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MAX4053ACEE+
Electronics Part Number
MAX4053ACEE+-WXManufacturer
onsemi
MAX4053ACEE+
Description
Triple SPDT Analog Switch IC, 100 Ohm, 16-QSOPInventory
590 Pcs New Original In Stock
16-QSOP analog switch, triple 2:1, 100Ω; low charge injection, fast switching, for audio/video signal routing and multiplexed ADCs.
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Technical Specifications
Category
Logic, Latches
Manufacturer
onsemi
Packaging
-
Operating Temperature
-40°C ~ 85°C
Mounting Type
Through Hole
Package / Case
16-DIP (0.300", 7.62mm)
Series
74HC
Base Product Number
74HC259
Product Status
Obsolete
Output Type
Standard
Voltage - Supply
2V ~ 6V
Supplier Device Package
16-PDIP
Circuit
1:8
Current - Output High, Low
5.2mA, 5.2mA
Logic Type
D-Type, Addressable
Independent Circuits
1
Delay Time - Propagation
17ns
Data Sheet Document (D)
Datasheets
Download MM74HC259N Product Specification (PDF)
HTML Datasheet
MM74HC259N-DG
Environmental & Export Classification
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
74HC259 MM74HC259N-NDR
Standard Package
25
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Frequently Asked Questions (FAQ)
What are the key risks when replacing the obsolete MM74HC259N with a modern equivalent like the SN74
The primary risk when substituting the MM74HC259N with the SN74HC259N lies in subtle timing and loading differences despite similar datasheet specs. While both are 1:8 addressable D-type latches in 16-DIP packages, the SN74HC259N from Texas Instruments may exhibit slightly different propagation delay skew across outputs under capacitive loads common in long backplane designs. Always validate signal integrity with an oscilloscope at the farthest load, especially if your system operates near the 17ns propagation limit. Additionally, confirm that the replacement’s output current capability (5.2mA) meets your fan-out requirements—adding a buffer may be necessary if driving multiple TTL inputs.
Can the MM74HC259N be safely used in a 5V automotive application with temperature swings from -30°C
No, operating the MM74HC259N above 85°C violates its absolute maximum rating and significantly increases the risk of thermal runaway or premature failure, even if short-term exposure seems functional. Automotive under-hood environments often exceed 85°C, especially near engine compartments. For reliable operation, either implement active cooling to keep the IC below 85°C or migrate to an automotive-qualified alternative like the AEC-Q100 compliant NC7WZ259P6X (in a smaller package, requiring board rework). Ignoring this derating can lead to latent field failures and void warranty claims.
How does the MM74HC259N compare to the CD74HC259E in terms of noise immunity and ground bounce in hi
While both the MM74HC259N (onsemi) and CD74HC259E (TI) share identical logic functions and pinouts, the CD74HC259E typically exhibits marginally better ground bounce performance due to tighter internal layout control and lower simultaneous switching noise (SSN). In systems with dense clocking or multiple parallel latches, this can reduce crosstalk and improve timing margin. However, the MM74HC259N’s MSL-1 rating gives it an edge in humid environments without requiring bake-out before assembly. Choose the CD74HC259E for high-speed (>20MHz) designs; stick with the MM74HC259N for cost-sensitive or high-humidity applications where speed is moderate.
Is it safe to hot-swap or dynamically reconfigure the address lines on the MM74HC259N during system
Dynamic address line changes on the MM74HC259N are permissible but require careful sequencing to avoid intermediate states that cause multiple outputs to briefly activate—this can create shoot-through currents in downstream drivers or bus contention. To mitigate risk, ensure address transitions occur only when the LE (Latch Enable) pin is held high (latch disabled), then strobe LE low after stabilization. Also, add 100–330Ω series resistors on address inputs to dampen reflections and reduce EMI. Never leave address lines floating; use pull-up/down resistors to define default states during power-up or reset.
What design precautions are needed when using the MM74HC259N in a mixed-voltage system where its 6V
Although the MM74HC259N accepts 2V–6V supply, its input high threshold (typically 3.5V at 5V VCC) may not be reliably driven by 3.3V logic. This can cause metastability or increased power consumption. Use a level shifter (e.g., TXB0108) or ensure your 3.3V MCU outputs meet VIH specs under load—some 3.3V CMOS devices barely reach 2.3V high, which is insufficient. Alternatively, power the MM74HC259N at 3.3V (within its range) to align logic thresholds, but verify output drive strength meets your load requirements. Always include decoupling capacitors (100nF ceramic per IC) close to VCC/GND to suppress transients during switching.
What are the key risks when replacing the obsolete MM74HC259N with a modern equivalent like the SN74
The primary risk when substituting the MM74HC259N with the SN74HC259N lies in subtle timing and loading differences despite similar datasheet specs. While both are 1:8 addressable D-type latches in 16-DIP packages, the SN74HC259N from Texas Instruments may exhibit slightly different propagation delay skew across outputs under capacitive loads common in long backplane designs. Always validate signal integrity with an oscilloscope at the farthest load, especially if your system operates near the 17ns propagation limit. Additionally, confirm that the replacement’s output current capability (5.2mA) meets your fan-out requirements—adding a buffer may be necessary if driving multiple TTL inputs.
Can the MM74HC259N be safely used in a 5V automotive application with temperature swings from -30°C
No, operating the MM74HC259N above 85°C violates its absolute maximum rating and significantly increases the risk of thermal runaway or premature failure, even if short-term exposure seems functional. Automotive under-hood environments often exceed 85°C, especially near engine compartments. For reliable operation, either implement active cooling to keep the IC below 85°C or migrate to an automotive-qualified alternative like the AEC-Q100 compliant NC7WZ259P6X (in a smaller package, requiring board rework). Ignoring this derating can lead to latent field failures and void warranty claims.
How does the MM74HC259N compare to the CD74HC259E in terms of noise immunity and ground bounce in hi
While both the MM74HC259N (onsemi) and CD74HC259E (TI) share identical logic functions and pinouts, the CD74HC259E typically exhibits marginally better ground bounce performance due to tighter internal layout control and lower simultaneous switching noise (SSN). In systems with dense clocking or multiple parallel latches, this can reduce crosstalk and improve timing margin. However, the MM74HC259N’s MSL-1 rating gives it an edge in humid environments without requiring bake-out before assembly. Choose the CD74HC259E for high-speed (>20MHz) designs; stick with the MM74HC259N for cost-sensitive or high-humidity applications where speed is moderate.
Is it safe to hot-swap or dynamically reconfigure the address lines on the MM74HC259N during system
Dynamic address line changes on the MM74HC259N are permissible but require careful sequencing to avoid intermediate states that cause multiple outputs to briefly activate—this can create shoot-through currents in downstream drivers or bus contention. To mitigate risk, ensure address transitions occur only when the LE (Latch Enable) pin is held high (latch disabled), then strobe LE low after stabilization. Also, add 100–330Ω series resistors on address inputs to dampen reflections and reduce EMI. Never leave address lines floating; use pull-up/down resistors to define default states during power-up or reset.
What design precautions are needed when using the MM74HC259N in a mixed-voltage system where its 6V
Although the MM74HC259N accepts 2V–6V supply, its input high threshold (typically 3.5V at 5V VCC) may not be reliably driven by 3.3V logic. This can cause metastability or increased power consumption. Use a level shifter (e.g., TXB0108) or ensure your 3.3V MCU outputs meet VIH specs under load—some 3.3V CMOS devices barely reach 2.3V high, which is insufficient. Alternatively, power the MM74HC259N at 3.3V (within its range) to align logic thresholds, but verify output drive strength meets your load requirements. Always include decoupling capacitors (100nF ceramic per IC) close to VCC/GND to suppress transients during switching.
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Sep 15 2026
