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G16-A-0375-50-030
Electronics Part Number
G16-A-0375-50-030-WXManufacturer
STMicroelectronics
G16-A-0375-50-030
Description
0.210" Thick Magnet, 1.005" DiameterInventory
292 Pcs New Original In Stock
Compact Neobond magnet with 25.53mm x 5.33mm dimensions for high-performance magnetic sensing, switching, and holding applications.
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Basic cost: USD 70.00
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Technical Specifications
Category
Motion Sensors, IMUs (Inertial Measurement Units)
Manufacturer
STMicroelectronics
Packaging
-
Operating Temperature
-30°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
28-VFLGA Module
Series
-
Base Product Number
LSM303
Sensor Type
Accelerometer, Magnetometer, 6 Axis
Product Status
Obsolete
Output Type
I2C
Supplier Device Package
28-LGA (5x5)
Data Sheet Document (D)
Datasheets
Download LSM303DLH Product Specification (PDF)
HTML Datasheet
LSM303DLH-DG
Design Resources
Development Tool Selector
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
497-10474
Standard Package
490
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Frequently Asked Questions (FAQ)
Can I still use the LSM303DLH in new designs given that it's marked as obsolete, and what are the lo
While the LSM303DLH is marked as obsolete, it is currently in stock with 5,264 units available as new original parts. However, STMicroelectronics no longer guarantees long-term availability, making it unsuitable for high-volume or long-lifecycle designs. For new developments, consider migration to active alternatives like the LSM6DSOX or LIS3MDL paired with LIS2DH12. If you proceed with LSM303DLH, secure a last-time buy and assess second-source options to mitigate supply chain disruptions during production ramp-up or field replacement scenarios.
How does the LSM303DLH handle cross-axis sensitivity between the accelerometer and magnetometer, and
The LSM303DLH integrates both sensors in a single 28-LGA package but does not inherently correct for cross-axis magnetic interference from the accelerometer or PCB components. Misalignment between sensor axes and local magnetic distortions can significantly degrade tilt-compensated heading accuracy. To mitigate this, perform in-situ calibration using ellipsoid fitting for the magnetometer and ensure rigid mechanical alignment between the sensor and system enclosure. Avoid placing current-carrying traces or ferromagnetic materials near the LSM303DLH, and consider using soft-iron and hard-iron compensation algorithms in firmware.
Is the LSM303DLH pin-compatible with newer STMicroelectronics IMUs like the LSM303AGR or LSM6DS33 fo
No, the LSM303DLH is not pin-compatible with newer ST IMUs such as the LSM303AGR or LSM6DS33. The 28-VFLGA package of the LSM303DLH has a unique 5x5 mm footprint and ball arrangement that differs from newer LGA and QFN packages. Replacing it requires PCB re-layout. Furthermore, electrical characteristics such as supply voltage ranges and I2C pull-up requirements may vary. If upgrading from LSM303DLH, treat it as a full redesign rather than a drop-in replacement, and validate signal integrity and mechanical integration.
What are the reliability risks of using the LSM303DLH in industrial environments with temperature cy
The LSM303DLH is rated for -30°C to 85°C operating temperature, making it suitable for many industrial applications. However, repeated thermal cycling in this range can exacerbate stress on the LGA solder joints due to CTE mismatch between the PCB and package. To ensure reliability, use proper SMT process controls, avoid underfill-incompatible layouts, and follow IPC-7095 guidelines for area array packaging. Additionally, validate performance at temperature extremes—especially magnetometer offset drift—which may require runtime recalibration in field-deployed systems.
How does the I2C interface on the LSM303DLH behave under noisy power conditions, and what filtering
The LSM303DLH’s I2C interface operates at 3.3V and can be sensitive to power supply noise, especially in motor-driven or automotive environments where ground bounce and EMI are prevalent. To maintain signal integrity, use a dedicated LDO for the sensor, add a 100nF ceramic capacitor close to VDD, and consider a common-mode choke on the I2C lines. Use 2.2kΩ to 4.7kΩ pull-up resistors to minimize bus rise time without excessive current draw. For high-noise settings, place the LSM303DLH away from switching components and shield the sensor area if necessary to prevent data corruption or lock-up on the I2C bus.
Can I still use the LSM303DLH in new designs given that it's marked as obsolete, and what are the lo
While the LSM303DLH is marked as obsolete, it is currently in stock with 5,264 units available as new original parts. However, STMicroelectronics no longer guarantees long-term availability, making it unsuitable for high-volume or long-lifecycle designs. For new developments, consider migration to active alternatives like the LSM6DSOX or LIS3MDL paired with LIS2DH12. If you proceed with LSM303DLH, secure a last-time buy and assess second-source options to mitigate supply chain disruptions during production ramp-up or field replacement scenarios.
How does the LSM303DLH handle cross-axis sensitivity between the accelerometer and magnetometer, and
The LSM303DLH integrates both sensors in a single 28-LGA package but does not inherently correct for cross-axis magnetic interference from the accelerometer or PCB components. Misalignment between sensor axes and local magnetic distortions can significantly degrade tilt-compensated heading accuracy. To mitigate this, perform in-situ calibration using ellipsoid fitting for the magnetometer and ensure rigid mechanical alignment between the sensor and system enclosure. Avoid placing current-carrying traces or ferromagnetic materials near the LSM303DLH, and consider using soft-iron and hard-iron compensation algorithms in firmware.
Is the LSM303DLH pin-compatible with newer STMicroelectronics IMUs like the LSM303AGR or LSM6DS33 fo
No, the LSM303DLH is not pin-compatible with newer ST IMUs such as the LSM303AGR or LSM6DS33. The 28-VFLGA package of the LSM303DLH has a unique 5x5 mm footprint and ball arrangement that differs from newer LGA and QFN packages. Replacing it requires PCB re-layout. Furthermore, electrical characteristics such as supply voltage ranges and I2C pull-up requirements may vary. If upgrading from LSM303DLH, treat it as a full redesign rather than a drop-in replacement, and validate signal integrity and mechanical integration.
What are the reliability risks of using the LSM303DLH in industrial environments with temperature cy
The LSM303DLH is rated for -30°C to 85°C operating temperature, making it suitable for many industrial applications. However, repeated thermal cycling in this range can exacerbate stress on the LGA solder joints due to CTE mismatch between the PCB and package. To ensure reliability, use proper SMT process controls, avoid underfill-incompatible layouts, and follow IPC-7095 guidelines for area array packaging. Additionally, validate performance at temperature extremes—especially magnetometer offset drift—which may require runtime recalibration in field-deployed systems.
How does the I2C interface on the LSM303DLH behave under noisy power conditions, and what filtering
The LSM303DLH’s I2C interface operates at 3.3V and can be sensitive to power supply noise, especially in motor-driven or automotive environments where ground bounce and EMI are prevalent. To maintain signal integrity, use a dedicated LDO for the sensor, add a 100nF ceramic capacitor close to VDD, and consider a common-mode choke on the I2C lines. Use 2.2kΩ to 4.7kΩ pull-up resistors to minimize bus rise time without excessive current draw. For high-noise settings, place the LSM303DLH away from switching components and shield the sensor area if necessary to prevent data corruption or lock-up on the I2C bus.
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Sep 15 2026
