPNXPMPC8343CZQADDB
Standard Package
36
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Frequently Asked Questions (FAQ)
What are the key design-in risks when using the MPC8343CZQADDB in a new embedded design given its ob
Using the MPC8343CZQADDB in a new design carries significant supply chain and lifecycle risks due to its 'Obsolete' status. While 1314 units are currently in stock, long-term availability is not guaranteed, increasing the risk of production interruptions. Engineers should perform a thorough risk assessment and consider implementing a last-time buy strategy, designing in drop-in replacements like the MPC8343CVRADDB if available, or planning for a future redesign using active-pin-compatible alternatives. Consider obsolescence monitoring and secure extended sourcing to mitigate these risks in high-reliability or long-lifecycle applications.
How does the MPC8343CZQADDB compare to the MPC8343CVRADDB in terms of reliability and integration fo
The MPC8343CZQADDB and MPC8343CVRADDB are functionally similar PowerPC e300-based microprocessors with identical 266MHz speed, DDR/DDR2 memory support, triple Gigabit Ethernet, and USB 2.0 + PHY interfaces. However, the MPC8343CZQADDB specifies operation up to 105°C, making it more suitable for high-temperature industrial environments compared to some variants. Users replacing the MPC8343CVRADDB with the MPC8343CZQADDB should verify voltage rail stability and PCB thermal management due to the larger HBGA package and potential differences in power dissipation. Always validate thermal performance under full load conditions.
What are the critical PCB layout considerations for signal integrity when integrating the MPC8343CZQ
When laying out the MPC8343CZQADDB, maintain strict impedance control (typically 50Ω single-ended, 100Ω differential) and length matching for DDR/DDR2 data, address, and control traces to prevent clock skew and signal degradation. Use ground planes beneath high-speed traces, minimize vias, and provide adequate spacing from noisy signals such as PCI bus lines. The 620-HBGA package requires careful fanout planning—employ staggered microvias if needed. Terminate PCI signals with 47–100Ω pull-ups as recommended, and isolate analog and digital grounds with single-point connection near the exposed thermal pad to reduce noise coupling.
Can the MPC8343CZQADDB safely interface with 3.3V and 1.8V logic families in mixed-voltage systems,
Yes, the MPC8343CZQADDB supports multiple I/O voltages (1.8V, 2.5V, 3.3V), allowing direct interface with mixed-voltage peripherals when assigned to appropriate banks. Assign 3.3V-tolerant pins to legacy interfaces like DUART or SPI connected to 3.3V sensors, while using 1.8V banks for high-speed USB or internal logic. Ensure I/O banks are powered in the correct sequence and avoid floating inputs. For signals crossing unpowered sections, use bidirectional FET-based level shifters rather than resistive dividers to maintain signal integrity and prevent backfeeding.
What are the long-term reliability concerns with the MPC8343CZQADDB given its RoHS non-compliant sta
The MPC8343CZQADDB's RoHS non-compliance indicates leaded materials are used, which may affect environmental compliance and future maintenance in regulated markets. Additionally, MSL 3 classification means the device is sensitive to moisture and must be stored in dry conditions and baked if exposed to ambient air beyond 168 hours. During reflow, follow JEDEC standards to avoid 'popcorning' due to vaporized moisture. For high-reliability or export-bound designs, assess regulatory risks and consider conformal coating or hermetic sealing to extend operational life in harsh environments.
What are the key design-in risks when using the MPC8343CZQADDB in a new embedded design given its ob
Using the MPC8343CZQADDB in a new design carries significant supply chain and lifecycle risks due to its 'Obsolete' status. While 1314 units are currently in stock, long-term availability is not guaranteed, increasing the risk of production interruptions. Engineers should perform a thorough risk assessment and consider implementing a last-time buy strategy, designing in drop-in replacements like the MPC8343CVRADDB if available, or planning for a future redesign using active-pin-compatible alternatives. Consider obsolescence monitoring and secure extended sourcing to mitigate these risks in high-reliability or long-lifecycle applications.
How does the MPC8343CZQADDB compare to the MPC8343CVRADDB in terms of reliability and integration fo
The MPC8343CZQADDB and MPC8343CVRADDB are functionally similar PowerPC e300-based microprocessors with identical 266MHz speed, DDR/DDR2 memory support, triple Gigabit Ethernet, and USB 2.0 + PHY interfaces. However, the MPC8343CZQADDB specifies operation up to 105°C, making it more suitable for high-temperature industrial environments compared to some variants. Users replacing the MPC8343CVRADDB with the MPC8343CZQADDB should verify voltage rail stability and PCB thermal management due to the larger HBGA package and potential differences in power dissipation. Always validate thermal performance under full load conditions.
What are the critical PCB layout considerations for signal integrity when integrating the MPC8343CZQ
When laying out the MPC8343CZQADDB, maintain strict impedance control (typically 50Ω single-ended, 100Ω differential) and length matching for DDR/DDR2 data, address, and control traces to prevent clock skew and signal degradation. Use ground planes beneath high-speed traces, minimize vias, and provide adequate spacing from noisy signals such as PCI bus lines. The 620-HBGA package requires careful fanout planning—employ staggered microvias if needed. Terminate PCI signals with 47–100Ω pull-ups as recommended, and isolate analog and digital grounds with single-point connection near the exposed thermal pad to reduce noise coupling.
Can the MPC8343CZQADDB safely interface with 3.3V and 1.8V logic families in mixed-voltage systems,
Yes, the MPC8343CZQADDB supports multiple I/O voltages (1.8V, 2.5V, 3.3V), allowing direct interface with mixed-voltage peripherals when assigned to appropriate banks. Assign 3.3V-tolerant pins to legacy interfaces like DUART or SPI connected to 3.3V sensors, while using 1.8V banks for high-speed USB or internal logic. Ensure I/O banks are powered in the correct sequence and avoid floating inputs. For signals crossing unpowered sections, use bidirectional FET-based level shifters rather than resistive dividers to maintain signal integrity and prevent backfeeding.
What are the long-term reliability concerns with the MPC8343CZQADDB given its RoHS non-compliant sta
The MPC8343CZQADDB's RoHS non-compliance indicates leaded materials are used, which may affect environmental compliance and future maintenance in regulated markets. Additionally, MSL 3 classification means the device is sensitive to moisture and must be stored in dry conditions and baked if exposed to ambient air beyond 168 hours. During reflow, follow JEDEC standards to avoid 'popcorning' due to vaporized moisture. For high-reliability or export-bound designs, assess regulatory risks and consider conformal coating or hermetic sealing to extend operational life in harsh environments.
Quality Assurance (QC)
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Sep 15 2026
