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LMP90077MHX/NOPB
Electronics Part Number
LMP90077MHX/NOPB-WXManufacturer
Lattice Semiconductor
LMP90077MHX/NOPB
Description
Analog Front End, 1 Channel, 16-Bit, HTSSOP-28Inventory
261 Pcs New Original In Stock
"Precision 16-bit AFE, one channel, compact 28-TSSOP. Minimal power consumption, high-resolution output. Suitable for battery-powered data acquisition.",
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Technical Specifications
Category
Embedded, CPLDs (Complex Programmable Logic Devices)
Manufacturer
Lattice Semiconductor
Packaging
Tray
Operating Temperature
0°C ~ 90°C (TJ)
Mounting Type
Surface Mount
Package / Case
144-LQFP
Series
ispMACH® 4000ZE
Base Product Number
LC4256
Product Status
Active
Programmable Type
In System Programmable
Supplier Device Package
144-TQFP (20x20)
DiGi-Electronics Programmable
Not Verified
Number of I/O
96
Number of Macrocells
256
Delay Time tpd(1) Max
5.8 ns
Voltage Supply - Internal
1.7V ~ 1.9V
Number of Logic Elements/Blocks
16
Data Sheet Document (D)
Datasheets
Download LC4256ZE-5TN144C Product Specification (PDF)
HTML Datasheet
LC4256ZE-5TN144C-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
LC4256ZE5TN144C 220-1027
Standard Package
60
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Frequently Asked Questions (FAQ)
What are the key reliability risks when designing in the LC4256ZE-5TN144C for industrial application
When using the LC4256ZE-5TN144C near its 90°C TJ limit, thermal management becomes critical—prolonged operation at high temperatures accelerates electromigration and increases static power leakage, potentially causing timing drift or functional failure. Ensure adequate PCB copper pour under the package, avoid enclosing the device in poorly ventilated enclosures, and validate junction temperature under worst-case load conditions using thermal simulation or infrared measurement. Derating to ≤85°C is recommended for long-term reliability in industrial environments.
Can the LC4256ZE-5TN144C be safely replaced with a Xilinx XC95288XL-10PQG208C in a legacy design wit
Direct replacement of the LC4256ZE-5TN144C with the XC95288XL-10PQG208C is not advisable due to fundamental architectural differences—the Lattice device uses a 1.8V core with 3.3V-tolerant I/Os and 5.8 ns propagation delay, while the Xilinx part operates at 3.3V core, has different pinout, and a 10 ns tPD. Additionally, the macrocell architecture, JTAG implementation, and in-system programming protocols differ significantly. A drop-in replacement would require schematic review, PCB re-layout, and HDL code adaptation, making it more cost-effective to redesign around one architecture rather than force compatibility.
How should I handle power sequencing when integrating the LC4256ZE-5TN144C into a multi-rail system
The LC4256ZE-5TN144C requires careful power sequencing: the internal 1.8V (VDD) rail must be stable before or simultaneously with the 3.3V I/O supply (VDDI/O) to prevent latch-up or unintended I/O contention. Although the datasheet does not mandate strict sequencing, best practice is to ensure VDD reaches 90% of nominal before VDDI/O ramps, using a sequencer IC or supervisor with delay. Reverse biasing of I/O pins during power-up can occur if VDDI/O rises first, risking damage—use series resistors on critical I/O lines and validate behavior with a scope during bring-up.
What layout considerations are critical for minimizing signal integrity issues with the LC4256ZE-5TN
With 96 I/Os switching at sub-6 ns speeds, the LC4256ZE-5TN144C demands careful PCB layout: maintain controlled impedance for high-speed traces (typically 50 Ω single-ended), minimize stub lengths, and route critical signals orthogonally across layers to reduce crosstalk. Use a solid ground plane beneath the package and place decoupling capacitors (100 nF X7R) as close as possible to each VDD pin—ideally one per power/ground pair. Avoid routing high-frequency signals under the device; instead, fan out I/Os radially and use via-in-pad if necessary. Poor layout can induce ground bounce or overshoot, leading to functional errors despite correct logic design.
Is the LC4256ZE-5TN144C suitable for automotive under-hood applications given its 0°C to 90°C operat
The LC4256ZE-5TN144C is not recommended for automotive under-hood use, as it lacks AEC-Q100 qualification and its 90°C maximum junction temperature falls short of typical automotive requirements (often ≥125°C). Even with thermal derating, sustained ambient temperatures in engine compartments can exceed 105°C, pushing the junction beyond safe limits. For such environments, consider automotive-grade alternatives like the Lattice MachXO2-7000HE HC/XC624 in a QFP package with AEC-Q100 Grade 1 certification. Using the LC4256ZE-5TN144C here introduces field-failure risk and may violate functional safety or warranty terms.
What are the key reliability risks when designing in the LC4256ZE-5TN144C for industrial application
When using the LC4256ZE-5TN144C near its 90°C TJ limit, thermal management becomes critical—prolonged operation at high temperatures accelerates electromigration and increases static power leakage, potentially causing timing drift or functional failure. Ensure adequate PCB copper pour under the package, avoid enclosing the device in poorly ventilated enclosures, and validate junction temperature under worst-case load conditions using thermal simulation or infrared measurement. Derating to ≤85°C is recommended for long-term reliability in industrial environments.
Can the LC4256ZE-5TN144C be safely replaced with a Xilinx XC95288XL-10PQG208C in a legacy design wit
Direct replacement of the LC4256ZE-5TN144C with the XC95288XL-10PQG208C is not advisable due to fundamental architectural differences—the Lattice device uses a 1.8V core with 3.3V-tolerant I/Os and 5.8 ns propagation delay, while the Xilinx part operates at 3.3V core, has different pinout, and a 10 ns tPD. Additionally, the macrocell architecture, JTAG implementation, and in-system programming protocols differ significantly. A drop-in replacement would require schematic review, PCB re-layout, and HDL code adaptation, making it more cost-effective to redesign around one architecture rather than force compatibility.
How should I handle power sequencing when integrating the LC4256ZE-5TN144C into a multi-rail system
The LC4256ZE-5TN144C requires careful power sequencing: the internal 1.8V (VDD) rail must be stable before or simultaneously with the 3.3V I/O supply (VDDI/O) to prevent latch-up or unintended I/O contention. Although the datasheet does not mandate strict sequencing, best practice is to ensure VDD reaches 90% of nominal before VDDI/O ramps, using a sequencer IC or supervisor with delay. Reverse biasing of I/O pins during power-up can occur if VDDI/O rises first, risking damage—use series resistors on critical I/O lines and validate behavior with a scope during bring-up.
What layout considerations are critical for minimizing signal integrity issues with the LC4256ZE-5TN
With 96 I/Os switching at sub-6 ns speeds, the LC4256ZE-5TN144C demands careful PCB layout: maintain controlled impedance for high-speed traces (typically 50 Ω single-ended), minimize stub lengths, and route critical signals orthogonally across layers to reduce crosstalk. Use a solid ground plane beneath the package and place decoupling capacitors (100 nF X7R) as close as possible to each VDD pin—ideally one per power/ground pair. Avoid routing high-frequency signals under the device; instead, fan out I/Os radially and use via-in-pad if necessary. Poor layout can induce ground bounce or overshoot, leading to functional errors despite correct logic design.
Is the LC4256ZE-5TN144C suitable for automotive under-hood applications given its 0°C to 90°C operat
The LC4256ZE-5TN144C is not recommended for automotive under-hood use, as it lacks AEC-Q100 qualification and its 90°C maximum junction temperature falls short of typical automotive requirements (often ≥125°C). Even with thermal derating, sustained ambient temperatures in engine compartments can exceed 105°C, pushing the junction beyond safe limits. For such environments, consider automotive-grade alternatives like the Lattice MachXO2-7000HE HC/XC624 in a QFP package with AEC-Q100 Grade 1 certification. Using the LC4256ZE-5TN144C here introduces field-failure risk and may violate functional safety or warranty terms.
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Sep 15 2026
