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MAX9177EUB+
Electronics Part Number
MAX9177EUB+-WXManufacturer
Analog Devices, Inc.
MAX9177EUB+
Description
2x1 multiplexer IC in 10-pin UMAX.Inventory
585 Pcs New Original In Stock
10-uMAX/uSOP LVDS switch; 1-channel; high-speed low-voltage differential signaling; for PCIe, display interfaces, and high-speed data multiplexing.
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Basic cost: USD 70.00
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Technical Specifications
Category
Data Acquisition, Digital to Analog Converters (DAC)
Manufacturer
Analog Devices, Inc.
Packaging
Tape & Reel (TR)
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
20-WFQFN Exposed Pad
Series
-
Base Product Number
LTC2654
Product Status
Active
Output Type
Voltage - Buffered
Supplier Device Package
20-QFN (4x4)
DiGi-Electronics Programmable
Not Verified
Data Interface
SPI
Reference Type
External, Internal
Number of Bits
12
Number of D/A Converters
4
Settling Time
4.2µs (Typ)
Differential Output
No
Voltage - Supply, Analog
2.7V ~ 5.5V
Voltage - Supply, Digital
2.7V ~ 5.5V
INL/DNL (LSB)
±0.5, ±0.1
Architecture
-
Data Sheet Document (D)
Datasheets
Download LTC2654IUF-L12#TRPBF Product Specification (PDF)
HTML Datasheet
LTC2654IUF-L12#TRPBF-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Standard Package
2,500
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Frequently Asked Questions (FAQ)
Can the LTC2654IUF-L12#TRPBF be safely used in a 5V industrial control system where the analog outpu
The LTC2654IUF-L12#TRPBF is rated for a 2.7V to 5.5V analog supply and can operate in a 5V system, but driving loads below 2kΩ risks exceeding the output amplifier’s current capability, potentially causing output saturation, increased settling time, or thermal stress. For loads under 2kΩ, add a buffer op-amp (e.g., ADA4807) between the DAC output and load to maintain accuracy and protect the internal buffer. Always verify headroom margins—output swing is typically within 50mV of rails under light loads, but drops significantly under heavier loads.
Is the LTC2654IUF-L12#TRPBF a drop-in replacement for the Texas Instruments DAC80504EVM in a 4-chann
While both are 12-bit, 4-channel SPI DACs in QFN packages, the LTC2654IUF-L12#TRPBF is not a direct drop-in for the DAC80504 due to pinout differences, reference architecture (external/internal vs. internal-only), and power sequencing requirements. The LTC2654 supports both internal and external references, offering more flexibility, but requires careful PCB layout changes. Additionally, the LTC2654 has a faster settling time (4.2µs vs. ~6µs), which may benefit dynamic applications, but ensure your firmware accounts for its power-on reset behavior and SDO timing if daisy-chaining.
What are the reliability implications of operating the LTC2654IUF-L12#TRPBF at its full -40°C to 85°
The LTC2654IUF-L12#TRPBF is qualified for -40°C to 85°C operation, but frequent thermal cycling in outdoor environments can induce mechanical stress on the 20-QFN exposed pad package, risking solder joint fatigue over time. To mitigate this, use a robust solder paste (e.g., SAC305 with no-clean flux), ensure proper pad design with thermal vias under the exposed pad, and consider underfill if vibration is present. Monitor INL drift over temperature—while typical performance is stable, long-term accuracy may degrade slightly at temperature extremes without periodic calibration.
How does the internal reference of the LTC2654IUF-L12#TRPBF compare to using an external ADR4525 in
The internal reference in the LTC2654IUF-L12#TRPBF offers convenience and space savings but has higher drift (~10ppm/°C typical) and noise (~30µV RMS) compared to the ADR4525 (~2ppm/°C, ~1.5µV RMS). For precision calibration instruments requiring <0.01% accuracy over time, an external ADR4525 is strongly recommended. When using an external reference, bypass it with a 10µF ceramic capacitor near the REF pin and isolate it from digital noise. This trade-off increases BOM cost and layout complexity but significantly improves long-term stability and reduces gain error drift.
Can I daisy-chain multiple LTC2654IUF-L12#TRPBF devices on a single SPI bus without signal integrity
Yes, the LTC2654IUF-L12#TRPBF supports SPI daisy-chaining via its SDO pin, but at 20MHz in a noisy motor environment, signal integrity risks increase due to crosstalk and ground bounce. Use short, impedance-controlled traces, series termination resistors (22–33Ω) near each SDI/SDO, and separate analog/digital ground planes with a single-point connection. Avoid routing SPI lines near PWM or power stages. For systems with >3 devices, consider using a SPI buffer (e.g., SN74LVC1G125) to maintain signal integrity. Also, ensure all devices share a common ground reference to prevent latch-up or communication errors.
Can the LTC2654IUF-L12#TRPBF be safely used in a 5V industrial control system where the analog outpu
The LTC2654IUF-L12#TRPBF is rated for a 2.7V to 5.5V analog supply and can operate in a 5V system, but driving loads below 2kΩ risks exceeding the output amplifier’s current capability, potentially causing output saturation, increased settling time, or thermal stress. For loads under 2kΩ, add a buffer op-amp (e.g., ADA4807) between the DAC output and load to maintain accuracy and protect the internal buffer. Always verify headroom margins—output swing is typically within 50mV of rails under light loads, but drops significantly under heavier loads.
Is the LTC2654IUF-L12#TRPBF a drop-in replacement for the Texas Instruments DAC80504EVM in a 4-chann
While both are 12-bit, 4-channel SPI DACs in QFN packages, the LTC2654IUF-L12#TRPBF is not a direct drop-in for the DAC80504 due to pinout differences, reference architecture (external/internal vs. internal-only), and power sequencing requirements. The LTC2654 supports both internal and external references, offering more flexibility, but requires careful PCB layout changes. Additionally, the LTC2654 has a faster settling time (4.2µs vs. ~6µs), which may benefit dynamic applications, but ensure your firmware accounts for its power-on reset behavior and SDO timing if daisy-chaining.
What are the reliability implications of operating the LTC2654IUF-L12#TRPBF at its full -40°C to 85°
The LTC2654IUF-L12#TRPBF is qualified for -40°C to 85°C operation, but frequent thermal cycling in outdoor environments can induce mechanical stress on the 20-QFN exposed pad package, risking solder joint fatigue over time. To mitigate this, use a robust solder paste (e.g., SAC305 with no-clean flux), ensure proper pad design with thermal vias under the exposed pad, and consider underfill if vibration is present. Monitor INL drift over temperature—while typical performance is stable, long-term accuracy may degrade slightly at temperature extremes without periodic calibration.
How does the internal reference of the LTC2654IUF-L12#TRPBF compare to using an external ADR4525 in
The internal reference in the LTC2654IUF-L12#TRPBF offers convenience and space savings but has higher drift (~10ppm/°C typical) and noise (~30µV RMS) compared to the ADR4525 (~2ppm/°C, ~1.5µV RMS). For precision calibration instruments requiring <0.01% accuracy over time, an external ADR4525 is strongly recommended. When using an external reference, bypass it with a 10µF ceramic capacitor near the REF pin and isolate it from digital noise. This trade-off increases BOM cost and layout complexity but significantly improves long-term stability and reduces gain error drift.
Can I daisy-chain multiple LTC2654IUF-L12#TRPBF devices on a single SPI bus without signal integrity
Yes, the LTC2654IUF-L12#TRPBF supports SPI daisy-chaining via its SDO pin, but at 20MHz in a noisy motor environment, signal integrity risks increase due to crosstalk and ground bounce. Use short, impedance-controlled traces, series termination resistors (22–33Ω) near each SDI/SDO, and separate analog/digital ground planes with a single-point connection. Avoid routing SPI lines near PWM or power stages. For systems with >3 devices, consider using a SPI buffer (e.g., SN74LVC1G125) to maintain signal integrity. Also, ensure all devices share a common ground reference to prevent latch-up or communication errors.
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Sep 15 2026
