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MPQ7920GRM-0000-AEC1-P
Electronics Part Number
MPQ7920GRM-0000-AEC1-P-WXManufacturer
NXP Semiconductors
MPQ7920GRM-0000-AEC1-P
Description
Power Management IC, 5V Input, Four Outputs 2A/2.5A/4.5A/4Inventory
213 Pcs New Original In Stock
26-QFN PMIC, 9 outputs: 4 synchronous buck + 5 LDO, 2.2MHz; compact high-efficiency multi-rail power for SoC, FPGA, and industrial designs.
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Technical Specifications
Category
Power Management (PMIC), Power Management - Specialized
Manufacturer
NXP Semiconductors
Packaging
-
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
64-LQFP Exposed Pad
Series
-
Base Product Number
MCZ33789
Product Status
Obsolete
Current - Supply
-
Applications
Airbag System
Voltage - Supply
5.2V ~ 20V
Supplier Device Package
64-LQFP (10x10)
Grade
Automotive
Data Sheet Document (D)
Datasheets
Download MCZ33789AE Product Specification (PDF)
HTML Datasheet
MCZ33789AE-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
935321364557
Standard Package
640
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Frequently Asked Questions (FAQ)
Can the MCZ33789AE be safely used as a direct replacement for the MCZ33789BAE in an existing airbag
The MCZ33789AE and MCZ33789BAE are functionally similar but not guaranteed as drop-in replacements due to potential internal firmware or calibration differences. While pinout and supply voltage (5.2V ~ 20V) are compatible, always verify SPI communication timing, wake-up behavior, and diagnostic flag responses in the target airbag system. We recommend reviewing NXP's errata and performing full functional testing under cold-crank (down to 5.2V) and load-dump conditions. If the BAE version is preferred for newer designs, consider redesigning the SBC initialization sequence and validating watchdog timeout thresholds to avoid false deployments or missed fault reporting.
What are the key design-in risks when using the MCZ33789AE in new automotive airbag systems given it
Using the MCZ33789AE in new designs carries significant supply chain and long-term reliability risks due to its obsolete status. While 2280 units are in stock, future availability is not guaranteed. For mission-critical airbag systems, this increases end-of-life exposure and limits production scalability. Strongly consider redesigning with active-recommended NXP SBCs like the MC33Z71790 or post-Q100 qualified replacements. If proceeding with MCZ33789AE, secure lifetime buys and validate the MSL 3 moisture sensitivity with board-level reflow profiling to prevent popcorning in the 64-LQFP exposed pad package.
How does the MCZ33789AE handle automotive supply transients like load dump or jump start, and are ex
The MCZ33789AE supports a wide input voltage range up to 20V, which covers typical 12V automotive jump-start conditions, but it does not inherently protect against standard load dump transients (which can exceed 40V). Therefore, external protection such as a transorb diode or load dump suppressor must be used on the main supply rail. For robust airbag system design, include a TVS diode rated for ISO 7637-2 Pulse 5a compliance on the VBATT input to prevent damage or unintended resets during transients, even though the PMIC operates within -40°C ~ 125°C under normal conditions.
What are the critical layout considerations for the MCZ33789AE 64-LQFP exposed pad package to ensure
Proper thermal management of the MCZ33789AE’s exposed pad is essential for long-term reliability in high-vibration airbag environments. The exposed pad must be soldered to a solid GND plane using a thermal via array (typically 9x9 grid), ensuring low thermal resistance to prevent junction temperature exceedance under continuous load. Additionally, minimize loop areas in SPI and CAN-FD traces to reduce EMI sensitivity. Route high-speed signals away from analog sensors, and place decoupling capacitors (100nF X7R) as close as possible to each VDD pin to maintain stable internal regulators under fast supply transients.
Is the MCZ33789AE suitable for integration in dual-redundant airbag control units, and what are the
The MCZ33789AE includes integrated diagnostics such as supply monitoring, watchdog, and communication checks, but it does not inherently support hardware-level redundancy required for ASIL D dual-path architectures. When designing redundant SRS systems, relying solely on the MCZ33789AE for fault coverage may not meet ISO 26262 ASIL requirements without external circuit validation. Designers must implement secondary monitoring (e.g., external watchdog, power supervisor) and validate fault detection coverage through FMEDA. For modern redundant systems, consider newer ASIL-compliant NXP SBCs that offer lockstep support and enhanced diagnostic coverage over the MCZ33789AE.
Can the MCZ33789AE be safely used as a direct replacement for the MCZ33789BAE in an existing airbag
The MCZ33789AE and MCZ33789BAE are functionally similar but not guaranteed as drop-in replacements due to potential internal firmware or calibration differences. While pinout and supply voltage (5.2V ~ 20V) are compatible, always verify SPI communication timing, wake-up behavior, and diagnostic flag responses in the target airbag system. We recommend reviewing NXP's errata and performing full functional testing under cold-crank (down to 5.2V) and load-dump conditions. If the BAE version is preferred for newer designs, consider redesigning the SBC initialization sequence and validating watchdog timeout thresholds to avoid false deployments or missed fault reporting.
What are the key design-in risks when using the MCZ33789AE in new automotive airbag systems given it
Using the MCZ33789AE in new designs carries significant supply chain and long-term reliability risks due to its obsolete status. While 2280 units are in stock, future availability is not guaranteed. For mission-critical airbag systems, this increases end-of-life exposure and limits production scalability. Strongly consider redesigning with active-recommended NXP SBCs like the MC33Z71790 or post-Q100 qualified replacements. If proceeding with MCZ33789AE, secure lifetime buys and validate the MSL 3 moisture sensitivity with board-level reflow profiling to prevent popcorning in the 64-LQFP exposed pad package.
How does the MCZ33789AE handle automotive supply transients like load dump or jump start, and are ex
The MCZ33789AE supports a wide input voltage range up to 20V, which covers typical 12V automotive jump-start conditions, but it does not inherently protect against standard load dump transients (which can exceed 40V). Therefore, external protection such as a transorb diode or load dump suppressor must be used on the main supply rail. For robust airbag system design, include a TVS diode rated for ISO 7637-2 Pulse 5a compliance on the VBATT input to prevent damage or unintended resets during transients, even though the PMIC operates within -40°C ~ 125°C under normal conditions.
What are the critical layout considerations for the MCZ33789AE 64-LQFP exposed pad package to ensure
Proper thermal management of the MCZ33789AE’s exposed pad is essential for long-term reliability in high-vibration airbag environments. The exposed pad must be soldered to a solid GND plane using a thermal via array (typically 9x9 grid), ensuring low thermal resistance to prevent junction temperature exceedance under continuous load. Additionally, minimize loop areas in SPI and CAN-FD traces to reduce EMI sensitivity. Route high-speed signals away from analog sensors, and place decoupling capacitors (100nF X7R) as close as possible to each VDD pin to maintain stable internal regulators under fast supply transients.
Is the MCZ33789AE suitable for integration in dual-redundant airbag control units, and what are the
The MCZ33789AE includes integrated diagnostics such as supply monitoring, watchdog, and communication checks, but it does not inherently support hardware-level redundancy required for ASIL D dual-path architectures. When designing redundant SRS systems, relying solely on the MCZ33789AE for fault coverage may not meet ISO 26262 ASIL requirements without external circuit validation. Designers must implement secondary monitoring (e.g., external watchdog, power supervisor) and validate fault detection coverage through FMEDA. For modern redundant systems, consider newer ASIL-compliant NXP SBCs that offer lockstep support and enhanced diagnostic coverage over the MCZ33789AE.
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Sep 15 2026
