Counterfeit and defect prevention
Visual and packaging inspection
Electrical performance verification
0.0 / 5.0
- (0 Ratings)
MCP14A0901-E/SN
Electronics Part Number
MCP14A0901-E/SN-WXManufacturer
Microchip Technology
MCP14A0901-E/SN
Description
SOIC-8 High/Low Side Gate Driver ICInventory
194 Pcs New Original In Stock
SOIC-8 gate driver, high/low-side, inverting; high noise immunity and reliable operation for industrial power supplies.
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
How to Order
Shipping & Delivery
Quality Assurance
365 - Day Quality Guarantee - Every part fully backed.
90 - Day Refund or Exchange - Defective parts? No hassle.
Limited Stock, Order Now - Get reliable parts without worry.
Global Shipping & Secure Packaging
Worldwide Delivery in 3-5 Business Days
100% ESD Anti-Static Packaging
Real-Time Tracking for Every Order
Secure & Flexible Payment
Credit Card, VISA, MasterCard, PayPal, Western Union, Telegraphic Transfer(T/T) and more
All payments encrypted for security
RFQ (Request for Quotations)
Submit your RFQ directly on the product detail page or the RFQ page.
Our sales team will respond within 24 hours.
Payment method
PayPal (recommended for new customers)
Credit Cards
Wire Transfer (T/T) – Available in USD, EUR, HKD, and other currencies.
Important Notice
You'll receive a confirmation email after submitting an RFQ.
Didn't get it? Check your spam folder and whitelist Info@WINSURE-Electronics.com
Prices and stock may change; we'll reconfirm your order.
Questions? Contact us anytime.
Freight
Basic cost: USD 70.00
Actual cost may vary depending on weight and destination
Shipping method
Shipped from Hong Kong via FedEx/DHL/UPS/TNT
Delivery Time
In-stock items: Ready to ship in 1-2 days
Transit time: 3-5 business days (FedEx/DHL/UPS)
Special requests? Contact us: Info@WINSURE-Electronics.com
Quantity
Minimum 1
Minimum 1
(*) (*) is mandatory
We'll get back to you within 24 hours
Technical Specifications
Category
Specialized ICs
Manufacturer
Microchip Technology
Packaging
-
Mounting Type
Surface Mount
Package / Case
128-BFQFP
Series
-
Base Product Number
KS8993
Product Status
Obsolete
Type
10/100 Integrated Switch
Applications
Port Switch/Network Interface
Supplier Device Package
128-PQFP (14x20)
DiGi-Electronics Programmable
Not Verified
Data Sheet Document (D)
Datasheets
Download KS8993F Product Specification (PDF)
HTML Datasheet
KS8993F-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A991B1
HTSUS
8542.39.0001
Additional Information
Standard Package
66
Reviews
0.0/5.0-(Show up to 5 Ratings)
No reviews yet
Publish Evalution
Evalution Message
Please enter your review message.
Please post honest comments and do not post ilegal comments.
Frequently Asked Questions (FAQ)
Can I replace the obsolete KS8993F with the KSZ8993F in an existing 10/100 Ethernet switch design wi
The KSZ8993F is a drop-in replacement for the KS8993F and is pin-compatible in the same 128-PQFP (14x20) package, making it suitable for direct substitution in most designs. However, verify that your firmware supports any minor register map differences—Microchip provides migration guidance confirming functional equivalence. Always revalidate signal integrity on high-speed traces (e.g., MII/RMII interfaces) after replacement, especially if your board layout pushes timing margins close to spec. This swap mitigates supply chain risk from the KS8993F’s obsolete status while maintaining RoHS3 compliance and MSL 3 handling requirements.
What are the key reliability risks when designing in the KS8993F given its obsolete status and MSL 3
The primary reliability risks with the KS8993F stem from its obsolete status—long-term availability is not guaranteed, increasing redesign risk—and its MSL 3 classification, which demands strict moisture control during storage and assembly (floor life of only 168 hours after bag opening). If your production line lacks controlled humidity environments or uses batch processing that exceeds this window, you risk popcorning or latent interconnect failures. Always bake parts per J-STD-033 if exposed beyond MSL 3 limits, and consider qualifying the KSZ8993F as a second-source to avoid field failures due to component shortages.
How does the thermal performance of the KS8993F in a 128-PQFP package affect layout decisions in com
The KS8993F’s 128-PQFP (14x20 mm) package lacks an exposed thermal pad, relying solely on leadframe conduction through the PCB. In dense industrial designs, this can lead to localized heating under sustained 100 Mbps full-duplex traffic. To mitigate this, use a solid ground plane under the device, stitch it with multiple vias to inner layers, and avoid placing heat-sensitive components nearby. Thermal simulations or empirical testing under worst-case ambient temperatures (e.g., 70°C enclosure) are recommended—failure to manage junction temperature may cause intermittent link drops or reduced MTBF, especially when operating near the upper end of the commercial temperature range.
Is the KS8993F suitable for automotive Ethernet applications, and how does it compare to newer alter
The KS8993F is not qualified for automotive use—it lacks AEC-Q100 certification and operates only over the commercial temperature range (0°C to 70°C), making it unsuitable for under-hood or exterior vehicle applications. In contrast, the KSZ9031RNX is AEC-Q100 Grade 2 qualified (-40°C to 105°C) and includes enhanced ESD protection. If you're designing an automotive-grade switch, avoid the KS8993F entirely; instead, migrate to automotive-certified PHYs or integrated switches. Using the KS8993F in such environments risks premature failure due to thermal cycling and electrical stress, voiding system reliability.
What design constraints should I consider when integrating the KS8993F into a legacy system with RMI
When using the KS8993F with an RMII interface, ensure your MAC supports the 50 MHz reference clock requirement and that trace lengths between the KS8993F and MAC are matched within ±50 mils to avoid setup/hold violations—critical in cost-optimized boards with minimal layer counts. The KS8993F integrates three PHYs and a switch fabric, reducing external component count versus discrete PHY solutions, but its obsolete status may increase long-term BOM risk. Validate EMI performance early, as integrated switches can exhibit higher radiated emissions than discrete designs; consider adding common-mode chokes on unused ports even if not strictly required, to avoid costly late-stage EMC re-spins.
Can I replace the obsolete KS8993F with the KSZ8993F in an existing 10/100 Ethernet switch design wi
The KSZ8993F is a drop-in replacement for the KS8993F and is pin-compatible in the same 128-PQFP (14x20) package, making it suitable for direct substitution in most designs. However, verify that your firmware supports any minor register map differences—Microchip provides migration guidance confirming functional equivalence. Always revalidate signal integrity on high-speed traces (e.g., MII/RMII interfaces) after replacement, especially if your board layout pushes timing margins close to spec. This swap mitigates supply chain risk from the KS8993F’s obsolete status while maintaining RoHS3 compliance and MSL 3 handling requirements.
What are the key reliability risks when designing in the KS8993F given its obsolete status and MSL 3
The primary reliability risks with the KS8993F stem from its obsolete status—long-term availability is not guaranteed, increasing redesign risk—and its MSL 3 classification, which demands strict moisture control during storage and assembly (floor life of only 168 hours after bag opening). If your production line lacks controlled humidity environments or uses batch processing that exceeds this window, you risk popcorning or latent interconnect failures. Always bake parts per J-STD-033 if exposed beyond MSL 3 limits, and consider qualifying the KSZ8993F as a second-source to avoid field failures due to component shortages.
How does the thermal performance of the KS8993F in a 128-PQFP package affect layout decisions in com
The KS8993F’s 128-PQFP (14x20 mm) package lacks an exposed thermal pad, relying solely on leadframe conduction through the PCB. In dense industrial designs, this can lead to localized heating under sustained 100 Mbps full-duplex traffic. To mitigate this, use a solid ground plane under the device, stitch it with multiple vias to inner layers, and avoid placing heat-sensitive components nearby. Thermal simulations or empirical testing under worst-case ambient temperatures (e.g., 70°C enclosure) are recommended—failure to manage junction temperature may cause intermittent link drops or reduced MTBF, especially when operating near the upper end of the commercial temperature range.
Is the KS8993F suitable for automotive Ethernet applications, and how does it compare to newer alter
The KS8993F is not qualified for automotive use—it lacks AEC-Q100 certification and operates only over the commercial temperature range (0°C to 70°C), making it unsuitable for under-hood or exterior vehicle applications. In contrast, the KSZ9031RNX is AEC-Q100 Grade 2 qualified (-40°C to 105°C) and includes enhanced ESD protection. If you're designing an automotive-grade switch, avoid the KS8993F entirely; instead, migrate to automotive-certified PHYs or integrated switches. Using the KS8993F in such environments risks premature failure due to thermal cycling and electrical stress, voiding system reliability.
What design constraints should I consider when integrating the KS8993F into a legacy system with RMI
When using the KS8993F with an RMII interface, ensure your MAC supports the 50 MHz reference clock requirement and that trace lengths between the KS8993F and MAC are matched within ±50 mils to avoid setup/hold violations—critical in cost-optimized boards with minimal layer counts. The KS8993F integrates three PHYs and a switch fabric, reducing external component count versus discrete PHY solutions, but its obsolete status may increase long-term BOM risk. Validate EMI performance early, as integrated switches can exhibit higher radiated emissions than discrete designs; consider adding common-mode chokes on unused ports even if not strictly required, to avoid costly late-stage EMC re-spins.
Quality Assurance (QC)
WINSURE ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
Sep 15 2026
