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MAX4373HESA-T

Electronics Part Number

MAX4373HESA-T-WX
MAX4373HESA-T

Description

IC with amplifier, comparator and reference in 8SOIC package.

Inventory

986 Pcs New Original In Stock
"Pkg: 8-uMAX/uSOP; Elec: multi-function analog IC; Func: current measurement; App: industrial power.",
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Basic cost: USD 70.00

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Technical Specifications

Category Clock/Timing, Delay Lines

Manufacturer Analog Devices, Inc.

Packaging Tube

Operating Temperature -40°C ~ 85°C

Mounting Type Surface Mount

Package / Case 14-TSSOP (0.173", 4.40mm Width)

Series -

Base Product Number DS1110

Product Status Active

Voltage - Supply 2.7V ~ 3.6V

Function Nonprogrammable

Supplier Device Package 14-TSSOP

Number of Taps/Steps 10

Delay to 1st Tap 10ns

Tap Increment 10 ns

Available Total Delays 100ns

Number of Independent Delays 1

Data Sheet Document (D)

Datasheets Download DS1110LE-100+ Product Specification (PDF)

HTML Datasheet DS1110LE-100+-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant

Moisture Sensitivity Level (MSL) 1 (Unlimited)

REACH Status REACH Unaffected

ECCN EAR99

HTSUS 8542.39.0001

Additional Information

Other Names DS1110LE100 -4941-DS1110LE-100+

Standard Package 96

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Frequently Asked Questions (FAQ)

FAQ Icon

What are the key design-in risks when using the DS1110LE-100+ in a high-temperature industrial envir

When designing the DS1110LE-100+ into systems operating near 85°C, thermal drift in delay accuracy becomes a concern despite its specified temperature range. Although the DS1110LE-100+ is rated for -40°C to 85°C, parasitic PCB heating or ambient convection can cause localized temperature rise beyond ambient, potentially affecting timing margins. To mitigate this, ensure adequate PCB copper heat sinking, avoid placing near high-power components, and validate timing performance under worst-case thermal conditions. Additionally, monitor long-term reliability as repeated thermal cycling near maximum ratings may accelerate aging in sensitive analog delay paths.
FAQ Icon

Can the DS1110LE-100+ be used as a direct replacement for the IDT5V90E100LGI8 in a 3.3V timing delay

The DS1110LE-100+ cannot be used as a direct drop-in replacement for the IDT5V90E100LGI8 due to key voltage and functional differences. The DS1110LE-100+ operates at 2.7V to 3.6V, while the IDT part is designed for 5V systems, risking under-voltage malfunction if substituted without a level-shifting or regulator update. Additionally, the IDT device offers different tap configurations and drive strength. Successful replacement requires signal integrity analysis, verification of load compatibility, and ensuring the 10ns fixed increments of the DS1110LE-100+ meet the original timing alignment requirements.
FAQ Icon

How does the fixed 10ns tap increment of the DS1110LE-100+ impact its suitability for high-precision

The DS1110LE-100+’s fixed 10ns tap increments limit fine-grained timing adjustment in high-precision ADC synchronization, where sub-10ns alignment is often required for optimal SNR and phase coherence. If your ADC front-end demands delays like 12ns or 27ns, the DS1110LE-100+ can only approximate (e.g., 10ns or 30ns), potentially introducing aperture timing errors. Use this device in applications where alignment tolerances exceed ±5ns; otherwise, consider programmable delay lines like the AD9523-1 or digital delay ICs for finer control. Always simulate propagation skew across voltage and temperature corners.
FAQ Icon

What PCB layout practices minimize signal integrity risks when integrating the DS1110LE-100+ in high

To maintain signal integrity with the DS1110LE-100+, treat all tap outputs and input lines as controlled-impedance traces, especially since uneven trace lengths can compound the IC’s internal delays. Use continuous ground planes, minimize vias on signal paths, and keep trace lengths from taps to loads as short and consistent as possible to prevent skew. Decouple the VCC pin with a 0.1µF ceramic capacitor placed within 5mm of the device. Also, avoid routing sensitive delay lines adjacent to switching signals to reduce crosstalk, as the DS1110LE-100+ has no shielding between internal taps.
FAQ Icon

What long-term reliability concerns should be considered when using the DS1110LE-100+ in automotive

While the DS1110LE-100+ meets the industrial temperature range (-40°C to 85°C), it is not AEC-Q100 qualified, posing reliability risks in automotive under-hood environments subject to harsh vibrations, humidity, and thermal cycling beyond 85°C. Prolonged exposure to such conditions may lead to wire bond fatigue or moisture ingress, even with MSL1 rating. For safety-critical or high-reliability automotive designs, prefer AEC-Q100-compliant alternatives like the TPD2S514-Q1 or consider over-spec’ing with a wider-temperature programmable delay IC. If using DS1110LE-100+, conduct extended environmental stress testing and conformal coating.
FAQ Icon

What are the key design-in risks when using the DS1110LE-100+ in a high-temperature industrial envir

When designing the DS1110LE-100+ into systems operating near 85°C, thermal drift in delay accuracy becomes a concern despite its specified temperature range. Although the DS1110LE-100+ is rated for -40°C to 85°C, parasitic PCB heating or ambient convection can cause localized temperature rise beyond ambient, potentially affecting timing margins. To mitigate this, ensure adequate PCB copper heat sinking, avoid placing near high-power components, and validate timing performance under worst-case thermal conditions. Additionally, monitor long-term reliability as repeated thermal cycling near maximum ratings may accelerate aging in sensitive analog delay paths.
FAQ Icon

Can the DS1110LE-100+ be used as a direct replacement for the IDT5V90E100LGI8 in a 3.3V timing delay

The DS1110LE-100+ cannot be used as a direct drop-in replacement for the IDT5V90E100LGI8 due to key voltage and functional differences. The DS1110LE-100+ operates at 2.7V to 3.6V, while the IDT part is designed for 5V systems, risking under-voltage malfunction if substituted without a level-shifting or regulator update. Additionally, the IDT device offers different tap configurations and drive strength. Successful replacement requires signal integrity analysis, verification of load compatibility, and ensuring the 10ns fixed increments of the DS1110LE-100+ meet the original timing alignment requirements.
FAQ Icon

How does the fixed 10ns tap increment of the DS1110LE-100+ impact its suitability for high-precision

The DS1110LE-100+’s fixed 10ns tap increments limit fine-grained timing adjustment in high-precision ADC synchronization, where sub-10ns alignment is often required for optimal SNR and phase coherence. If your ADC front-end demands delays like 12ns or 27ns, the DS1110LE-100+ can only approximate (e.g., 10ns or 30ns), potentially introducing aperture timing errors. Use this device in applications where alignment tolerances exceed ±5ns; otherwise, consider programmable delay lines like the AD9523-1 or digital delay ICs for finer control. Always simulate propagation skew across voltage and temperature corners.
FAQ Icon

What PCB layout practices minimize signal integrity risks when integrating the DS1110LE-100+ in high

To maintain signal integrity with the DS1110LE-100+, treat all tap outputs and input lines as controlled-impedance traces, especially since uneven trace lengths can compound the IC’s internal delays. Use continuous ground planes, minimize vias on signal paths, and keep trace lengths from taps to loads as short and consistent as possible to prevent skew. Decouple the VCC pin with a 0.1µF ceramic capacitor placed within 5mm of the device. Also, avoid routing sensitive delay lines adjacent to switching signals to reduce crosstalk, as the DS1110LE-100+ has no shielding between internal taps.
FAQ Icon

What long-term reliability concerns should be considered when using the DS1110LE-100+ in automotive

While the DS1110LE-100+ meets the industrial temperature range (-40°C to 85°C), it is not AEC-Q100 qualified, posing reliability risks in automotive under-hood environments subject to harsh vibrations, humidity, and thermal cycling beyond 85°C. Prolonged exposure to such conditions may lead to wire bond fatigue or moisture ingress, even with MSL1 rating. For safety-critical or high-reliability automotive designs, prefer AEC-Q100-compliant alternatives like the TPD2S514-Q1 or consider over-spec’ing with a wider-temperature programmable delay IC. If using DS1110LE-100+, conduct extended environmental stress testing and conformal coating.

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