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MP5424GRM-0000-Z
Electronics Part Number
MP5424GRM-0000-Z-WXManufacturer
Renesas Electronics Corporation
MP5424GRM-0000-Z
Description
5V Power Management IC with Quad 4.5A/2.5A/4.5A OutputsInventory
466 Pcs New Original In Stock
26-QFN PMIC with 8 outputs: 4 synchronous buck + 3 LDO; 1.1MHz switching; efficient multi-rail power management for processors, FPGAs, and compact embedded systems.
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Technical Specifications
Category
Power Management (PMIC), Power Distribution Switches, Load Drivers
Manufacturer
Renesas Electronics Corporation
Packaging
-
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
8-PowerWFDFN
Series
-
Base Product Number
SLG7NT
Product Status
Obsolete
Output Type
N-Channel
Number of Outputs
1
Current - Output (Max)
4A
Input Type
CMOS
Supplier Device Package
8-FC-TDFN (1.5x2)
Switch Type
General Purpose
Voltage - Load
-
Output Configuration
High Side
Voltage - Supply (Vcc/Vdd)
2.5V ~ 5.5V
Ratio - Input:Output
1:1
Rds On (Typ)
22mOhm
Data Sheet Document (D)
Datasheets
Download SLG7NT614V Product Specification (PDF)
HTML Datasheet
SLG7NT614V-DG
Environmental & Export Classification
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
SLG7NT614VTR 1695-SLG7NT614VDKR 1695-SLG7NT614VCT 1827-1125-6 1695-SLG7NT614VTR 1827-1125-2 1827-1125-1 1827-1125-2-DG 1827-1125-1-DG 1827-1125-6-DG
Standard Package
3,000
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Frequently Asked Questions (FAQ)
Can the SLG7NT614V be used as a drop-in replacement for the SLG59M610V in a high-side N-channel MOSF
The SLG7NT614V is not a direct drop-in replacement for the SLG59M610V due to differences in control logic and enable timing characteristics, despite both being high-side N-channel power switches from Renesas. The SLG7NT614V uses CMOS input levels and has a fixed 1:1 ratio with no onboard charge pump boosting, whereas the SLG59M610V includes adaptive gate drive for better Rds(on) control. Using the SLG7NT614V in legacy SLG59M610V designs risks insufficient gate drive in low-voltage startup conditions (near 2.5V), potentially leading to elevated conduction losses. Always verify the input logic threshold compatibility and simulate turn-on transients under worst-case load conditions to ensure reliable operation.
What are the thermal design implications of using the SLG7NT614V at its maximum 4A output current in
Operating the SLG7NT614V at 4A continuous current requires careful thermal management due to its small 8-FC-TDFN (1.5x2mm) footprint. With a typical Rds(on) of 22mΩ, power dissipation can reach up to 352mW (I²R) under full load, which may cause the junction temperature to approach or exceed limits in poorly laid-out PCBs. To mitigate thermal risk, ensure at least 2x2 thermal vias under the exposed pad connected to a solid ground plane, use ≥2oz copper layers, and avoid placing the device near other heat sources. Monitor temperature in early prototypes with an IR camera or thermal pad simulation in your layout tool.
How does the obsolescence status of the SLG7NT614V impact long-term reliability and supply chain pla
The obsolescence status of the SLG7NT614V means Renesas no longer guarantees long-term availability, increasing supply chain risk for new product introductions. While 3050 units are currently in stock as New Original parts, these may not support volume production or extended lifecycle needs. Relying on this PMIC in new designs risks costly redesigns or last-time buys later. For long-term reliability, consider obsolescence-resistant alternatives like the MAX14577 or TPS22919, or contact Renesas directly for a recommended replacement path. Design mitigations include qualifying multiple switch ICs in parallel or selecting active-status pin-compatible devices with higher availability.
What are the risks of using the SLG7NT614V in a load-switch application with capacitive loads exceed
Using the SLG7NT614V with large capacitive loads (>100μF) risks inrush current spikes that exceed the 4A peak limit, potentially triggering internal protection or causing voltage droop on the supply rail. The device lacks adjustable slew rate control, so the rise time is fixed, leading to rapid charging of output capacitance. To reduce inrush, place a small series resistor (e.g., 10–50mΩ) or ferrite bead between the switch and the load, or use a staggered power-up sequence via external timing control. Always simulate the turn-on profile with your actual load and PCB parasitics to validate safe operation.
Can the SLG7NT614V reliably drive a 3.3V microcontroller power domain with dynamic load transients u
The SLG7NT614V can drive a 3.3V MCU domain with 3A dynamic loads, provided the input supply stays above 2.5V during transient events and PCB layout minimizes inductance. However, due to its fixed turn-on/off times and lack of active current limiting, it may not respond quickly enough to fast current spikes, increasing the risk of brownouts. Use at least 10μF low-ESR ceramic capacitance at the output and confirm stability with the MCU's worst-case power-up and sleep-mode transitions. Also validate operation over the full -40°C to 85°C range, as Rds(on) increases with temperature, which can exacerbate voltage drop under transient loads.
Can the SLG7NT614V be used as a drop-in replacement for the SLG59M610V in a high-side N-channel MOSF
The SLG7NT614V is not a direct drop-in replacement for the SLG59M610V due to differences in control logic and enable timing characteristics, despite both being high-side N-channel power switches from Renesas. The SLG7NT614V uses CMOS input levels and has a fixed 1:1 ratio with no onboard charge pump boosting, whereas the SLG59M610V includes adaptive gate drive for better Rds(on) control. Using the SLG7NT614V in legacy SLG59M610V designs risks insufficient gate drive in low-voltage startup conditions (near 2.5V), potentially leading to elevated conduction losses. Always verify the input logic threshold compatibility and simulate turn-on transients under worst-case load conditions to ensure reliable operation.
What are the thermal design implications of using the SLG7NT614V at its maximum 4A output current in
Operating the SLG7NT614V at 4A continuous current requires careful thermal management due to its small 8-FC-TDFN (1.5x2mm) footprint. With a typical Rds(on) of 22mΩ, power dissipation can reach up to 352mW (I²R) under full load, which may cause the junction temperature to approach or exceed limits in poorly laid-out PCBs. To mitigate thermal risk, ensure at least 2x2 thermal vias under the exposed pad connected to a solid ground plane, use ≥2oz copper layers, and avoid placing the device near other heat sources. Monitor temperature in early prototypes with an IR camera or thermal pad simulation in your layout tool.
How does the obsolescence status of the SLG7NT614V impact long-term reliability and supply chain pla
The obsolescence status of the SLG7NT614V means Renesas no longer guarantees long-term availability, increasing supply chain risk for new product introductions. While 3050 units are currently in stock as New Original parts, these may not support volume production or extended lifecycle needs. Relying on this PMIC in new designs risks costly redesigns or last-time buys later. For long-term reliability, consider obsolescence-resistant alternatives like the MAX14577 or TPS22919, or contact Renesas directly for a recommended replacement path. Design mitigations include qualifying multiple switch ICs in parallel or selecting active-status pin-compatible devices with higher availability.
What are the risks of using the SLG7NT614V in a load-switch application with capacitive loads exceed
Using the SLG7NT614V with large capacitive loads (>100μF) risks inrush current spikes that exceed the 4A peak limit, potentially triggering internal protection or causing voltage droop on the supply rail. The device lacks adjustable slew rate control, so the rise time is fixed, leading to rapid charging of output capacitance. To reduce inrush, place a small series resistor (e.g., 10–50mΩ) or ferrite bead between the switch and the load, or use a staggered power-up sequence via external timing control. Always simulate the turn-on profile with your actual load and PCB parasitics to validate safe operation.
Can the SLG7NT614V reliably drive a 3.3V microcontroller power domain with dynamic load transients u
The SLG7NT614V can drive a 3.3V MCU domain with 3A dynamic loads, provided the input supply stays above 2.5V during transient events and PCB layout minimizes inductance. However, due to its fixed turn-on/off times and lack of active current limiting, it may not respond quickly enough to fast current spikes, increasing the risk of brownouts. Use at least 10μF low-ESR ceramic capacitance at the output and confirm stability with the MCU's worst-case power-up and sleep-mode transitions. Also validate operation over the full -40°C to 85°C range, as Rds(on) increases with temperature, which can exacerbate voltage drop under transient loads.
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Sep 15 2026
