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MAX4052EEE+T
Electronics Part Number
MAX4052EEE+T-WXManufacturer
onsemi
MAX4052EEE+T
Description
Dual SP4T Analog Switch, 100 Ohm, 16-Lead QSOPInventory
382 Pcs New Original In Stock
Dual 4:1 analog switch in 16-QSOP, 100Ω; TTL control, rail-to-rail operation for portable devices and battery circuits.
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Basic cost: USD 70.00
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Technical Specifications
Category
Logic, Latches
Manufacturer
onsemi
Packaging
-
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-SOIC (0.154", 3.90mm Width)
Series
74HC
Base Product Number
74HC259
Product Status
Obsolete
Output Type
Standard
Voltage - Supply
2V ~ 6V
Supplier Device Package
16-SOIC
Circuit
1:8
Current - Output High, Low
5.2mA, 5.2mA
Logic Type
D-Type, Addressable
Independent Circuits
1
Delay Time - Propagation
17ns
Data Sheet Document (D)
Datasheets
Download MM74HC259MX Product Specification (PDF)
HTML Datasheet
MM74HC259MX-DG
Environmental & Export Classification
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
MM74HC259MXTR MM74HC259MX-DG MM74HC259MXCT MM74HC259MXDKR
Standard Package
2,500
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Frequently Asked Questions (FAQ)
Can I use the MM74HC259MX in a new design given its obsolete status, and what are the long-term risk
The MM74HC259MX is listed as obsolete, meaning onsemi no longer manufactures it, which poses significant supply chain risks for high-volume or long-lifecycle designs. While 2600 units are in stock, relying on this part for new designs risks future unavailability. For production scalability, consider migrating to active equivalents like the SN74HC259D from Texas Instruments, or evaluate newer addressable latch ICs with second-source availability. If using MM74HC259MX temporarily, secure lifetime buys and qualify drop-in replacements early to mitigate obsolescence risks in your BOM.
How do I ensure stable output current performance when driving multiple TTL loads with the MM74HC259
The MM74HC259MX guarantees 5.2mA drive strength per output at 4.5V and 6V, but output current drops significantly at 3.3V, potentially leading to signal integrity issues under heavy TTL loading. To ensure stable performance, verify that total load per output stays below 3mA at 3.3V using actual VCC and temperature conditions. Use series resistors to limit current and avoid bus contention. For higher fan-out needs, buffer outputs with a 74LVC series driver or consider the NLVHC259ADR2G, which offers better low-voltage performance and is actively recommended as a substitute.
What are the key timing design-in challenges with the MM74HC259MX when interfacing with microcontrol
When interfacing the MM74HC259MX with a 20MHz microcontroller, the 17ns propagation delay is generally sufficient, but signal setup and hold times are critical—especially for the address and data lines. Ensure your MCU provides at least 10ns setup time for data and address inputs relative to the latch enable. Avoid routing address lines with excessive capacitance, and minimize clock skew between control signals. Use series termination (22–33Ω) if traces exceed 2 inches to prevent ringing. Also, monitor VCC decoupling: place a 0.1µF ceramic capacitor near the VDD pin to maintain timing integrity under dynamic switching.
Is the MM74HC259MX interchangeable with the SN74HC259NSR without design modifications, and what comp
The MM74HC259MX and SN74HC259NSR are functionally equivalent 8-bit addressable latches with matching pinouts and specifications, making them largely interchangeable in most applications. However, minor differences in input threshold levels, ESD protection, and output drive behavior under low VCC may affect reliability in marginal designs. Ensure both parts are rated for your supply voltage range (2V–6V) and verify timing margins on control signals, especially when sharing buses. Also, confirm moisture sensitivity and packaging differences—SN74HC259NSR is also obsolete, so both should be avoided in new production designs.
What PCB layout and thermal considerations should I address when integrating the MM74HC259MX in a hi
In high-density layouts, the 16-SOIC package of the MM74HC259MX is sensitive to thermal and electrical crosstalk. Maintain at least 0.3mm trace spacing to adjacent high-speed signals and use ground planes to reduce noise coupling. Avoid routing switching signals under the device. While the MM74HC259MX has low power dissipation, ensure adequate copper pour on VDD and GND traces to handle peak current during output transitions—especially if all 8 outputs switch simultaneously. In industrial environments (-40°C to 85°C), confirm that your PCB material (e.g., FR4) supports the full temperature range, and avoid vias in pad for reliable solder joints during thermal cycling.
Can I use the MM74HC259MX in a new design given its obsolete status, and what are the long-term risk
The MM74HC259MX is listed as obsolete, meaning onsemi no longer manufactures it, which poses significant supply chain risks for high-volume or long-lifecycle designs. While 2600 units are in stock, relying on this part for new designs risks future unavailability. For production scalability, consider migrating to active equivalents like the SN74HC259D from Texas Instruments, or evaluate newer addressable latch ICs with second-source availability. If using MM74HC259MX temporarily, secure lifetime buys and qualify drop-in replacements early to mitigate obsolescence risks in your BOM.
How do I ensure stable output current performance when driving multiple TTL loads with the MM74HC259
The MM74HC259MX guarantees 5.2mA drive strength per output at 4.5V and 6V, but output current drops significantly at 3.3V, potentially leading to signal integrity issues under heavy TTL loading. To ensure stable performance, verify that total load per output stays below 3mA at 3.3V using actual VCC and temperature conditions. Use series resistors to limit current and avoid bus contention. For higher fan-out needs, buffer outputs with a 74LVC series driver or consider the NLVHC259ADR2G, which offers better low-voltage performance and is actively recommended as a substitute.
What are the key timing design-in challenges with the MM74HC259MX when interfacing with microcontrol
When interfacing the MM74HC259MX with a 20MHz microcontroller, the 17ns propagation delay is generally sufficient, but signal setup and hold times are critical—especially for the address and data lines. Ensure your MCU provides at least 10ns setup time for data and address inputs relative to the latch enable. Avoid routing address lines with excessive capacitance, and minimize clock skew between control signals. Use series termination (22–33Ω) if traces exceed 2 inches to prevent ringing. Also, monitor VCC decoupling: place a 0.1µF ceramic capacitor near the VDD pin to maintain timing integrity under dynamic switching.
Is the MM74HC259MX interchangeable with the SN74HC259NSR without design modifications, and what comp
The MM74HC259MX and SN74HC259NSR are functionally equivalent 8-bit addressable latches with matching pinouts and specifications, making them largely interchangeable in most applications. However, minor differences in input threshold levels, ESD protection, and output drive behavior under low VCC may affect reliability in marginal designs. Ensure both parts are rated for your supply voltage range (2V–6V) and verify timing margins on control signals, especially when sharing buses. Also, confirm moisture sensitivity and packaging differences—SN74HC259NSR is also obsolete, so both should be avoided in new production designs.
What PCB layout and thermal considerations should I address when integrating the MM74HC259MX in a hi
In high-density layouts, the 16-SOIC package of the MM74HC259MX is sensitive to thermal and electrical crosstalk. Maintain at least 0.3mm trace spacing to adjacent high-speed signals and use ground planes to reduce noise coupling. Avoid routing switching signals under the device. While the MM74HC259MX has low power dissipation, ensure adequate copper pour on VDD and GND traces to handle peak current during output transitions—especially if all 8 outputs switch simultaneously. In industrial environments (-40°C to 85°C), confirm that your PCB material (e.g., FR4) supports the full temperature range, and avoid vias in pad for reliable solder joints during thermal cycling.
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Sep 15 2026
