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FP100R12N3T7B16BPSA1
Electronics Part Number
FP100R12N3T7B16BPSA1-WXManufacturer
Analog Devices, Inc.
FP100R12N3T7B16BPSA1
Description
Low Power ECONO Module AG-ECONO3B-711Inventory
561 Pcs New Original In Stock
Trench field-stop three-phase inverter IGBT module; 1200V, 100A; optimized for low switching losses; for high-performance motor control.
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Minimum 1
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Technical Specifications
Category
RF Amplifiers
Manufacturer
Analog Devices, Inc.
Packaging
-
Mounting Type
Surface Mount
Package / Case
16-VFQFN Exposed Pad
Series
-
Base Product Number
HMC605
Product Status
Obsolete
Gain
20dB
Current - Supply
74mA
Frequency
2.3GHz ~ 2.7GHz
Voltage - Supply
3V, 5V
Supplier Device Package
16-QFN (3x3)
RF Type
WiMAX / WiBro
Test Frequency
-
P1dB
17dBm
Noise Figure
1.1dB
Data Sheet Document (D)
Datasheets
Download HMC605LP3E Product Specification (PDF)
HTML Datasheet
HMC605LP3E-DG
Environmental & Export Classification
Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN
EAR99
HTSUS
8542.33.0001
Additional Information
Standard Package
1
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Frequently Asked Questions (FAQ)
Can the HMC605LP3E be used as a direct replacement for the HMC324ALC3B in a 2.5GHz WiMAX power ampli
While both the HMC605LP3E and HMC324ALC3B operate in the 2.3GHz–2.7GHz WiMAX band, they differ in gain (20dB vs. 16dB) and output power (P1dB of 17dBm vs. 19.5dBm), making the HMC605LP3E unsuitable as a direct drop-in replacement in high-power stages. Key design-in risks include reduced system gain margin and potential need for additional driver amplification. Additionally, the HMC605LP3E is marked as obsolete, raising long-term supply and reliability concerns for production designs. Always verify matching network compatibility and simulate small-signal performance before integration.
What are the implications of using the HMC605LP3E in a 5V supply system when the datasheet emphasize
The HMC605LP3E supports dual 3V and 5V supply operation, but using 5V increases supply current (up to 74mA) and junction temperature, potentially accelerating aging in thermally constrained PCB layouts. While operation at 5V is electrically valid, it's critical to evaluate thermal performance—especially with continuous wave (CW) signals—and ensure the exposed pad is properly soldered to a sufficient ground plane to avoid premature device degradation. Consider derating specifications and confirm gain flatness and noise figure stability at 5V in your application bandwidth.
How does the obsolescence status of the HMC605LP3E impact long-term reliability and production desig
The obsolete status of the HMC605LP3E means Analog Devices no longer guarantees long-term availability or wafer fab support, introducing supply chain risk for sustained manufacturing. While current stock is new and original, lifetime buy quantities may be limited. For reliability, units from remaining inventory may have extended storage periods—ensure proper handling per MSL1 guidelines and verify post-storage performance in production testing. Redesign with active-pin-compatible successors (e.g., HMC1080LP5E) is recommended for new designs targeting multi-year deployment.
What are critical layout considerations when integrating the HMC605LP3E in a densely packed RF front
When integrating the HMC605LP3E in high-density RF designs, maintain strict impedance control (50Ω) on input and output traces to prevent gain ripple and VSWR issues. Utilize the exposed pad for both thermal dissipation and grounding—use multiple vias under the pad connected to a solid ground plane to minimize thermal resistance and parasitic inductance. Avoid routing digital lines near RF paths to prevent coupling, and isolate the 3V/5V supply with ferrite beads and bypass capacitors (e.g., 100pF and 10μF) close to the supply pins to suppress oscillation risk in sensitive low-noise applications.
Is the HMC605LP3E suitable for replacing the Qorvo QPA2211 in a point-to-multipoint WiBro base stati
The HMC605LP3E is not an ideal replacement for the QPA2211 in base station receiver chains due to significant performance trade-offs: while both cover the 2.3GHz–2.7GHz band, the QPA2211 offers much higher gain (>30dB) and better output power, making it better suited for macro-cell applications. The HMC605LP3E’s 20dB gain and 17dBm P1dB limit its use to lower-power, short-range systems like CPE units or small cells. Use of the HMC605LP3E in place of the QPA2211 risks inadequate system sensitivity and dynamic range—consider cascaded LNA designs with the HMC605LP3E only if power consumption and footprint are critical constraints.
Can the HMC605LP3E be used as a direct replacement for the HMC324ALC3B in a 2.5GHz WiMAX power ampli
While both the HMC605LP3E and HMC324ALC3B operate in the 2.3GHz–2.7GHz WiMAX band, they differ in gain (20dB vs. 16dB) and output power (P1dB of 17dBm vs. 19.5dBm), making the HMC605LP3E unsuitable as a direct drop-in replacement in high-power stages. Key design-in risks include reduced system gain margin and potential need for additional driver amplification. Additionally, the HMC605LP3E is marked as obsolete, raising long-term supply and reliability concerns for production designs. Always verify matching network compatibility and simulate small-signal performance before integration.
What are the implications of using the HMC605LP3E in a 5V supply system when the datasheet emphasize
The HMC605LP3E supports dual 3V and 5V supply operation, but using 5V increases supply current (up to 74mA) and junction temperature, potentially accelerating aging in thermally constrained PCB layouts. While operation at 5V is electrically valid, it's critical to evaluate thermal performance—especially with continuous wave (CW) signals—and ensure the exposed pad is properly soldered to a sufficient ground plane to avoid premature device degradation. Consider derating specifications and confirm gain flatness and noise figure stability at 5V in your application bandwidth.
How does the obsolescence status of the HMC605LP3E impact long-term reliability and production desig
The obsolete status of the HMC605LP3E means Analog Devices no longer guarantees long-term availability or wafer fab support, introducing supply chain risk for sustained manufacturing. While current stock is new and original, lifetime buy quantities may be limited. For reliability, units from remaining inventory may have extended storage periods—ensure proper handling per MSL1 guidelines and verify post-storage performance in production testing. Redesign with active-pin-compatible successors (e.g., HMC1080LP5E) is recommended for new designs targeting multi-year deployment.
What are critical layout considerations when integrating the HMC605LP3E in a densely packed RF front
When integrating the HMC605LP3E in high-density RF designs, maintain strict impedance control (50Ω) on input and output traces to prevent gain ripple and VSWR issues. Utilize the exposed pad for both thermal dissipation and grounding—use multiple vias under the pad connected to a solid ground plane to minimize thermal resistance and parasitic inductance. Avoid routing digital lines near RF paths to prevent coupling, and isolate the 3V/5V supply with ferrite beads and bypass capacitors (e.g., 100pF and 10μF) close to the supply pins to suppress oscillation risk in sensitive low-noise applications.
Is the HMC605LP3E suitable for replacing the Qorvo QPA2211 in a point-to-multipoint WiBro base stati
The HMC605LP3E is not an ideal replacement for the QPA2211 in base station receiver chains due to significant performance trade-offs: while both cover the 2.3GHz–2.7GHz band, the QPA2211 offers much higher gain (>30dB) and better output power, making it better suited for macro-cell applications. The HMC605LP3E’s 20dB gain and 17dBm P1dB limit its use to lower-power, short-range systems like CPE units or small cells. Use of the HMC605LP3E in place of the QPA2211 risks inadequate system sensitivity and dynamic range—consider cascaded LNA designs with the HMC605LP3E only if power consumption and footprint are critical constraints.
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Sep 15 2026
