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MPQ1530DQ-AEC1-LF-P
Electronics Part Number
MPQ1530DQ-AEC1-LF-P-WXManufacturer
NXP Semiconductors
MPQ1530DQ-AEC1-LF-P
Description
Positive and Negative Adjustable Linear Regulator, QFN-16Inventory
923 Pcs New Original In Stock
16-QFN PMIC: 3 outputs (1 boost, 2 LDO), 1.4MHz; saves space, extends battery life, and supplies stable rails for portable electronics and wireless sensors.
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Minimum 1
Minimum 1
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Basic cost: USD 70.00
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Technical Specifications
Category
Power Management (PMIC), Power Management - Specialized
Manufacturer
NXP Semiconductors
Packaging
-
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
28-SOIC (0.295", 7.50mm Width)
Series
-
Base Product Number
MCZ33742
Product Status
Obsolete
Current - Supply
42mA
Applications
-
Voltage - Supply
5.5V ~ 18V
Supplier Device Package
28-SOIC
Grade
Automotive
Data Sheet Document (D)
Datasheets
Download MCZ33742SEGR2 Product Specification (PDF)
HTML Datasheet
MCZ33742SEGR2-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.31.0001
Additional Information
Standard Package
1,000
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Frequently Asked Questions (FAQ)
What are the key design-in risks when using the MCZ33742SEGR2 in a new automotive application given
Using the MCZ33742SEGR2 in a new design carries significant supply chain risk due to its obsolete status. While 1,706 units are available as new original stock, long-term availability is not guaranteed. Engineers should evaluate end-of-life (EOL) implications, secure last-time buy quantities, and develop a migration plan. Consider pin-compatible alternatives like the ON Semiconductor NCV7420, or redesign with a currently active system basis chip (SBC) that supports similar CAN and voltage regulation features to ensure production longevity and support for automotive safety standards.
How does the MCZ33742SEGR2 handle thermal stress in high-temperature environments near 125°C, and wh
The MCZ33742SEGR2 is rated for operation up to 125°C, but under continuous load, thermal performance depends heavily on PCB design. To manage heat dissipation in automotive under-hood applications, use a 4-layer board with a dedicated ground plane and thermal vias under the exposed pad (if applicable—confirm package variant). Maintain adequate copper area for power traces and avoid placing heat-sensitive components nearby. Monitor junction temperature via datasheet thermal resistance parameters and derate power dissipation if ambient exceeds 105°C to ensure long-term reliability.
Can the MCZ33742SEGR2 replace the Freescale MCZ33843 in a CAN-powered body control module, and what
The MCZ33742SEGR2 and MCZ33843 share automotive CAN functionality but are not drop-in replacements. The MCZ33742SEGR2 integrates different voltage regulation profiles and wake-up mechanisms. Key differences include supply voltage monitoring thresholds and CAN transceiver sensitivity. If migrating from MCZ33843, revalidate the wake-up response time and verify compatibility with the ECU's power tree. Firmware-based wake-up filters may need adjustment, and external supervision circuitry could be required to match the original system behavior.
What are the reliability concerns with using a moisture sensitivity level 3 (MSL3) device like the M
As an MSL3 device, the MCZ33742SEGR2 must be used within 168 hours after exposure to ambient conditions (≤30°C/60% RH) or be re-baked before reflow. To avoid popcorning or delamination during SMT assembly, store the device in dry storage <10% RH and use humidity indicator cards in packaging. For extended storage, bake at 125°C for 24 hours before placement. Strict handling prevents internal damage that could lead to early-life failures in automotive environments with wide thermal cycling.
How does the MCZ33742SEGR2 perform during automotive cold crank conditions when supply voltage drops
The MCZ33742SEGR2 maintains regulated output down to 5.5V, making it suitable for cold crank scenarios typical in 12V automotive systems. However, ensure that downstream loads do not exceed the current capability under low input voltage conditions, as efficiency may decrease. Use low-ESR input capacitors near the VCC pins to sustain transient stability. Verify operation with a test profile emulating ISO 16750-2 voltage dips, and consider adding a pre-boost or hold-up capacitor if the system requires uninterrupted function below 5.5V.
What are the key design-in risks when using the MCZ33742SEGR2 in a new automotive application given
Using the MCZ33742SEGR2 in a new design carries significant supply chain risk due to its obsolete status. While 1,706 units are available as new original stock, long-term availability is not guaranteed. Engineers should evaluate end-of-life (EOL) implications, secure last-time buy quantities, and develop a migration plan. Consider pin-compatible alternatives like the ON Semiconductor NCV7420, or redesign with a currently active system basis chip (SBC) that supports similar CAN and voltage regulation features to ensure production longevity and support for automotive safety standards.
How does the MCZ33742SEGR2 handle thermal stress in high-temperature environments near 125°C, and wh
The MCZ33742SEGR2 is rated for operation up to 125°C, but under continuous load, thermal performance depends heavily on PCB design. To manage heat dissipation in automotive under-hood applications, use a 4-layer board with a dedicated ground plane and thermal vias under the exposed pad (if applicable—confirm package variant). Maintain adequate copper area for power traces and avoid placing heat-sensitive components nearby. Monitor junction temperature via datasheet thermal resistance parameters and derate power dissipation if ambient exceeds 105°C to ensure long-term reliability.
Can the MCZ33742SEGR2 replace the Freescale MCZ33843 in a CAN-powered body control module, and what
The MCZ33742SEGR2 and MCZ33843 share automotive CAN functionality but are not drop-in replacements. The MCZ33742SEGR2 integrates different voltage regulation profiles and wake-up mechanisms. Key differences include supply voltage monitoring thresholds and CAN transceiver sensitivity. If migrating from MCZ33843, revalidate the wake-up response time and verify compatibility with the ECU's power tree. Firmware-based wake-up filters may need adjustment, and external supervision circuitry could be required to match the original system behavior.
What are the reliability concerns with using a moisture sensitivity level 3 (MSL3) device like the M
As an MSL3 device, the MCZ33742SEGR2 must be used within 168 hours after exposure to ambient conditions (≤30°C/60% RH) or be re-baked before reflow. To avoid popcorning or delamination during SMT assembly, store the device in dry storage <10% RH and use humidity indicator cards in packaging. For extended storage, bake at 125°C for 24 hours before placement. Strict handling prevents internal damage that could lead to early-life failures in automotive environments with wide thermal cycling.
How does the MCZ33742SEGR2 perform during automotive cold crank conditions when supply voltage drops
The MCZ33742SEGR2 maintains regulated output down to 5.5V, making it suitable for cold crank scenarios typical in 12V automotive systems. However, ensure that downstream loads do not exceed the current capability under low input voltage conditions, as efficiency may decrease. Use low-ESR input capacitors near the VCC pins to sustain transient stability. Verify operation with a test profile emulating ISO 16750-2 voltage dips, and consider adding a pre-boost or hold-up capacitor if the system requires uninterrupted function below 5.5V.
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Sep 15 2026
