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MAL222531001E3
Electronics Part Number
MAL222531001E3-WXManufacturer
TE Connectivity Potter & Brumfield Relays
MAL222531001E3
Description
Aluminum Electrolytic Capacitor, 40F, 2.7V, 2000hInventory
530 Pcs New Original In Stock
40F EDLC supercapacitor, 2.7V, radial can, 12mΩ@1kHz, 2000h@85°C.
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Basic cost: USD 70.00
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Technical Specifications
Category
Signal Relays, Up to 2 Amps
Manufacturer
TE Connectivity Potter & Brumfield Relays
Packaging
Cut Tape (CT) & Digi-Reel®
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Series
IM, AXICOM
Features
-
Base Product Number
1462037
Product Status
Active
Contact Material
Palladium (Pd), Ruthenium (Ru), Gold (Au)
Termination Style
Gull Wing
Operate Time
3 ms
Release Time
3 ms
Contact Form
DPDT (2 Form C)
Coil Voltage
3VDC
Contact Rating (Current)
2 A
Switching Voltage
250VAC, 220VDC - Max
Coil Current
46.7 mA
Coil Type
Non Latching
Seal Rating
Sealed - Hermetically
Coil Insulation
-
Must Operate Voltage
2.25 VDC
Must Release Voltage
0.3 VDC
Relay Type
Telecom
Coil Resistance
64 Ohms
Data Sheet Document (D)
Datasheets
Download IM01GR Product Specification (PDF)
HTML Datasheet
IM01GR-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.41.0020
Additional Information
Other Names
Q8584640A PB1060-DG 2266-IM01GRTR IM01GR-DG PB1060CT -IM01GR=IM RELAY 14-CSI -IM01GR=IM RELAY 14-SI-DG 1462037-1 -IM01GR=IMRELAY14-CSI -IM01GR=IM RELAY 14-SI PB1060 -IM01GR-SI PB1060DKR PB1060TR -IM01GR=IM RELAY 14-CSI-DG
Standard Package
1,000
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Frequently Asked Questions (FAQ)
What are the key design-in risks when using the IM01GR telecom relay in a power-constrained 3.3V emb
When integrating the IM01GR into a 3.3V embedded design, ensure your supply remains above the 2.25V must-operate threshold under load, especially during brown-out conditions. Since the IM01GR draws 46.7 mA at 3VDC, verify your regulator or MCU GPIO can sustain this without voltage droop. Use a local 10µF decoupling capacitor near the coil pins to stabilize transient current spikes. Also, the gull wing termination requires precise reflow profiling (per MSL3 limits) to avoid tombstoning—consider placement near board center to reduce thermal gradients. The hermetic seal enables use in harsh environments but increases thermal mass, affecting solder joint reliability during repeated thermal cycling.
Can I replace a failing TXS2-5V relay with the IM01GR in an existing telecom switching board, and wh
Replacing a TXS2-5V (5V-coil) relay with the IM01GR (3V-coil) introduces a voltage mismatch that requires level-shifting. Driving the IM01GR directly from a 5V logic signal risks damaging the coil unless buffered with a series resistor or MOSFET driver. Calculate a series resistor (e.g., ~43Ω) to drop 2V at 46.7mA, ensuring power dissipation is managed. Also, verify that the contact configuration (DPDT) and switching ratings (2A, 250VAC) match your load—while both relays are telecom-grade, the IM01GR’s lower coil voltage may require redesign of the driver stage. Confirm PCB footprint compatibility, as gull-wing pitches can differ.
How does the IM01GR's palladium-ruthenium-gold contact material affect reliability in low-voltage si
The IM01GR’s Pd-Ru-Au contact alloy offers superior resistance to oxidation and contact degradation under low-load, dry-circuit conditions common in telecom signal routing. Unlike silver-based contacts (e.g., in CDR2D series relays), which can form insulating sulfide layers, the noble metal plating ensures stable contact resistance over 100k+ cycles even with low-current signals (<100mA). However, this comes with reduced resistance to high inrush currents—avoid using the IM01GR for loads exceeding 2A or with highly inductive kickback without external suppression. Use transient clamping (e.g., TVS diode across contacts) when switching capacitive or mixed analog/digital signals.
What thermal and mechanical stress risks should I mitigate when mounting the IM01GR on high-vibratio
While the IM01GR’s hermetic seal enhances reliability in humid or corrosive environments, its ceramic package is more brittle than plastic-molded relays and susceptible to cracking under mechanical shock. In high-vibration applications—such as outdoor telecom enclosures—use conformal coating and avoid placing the IM01GR near board edges. The 64Ω coil has low thermal mass but generates localized heat during continuous operation; ensure at least 2mm clearance around the relay for thermal dissipation. Also, verify that reflow soldering adheres to MSL3 (168-hour floor life) to prevent 'popcorning' during assembly. Consider underfill for added mechanical stability in mobile or industrial vibration environments.
How does the IM01GR compare to the Panasonic DS2E3-S-DC3V in terms of switching speed and coil effic
Both the IM01GR and DS2E3-S-DC3V are DPDT SMT telecom relays rated for 3VDC coils, but key differences impact dense, power-sensitive designs. The IM01GR offers faster operate and release times (3ms each) vs. DS2E3-S-DC3V’s 5ms/5ms, beneficial in time-critical signal routing. However, the DS2E3-S-DC3V draws slightly less coil current (42mA vs. 46.7mA), improving power efficiency in battery-backed systems. The IM01GR’s hermetic seal provides better long-term reliability in fluctuating environments, whereas the DS2E3-S series uses a sealed but non-hermetic epoxy. Choose IM01GR when speed and environmental robustness are critical; opt for DS2E3-S-DC3V where power budget is tighter and operating conditions are stable.
What are the key design-in risks when using the IM01GR telecom relay in a power-constrained 3.3V emb
When integrating the IM01GR into a 3.3V embedded design, ensure your supply remains above the 2.25V must-operate threshold under load, especially during brown-out conditions. Since the IM01GR draws 46.7 mA at 3VDC, verify your regulator or MCU GPIO can sustain this without voltage droop. Use a local 10µF decoupling capacitor near the coil pins to stabilize transient current spikes. Also, the gull wing termination requires precise reflow profiling (per MSL3 limits) to avoid tombstoning—consider placement near board center to reduce thermal gradients. The hermetic seal enables use in harsh environments but increases thermal mass, affecting solder joint reliability during repeated thermal cycling.
Can I replace a failing TXS2-5V relay with the IM01GR in an existing telecom switching board, and wh
Replacing a TXS2-5V (5V-coil) relay with the IM01GR (3V-coil) introduces a voltage mismatch that requires level-shifting. Driving the IM01GR directly from a 5V logic signal risks damaging the coil unless buffered with a series resistor or MOSFET driver. Calculate a series resistor (e.g., ~43Ω) to drop 2V at 46.7mA, ensuring power dissipation is managed. Also, verify that the contact configuration (DPDT) and switching ratings (2A, 250VAC) match your load—while both relays are telecom-grade, the IM01GR’s lower coil voltage may require redesign of the driver stage. Confirm PCB footprint compatibility, as gull-wing pitches can differ.
How does the IM01GR's palladium-ruthenium-gold contact material affect reliability in low-voltage si
The IM01GR’s Pd-Ru-Au contact alloy offers superior resistance to oxidation and contact degradation under low-load, dry-circuit conditions common in telecom signal routing. Unlike silver-based contacts (e.g., in CDR2D series relays), which can form insulating sulfide layers, the noble metal plating ensures stable contact resistance over 100k+ cycles even with low-current signals (<100mA). However, this comes with reduced resistance to high inrush currents—avoid using the IM01GR for loads exceeding 2A or with highly inductive kickback without external suppression. Use transient clamping (e.g., TVS diode across contacts) when switching capacitive or mixed analog/digital signals.
What thermal and mechanical stress risks should I mitigate when mounting the IM01GR on high-vibratio
While the IM01GR’s hermetic seal enhances reliability in humid or corrosive environments, its ceramic package is more brittle than plastic-molded relays and susceptible to cracking under mechanical shock. In high-vibration applications—such as outdoor telecom enclosures—use conformal coating and avoid placing the IM01GR near board edges. The 64Ω coil has low thermal mass but generates localized heat during continuous operation; ensure at least 2mm clearance around the relay for thermal dissipation. Also, verify that reflow soldering adheres to MSL3 (168-hour floor life) to prevent 'popcorning' during assembly. Consider underfill for added mechanical stability in mobile or industrial vibration environments.
How does the IM01GR compare to the Panasonic DS2E3-S-DC3V in terms of switching speed and coil effic
Both the IM01GR and DS2E3-S-DC3V are DPDT SMT telecom relays rated for 3VDC coils, but key differences impact dense, power-sensitive designs. The IM01GR offers faster operate and release times (3ms each) vs. DS2E3-S-DC3V’s 5ms/5ms, beneficial in time-critical signal routing. However, the DS2E3-S-DC3V draws slightly less coil current (42mA vs. 46.7mA), improving power efficiency in battery-backed systems. The IM01GR’s hermetic seal provides better long-term reliability in fluctuating environments, whereas the DS2E3-S series uses a sealed but non-hermetic epoxy. Choose IM01GR when speed and environmental robustness are critical; opt for DS2E3-S-DC3V where power budget is tighter and operating conditions are stable.
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Sep 15 2026
