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MAX7457ETE+
Electronics Part Number
MAX7457ETE+-WXManufacturer
Microchip Technology
MAX7457ETE+
Description
Dual SCART video switch IC, 16-TQFN.Inventory
427 Pcs New Original In Stock
16-TQFN video switch; 4-channel; wideband performance, low crosstalk; for multi-input video routers, surveillance systems, and display selectors.
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Basic cost: USD 70.00
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Technical Specifications
Category
Data Acquisition, Touch Screen Controllers
Manufacturer
Microchip Technology
Packaging
Tube
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
44-VQFN Exposed Pad
Series
-
Base Product Number
MTCH6301
Product Status
Active
Current - Supply
19 mA
Voltage - Supply
2.3V ~ 3.6V
Supplier Device Package
44-QFN (8x8)
Interface
I2C
Touchscreen
2 Wire Capacitive
Resolution (Bits)
-
Voltage Reference
-
Data Sheet Document (D)
Datasheets
Download MTCH6301-I/ML Product Specification (PDF)
HTML Datasheet
MTCH6301-I/ML-DG
PCN Design/Specification
MTCH6301 Datasheet Update 21/Mar/2014
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.31.0001
Additional Information
Standard Package
45
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Frequently Asked Questions (FAQ)
What are the key design-in risks when integrating the MTCH6301-I/ML touchscreen controller in a batt
When designing the MTCH6301-I/ML into low-power systems, engineers must account for its 19 mA active current draw, which can significantly impact battery life if the controller runs continuously. Although the device supports low-voltage operation (2.3V–3.6V), it lacks built-in ultra-low-power sleep modes commonly found in competing controllers like the MAX14827A. To mitigate power consumption risks, implement firmware-driven periodic wake/sleep cycles via the I2C interface and ensure unused channels are disabled. Additionally, verify that the host microcontroller can reliably manage I2C clock stretching during touch detection to prevent bus lockups under low-power states.
How does the MTCH6301-I/ML compare to the FDC1004QRUYR in terms of noise immunity and EMI performanc
The MTCH6301-I/ML offers capacitive sensing robustness in noisy environments due to Microchip's patented SmartSense auto-calibration algorithm, which dynamically adjusts baselines—giving it an edge over the FDC1004QRUYR, which requires external RC filtering and manual gain calibration. However, unlike the FDC1004's differential input structure, the MTCH6301-I/ML uses single-ended 2-wire capacitive sensing, making it more susceptible to common-mode noise on long trace runs. In high-ESD industrial setups, supplement the MTCH6301-I/ML with TVS diodes on the I2C lines and guard rings around sensor traces. Validate immunity per IEC 61000-4-2 Level 3 during prototyping to avoid field failures.
Can the MTCH6301-I/ML reliably replace the TTP229B-BA6 in a 44-key capacitive keypad design, and wha
While both the MTCH6301-I/ML and TTP229B-BA6 support 2-wire capacitive sensing, the MTCH6301-I/ML provides superior channel count scalability and I2C configurability compared to the fixed-function TTP229B-BA6. However, replacing the TTP229B-BA6 requires careful attention to layout: maintain minimum 2 mm spacing between adjacent sensor pads, use ground-filled voids between channels, and keep trace lengths under 10 mm to minimize capacitive coupling. The MTCH6301-I/ML allows individual channel sensitivity tuning via firmware, which should be leveraged to balance response across the array. Validate crosstalk behavior with all keys pressed simultaneously during EMI chamber testing.
What are the thermal and mechanical reliability concerns when mounting the MTCH6301-I/ML in a 44-QFN
The MTCH6301-I/ML's 44-QFN (8x8) package with exposed thermal pad is physically robust but vulnerable to solder joint fatigue under sustained mechanical vibration unless properly anchored. Use an array of thermal vias (at least 4x4) under the exposed pad connected to internal ground planes to enhance mechanical adhesion and thermal dissipation. Avoid placing the device near board edges or connectors that act as stress concentrators. Additionally, ensure the reflow profile meets IPC-7095 standards for QFNs to prevent voiding or head-in-pillow defects. For automotive applications, supplement with conformal coating to resist microcracking from thermal cycling between -40°C and 85°C.
What are the I2C integration challenges with the MTCH6301-I/ML when shared on a bus with other senso
The MTCH6301-I/ML uses a fixed I2C address, increasing the risk of bus collisions in multi-sensor designs. If sharing the bus with devices like the BME280 or Si7021, isolate the MTCH6301-I/ML on a dedicated I2C line or use an I2C multiplexer (e.g., PCA9548A) to avoid address contention. The device employs clock stretching during touch processing, which can cause timeouts on microcontrollers with short I2C hold-time tolerances (e.g., some STM32 variants). To prevent communication failures, extend MCU I2C timeout periods, use pull-up resistors of 2.2kΩ–4.7kΩ (optimized for 3.3V), and buffer SDA/SCL lines with 100Ω series resistors to dampen ringing in dense layouts.
What are the key design-in risks when integrating the MTCH6301-I/ML touchscreen controller in a batt
When designing the MTCH6301-I/ML into low-power systems, engineers must account for its 19 mA active current draw, which can significantly impact battery life if the controller runs continuously. Although the device supports low-voltage operation (2.3V–3.6V), it lacks built-in ultra-low-power sleep modes commonly found in competing controllers like the MAX14827A. To mitigate power consumption risks, implement firmware-driven periodic wake/sleep cycles via the I2C interface and ensure unused channels are disabled. Additionally, verify that the host microcontroller can reliably manage I2C clock stretching during touch detection to prevent bus lockups under low-power states.
How does the MTCH6301-I/ML compare to the FDC1004QRUYR in terms of noise immunity and EMI performanc
The MTCH6301-I/ML offers capacitive sensing robustness in noisy environments due to Microchip's patented SmartSense auto-calibration algorithm, which dynamically adjusts baselines—giving it an edge over the FDC1004QRUYR, which requires external RC filtering and manual gain calibration. However, unlike the FDC1004's differential input structure, the MTCH6301-I/ML uses single-ended 2-wire capacitive sensing, making it more susceptible to common-mode noise on long trace runs. In high-ESD industrial setups, supplement the MTCH6301-I/ML with TVS diodes on the I2C lines and guard rings around sensor traces. Validate immunity per IEC 61000-4-2 Level 3 during prototyping to avoid field failures.
Can the MTCH6301-I/ML reliably replace the TTP229B-BA6 in a 44-key capacitive keypad design, and wha
While both the MTCH6301-I/ML and TTP229B-BA6 support 2-wire capacitive sensing, the MTCH6301-I/ML provides superior channel count scalability and I2C configurability compared to the fixed-function TTP229B-BA6. However, replacing the TTP229B-BA6 requires careful attention to layout: maintain minimum 2 mm spacing between adjacent sensor pads, use ground-filled voids between channels, and keep trace lengths under 10 mm to minimize capacitive coupling. The MTCH6301-I/ML allows individual channel sensitivity tuning via firmware, which should be leveraged to balance response across the array. Validate crosstalk behavior with all keys pressed simultaneously during EMI chamber testing.
What are the thermal and mechanical reliability concerns when mounting the MTCH6301-I/ML in a 44-QFN
The MTCH6301-I/ML's 44-QFN (8x8) package with exposed thermal pad is physically robust but vulnerable to solder joint fatigue under sustained mechanical vibration unless properly anchored. Use an array of thermal vias (at least 4x4) under the exposed pad connected to internal ground planes to enhance mechanical adhesion and thermal dissipation. Avoid placing the device near board edges or connectors that act as stress concentrators. Additionally, ensure the reflow profile meets IPC-7095 standards for QFNs to prevent voiding or head-in-pillow defects. For automotive applications, supplement with conformal coating to resist microcracking from thermal cycling between -40°C and 85°C.
What are the I2C integration challenges with the MTCH6301-I/ML when shared on a bus with other senso
The MTCH6301-I/ML uses a fixed I2C address, increasing the risk of bus collisions in multi-sensor designs. If sharing the bus with devices like the BME280 or Si7021, isolate the MTCH6301-I/ML on a dedicated I2C line or use an I2C multiplexer (e.g., PCA9548A) to avoid address contention. The device employs clock stretching during touch processing, which can cause timeouts on microcontrollers with short I2C hold-time tolerances (e.g., some STM32 variants). To prevent communication failures, extend MCU I2C timeout periods, use pull-up resistors of 2.2kΩ–4.7kΩ (optimized for 3.3V), and buffer SDA/SCL lines with 100Ω series resistors to dampen ringing in dense layouts.
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Sep 15 2026
