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MCZ33905BS5EKR2
Electronics Part Number
MCZ33905BS5EKR2-WXManufacturer
STMicroelectronics
MCZ33905BS5EKR2
Description
Interface Controller IC, Specialized, 32-SOICInventory
589 Pcs New Original In Stock
"54-SOIC-EP system basis chip interface. Integrates regulation, monitoring, protection. Enhances ECU reliability. For automotive body control.",
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Basic cost: USD 70.00
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Technical Specifications
Category
Interface, Encoders, Decoders, Converters
Manufacturer
STMicroelectronics
Packaging
-
Mounting Type
Surface Mount
Package / Case
80-LQFP
Series
-
Base Product Number
STA310
Product Status
Obsolete
Type
Audio Decoder
Applications
HDTV, Players, Receivers, Set-Top Boxes
Supplier Device Package
80-TQFP (14x14)
Voltage - Supply, Analog
2.5V
Voltage - Supply, Digital
2.5V
Data Sheet Document (D)
Datasheets
Download STA310 Product Specification (PDF)
HTML Datasheet
STA310-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
497-8856 STA310-DG
Standard Package
90
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Frequently Asked Questions (FAQ)
Can the STA310 be used as a drop-in replacement for the STA309A in a set-top box audio decoding desi
The STA310 is not a direct drop-in replacement for the STA309A due to differences in register mapping and firmware compatibility, despite similar pinouts and 6+2 channel functionality. Designers must verify configuration code and audio processing parameters, as the STA310 may require updated initialization sequences. Additionally, always confirm supply rail stability at 2.5V for both analog and digital domains when migrating, as noise coupling can impact audio quality in legacy designs not originally targeting the STA310's power requirements.
What are the risks of using the STA310 in a new product design given its obsolete status from STMicr
Using the STA310 in a new design carries significant supply chain risk due to its obsolete status, limiting long-term availability despite current stock of 2460 units. Designers should consider end-of-life implications for production scalability and field repairs. For new designs, evaluate alternatives like the STA333W6B or digital audio processors from Analog Devices (e.g., ADAU1781) with upgraded support and pin-compatible integration paths. Always secure last-time buy quantities and validate second-source options if committed to the STA310.
How can I mitigate audio distortion in the STA310 when operating in high-noise environments like AV
To reduce audio distortion in noisy environments, implement strict PCB layout practices for the STA310: separate analog and digital ground planes tied at a single point, use ferrite beads on the 2.5V supply lines, and add low-ESR decoupling capacitors (10μF X7R + 100nF ceramic) close to each power pin. Shield the crystal oscillator traces and avoid routing digital signals under the 80-TQFP package. Consider adding a separate LDO for the STA310's analog supply to isolate it from digital switching noise in AV receiver applications.
Is the STA310 suitable for modern HDMI 2.0 audio passthrough designs in HDTV systems, and what are t
The STA310 supports multichannel PCM and legacy Dolby Digital decoding but lacks native HDMI 2.0 interface circuitry, limiting its use in modern HDMI 2.0 audio passthrough applications. It relies on external S/PDIF or I2S inputs, which may bottleneck high-bitrate audio like Dolby TrueHD or DTS-HD Master Audio. For HDTV designs requiring HDMI 2.0 audio, pairing the STA310 with a bridge IC (e.g., TI's TS3L501E) is possible but adds complexity; consider upgrading to HDMI-enabled decoders like the TAS5760M for better integration and future-proofing.
What thermal management considerations are critical when designing the STA310 into compact set-top b
In confined set-top box enclosures, the STA310's 80-TQFP (14x14) package requires careful thermal planning due to potential heat buildup under sustained multichannel decoding. Use a solid thermal via array under the exposed pad connected to an internal ground plane, and ensure at least 2 oz copper for power and ground layers. Monitor junction temperature via thermal simulation, especially when ambient exceeds 50°C. Derate maximum power dissipation by 20% in no-airflow scenarios and avoid placing heat-generating components (e.g., power regulators) adjacent to the STA310 on the PCB.
Can the STA310 be used as a drop-in replacement for the STA309A in a set-top box audio decoding desi
The STA310 is not a direct drop-in replacement for the STA309A due to differences in register mapping and firmware compatibility, despite similar pinouts and 6+2 channel functionality. Designers must verify configuration code and audio processing parameters, as the STA310 may require updated initialization sequences. Additionally, always confirm supply rail stability at 2.5V for both analog and digital domains when migrating, as noise coupling can impact audio quality in legacy designs not originally targeting the STA310's power requirements.
What are the risks of using the STA310 in a new product design given its obsolete status from STMicr
Using the STA310 in a new design carries significant supply chain risk due to its obsolete status, limiting long-term availability despite current stock of 2460 units. Designers should consider end-of-life implications for production scalability and field repairs. For new designs, evaluate alternatives like the STA333W6B or digital audio processors from Analog Devices (e.g., ADAU1781) with upgraded support and pin-compatible integration paths. Always secure last-time buy quantities and validate second-source options if committed to the STA310.
How can I mitigate audio distortion in the STA310 when operating in high-noise environments like AV
To reduce audio distortion in noisy environments, implement strict PCB layout practices for the STA310: separate analog and digital ground planes tied at a single point, use ferrite beads on the 2.5V supply lines, and add low-ESR decoupling capacitors (10μF X7R + 100nF ceramic) close to each power pin. Shield the crystal oscillator traces and avoid routing digital signals under the 80-TQFP package. Consider adding a separate LDO for the STA310's analog supply to isolate it from digital switching noise in AV receiver applications.
Is the STA310 suitable for modern HDMI 2.0 audio passthrough designs in HDTV systems, and what are t
The STA310 supports multichannel PCM and legacy Dolby Digital decoding but lacks native HDMI 2.0 interface circuitry, limiting its use in modern HDMI 2.0 audio passthrough applications. It relies on external S/PDIF or I2S inputs, which may bottleneck high-bitrate audio like Dolby TrueHD or DTS-HD Master Audio. For HDTV designs requiring HDMI 2.0 audio, pairing the STA310 with a bridge IC (e.g., TI's TS3L501E) is possible but adds complexity; consider upgrading to HDMI-enabled decoders like the TAS5760M for better integration and future-proofing.
What thermal management considerations are critical when designing the STA310 into compact set-top b
In confined set-top box enclosures, the STA310's 80-TQFP (14x14) package requires careful thermal planning due to potential heat buildup under sustained multichannel decoding. Use a solid thermal via array under the exposed pad connected to an internal ground plane, and ensure at least 2 oz copper for power and ground layers. Monitor junction temperature via thermal simulation, especially when ambient exceeds 50°C. Derate maximum power dissipation by 20% in no-airflow scenarios and avoid placing heat-generating components (e.g., power regulators) adjacent to the STA310 on the PCB.
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Sep 15 2026
