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LTC2311IMSE-14#WPBF
Electronics Part Number
LTC2311IMSE-14#WPBF-WXManufacturer
Texas Instruments
LTC2311IMSE-14#WPBF
Description
14-Bit + Sign 5MSPS Differential In ADC, WideInventory
677 Pcs New Original In Stock
16-MSOP-EP; 14-bit SAR ADC; 1 input 1 SAR.
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Minimum 1
Minimum 1
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Basic cost: USD 70.00
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Technical Specifications
Category
Interface, UARTs (Universal Asynchronous Receiver Transmitter)
Manufacturer
Texas Instruments
Packaging
Tape & Reel (TR)
Mounting Type
Surface Mount
Package / Case
48-TQFP
Series
-
Features
-
Base Product Number
TL16C752
Product Status
Active
Number of Channels
2, DUART
Voltage - Supply
1.62V ~ 5.5V
Supplier Device Package
48-TQFP (7x7)
Data Rate (Max)
3Mbps
Protocol
RS485
FIFO's
64 Byte
With Auto Flow Control
Yes
With IrDA Encoder/Decoder
Yes
With False Start Bit Detection
Yes
With Modem Control
Yes
Data Sheet Document (D)
Datasheets
Download TL16C752CIPFBR Product Specification (PDF)
HTML Datasheet
TL16C752CIPFBR-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
2 (1 Year)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Standard Package
1,000
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Frequently Asked Questions (FAQ)
Can the TL16C752CIPFBR be safely used in a 3.3V system with 5V-tolerant inputs when interfacing with
The TL16C752CIPFBR operates from 1.62V to 5.5V, making it compatible with 3.3V logic, but its I/O pins are not 5V-tolerant when the device is powered at 3.3V. If interfacing with 5V RS485 transceivers (e.g., SN65HVD72), a level-shifting circuit or voltage clamp (such as a Zener diode or dedicated level translator like TXB0108) is required to prevent damage during hot-plug or power sequencing mismatches. Without protection, exceeding the absolute maximum input voltage can degrade the ESD structures over time, leading to latent failures—especially in industrial environments with frequent cable connections.
How does the TL16C752CIPFBR compare to the XR68M752IM48TR-F in terms of FIFO management and auto-flo
While both the TL16C752CIPFBR and XR68M752IM48TR-F offer 64-byte FIFOs and auto-flow control, the TI device provides more deterministic FIFO threshold interrupts and better false start bit detection, which reduces framing errors in electrically noisy RS485 environments. The Exar (now MaxLinear) part may exhibit slightly higher latency in RTS deassertion during back-to-back transmissions, increasing collision risk in dense multi-drop setups. For mission-critical industrial communication, the TL16C752CIPFBR’s tighter timing control and integrated modem control signals offer superior reliability, though the XR68M752IM48TR-F may be preferred in cost-sensitive designs with lighter traffic loads.
What design precautions are necessary when replacing a failed TL16C752CIPFBR in an existing 5V syste
When replacing the TL16C752CIPFBR in a mixed-voltage system, ensure the new IC’s supply voltage matches the original design intent. If the replacement operates at 5V but drives a 3.3V MCU, use series resistors (e.g., 220Ω) on TX lines and verify that the MCU’s input high voltage (VIH) threshold is met. Alternatively, power the TL16C752CIPFBR at 3.3V if the RS485 transceiver supports it, to eliminate level-shifting needs. Always validate signal integrity with an oscilloscope during power-up sequences, as floating inputs on unpowered MCUs can cause parasitic conduction through protection diodes, leading to bus contention or excessive current draw.
Is the TL16C752CIPFBR suitable for battery-powered field devices requiring ultra-low sleep current,
The standard TL16C752CIPFBR is not optimized for ultra-low-power applications; its shutdown current is typically 10µA, which may be excessive for multi-year battery-operated field sensors. In contrast, the TL16C752CIPFBRQ1 (AEC-Q100 qualified) has similar quiescent current but includes enhanced electrostatic discharge (ESD) protection and wider temperature stability—making it overkill for non-automotive use. For battery-powered designs, consider instead the XR16L2750IM-F, which offers sub-1µA sleep current and programmable wake-up interrupts. If using the TL16C752CIPFBR, minimize power by disabling unused channels via software and gating the clock source during idle periods.
What are the thermal and layout risks when mounting the TL16C752CIPFBR in a compact 48-TQFP package
The 7x7mm 48-TQFP package of the TL16C752CIPFBR has limited thermal dissipation, and placing it near switching regulators (e.g., buck converters) can cause localized heating that shifts UART timing margins, especially at 3Mbps data rates. Maintain a 5mm clearance from high-di/dt traces and use a solid ground plane beneath the IC to act as a heat spreader. Route UART differential pairs (TX/RX) as impedance-controlled traces with minimal vias, and isolate them from digital noise sources using guard traces tied to ground. Additionally, place decoupling capacitors (100nF + 1µF) within 2mm of each VCC pin to suppress high-frequency noise that could corrupt FIFO operations or auto-flow control signaling.
Can the TL16C752CIPFBR be safely used in a 3.3V system with 5V-tolerant inputs when interfacing with
The TL16C752CIPFBR operates from 1.62V to 5.5V, making it compatible with 3.3V logic, but its I/O pins are not 5V-tolerant when the device is powered at 3.3V. If interfacing with 5V RS485 transceivers (e.g., SN65HVD72), a level-shifting circuit or voltage clamp (such as a Zener diode or dedicated level translator like TXB0108) is required to prevent damage during hot-plug or power sequencing mismatches. Without protection, exceeding the absolute maximum input voltage can degrade the ESD structures over time, leading to latent failures—especially in industrial environments with frequent cable connections.
How does the TL16C752CIPFBR compare to the XR68M752IM48TR-F in terms of FIFO management and auto-flo
While both the TL16C752CIPFBR and XR68M752IM48TR-F offer 64-byte FIFOs and auto-flow control, the TI device provides more deterministic FIFO threshold interrupts and better false start bit detection, which reduces framing errors in electrically noisy RS485 environments. The Exar (now MaxLinear) part may exhibit slightly higher latency in RTS deassertion during back-to-back transmissions, increasing collision risk in dense multi-drop setups. For mission-critical industrial communication, the TL16C752CIPFBR’s tighter timing control and integrated modem control signals offer superior reliability, though the XR68M752IM48TR-F may be preferred in cost-sensitive designs with lighter traffic loads.
What design precautions are necessary when replacing a failed TL16C752CIPFBR in an existing 5V syste
When replacing the TL16C752CIPFBR in a mixed-voltage system, ensure the new IC’s supply voltage matches the original design intent. If the replacement operates at 5V but drives a 3.3V MCU, use series resistors (e.g., 220Ω) on TX lines and verify that the MCU’s input high voltage (VIH) threshold is met. Alternatively, power the TL16C752CIPFBR at 3.3V if the RS485 transceiver supports it, to eliminate level-shifting needs. Always validate signal integrity with an oscilloscope during power-up sequences, as floating inputs on unpowered MCUs can cause parasitic conduction through protection diodes, leading to bus contention or excessive current draw.
Is the TL16C752CIPFBR suitable for battery-powered field devices requiring ultra-low sleep current,
The standard TL16C752CIPFBR is not optimized for ultra-low-power applications; its shutdown current is typically 10µA, which may be excessive for multi-year battery-operated field sensors. In contrast, the TL16C752CIPFBRQ1 (AEC-Q100 qualified) has similar quiescent current but includes enhanced electrostatic discharge (ESD) protection and wider temperature stability—making it overkill for non-automotive use. For battery-powered designs, consider instead the XR16L2750IM-F, which offers sub-1µA sleep current and programmable wake-up interrupts. If using the TL16C752CIPFBR, minimize power by disabling unused channels via software and gating the clock source during idle periods.
What are the thermal and layout risks when mounting the TL16C752CIPFBR in a compact 48-TQFP package
The 7x7mm 48-TQFP package of the TL16C752CIPFBR has limited thermal dissipation, and placing it near switching regulators (e.g., buck converters) can cause localized heating that shifts UART timing margins, especially at 3Mbps data rates. Maintain a 5mm clearance from high-di/dt traces and use a solid ground plane beneath the IC to act as a heat spreader. Route UART differential pairs (TX/RX) as impedance-controlled traces with minimal vias, and isolate them from digital noise sources using guard traces tied to ground. Additionally, place decoupling capacitors (100nF + 1µF) within 2mm of each VCC pin to suppress high-frequency noise that could corrupt FIFO operations or auto-flow control signaling.
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Sep 15 2026
