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MPQ7051
Electronics Part Number
MPQ7051-WX
MPQ7051
Description
NPN Power Bipolar Transistor High Current SwitchInventory
199 Pcs New Original In Stock
14-PDIP complementary NPN/PNP transistor array; 150V, 500mA, 50MHz, 750mW; versatile push-pull; for audio drivers and line amplifiers.
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Basic cost: USD 70.00
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Technical Specifications
Category
Power Driver Modules
Manufacturer
Packaging
Tube
Mounting Type
Through Hole
Package / Case
27-PowerDIP Module (1.205", 30.60mm)
Series
Motion-SPM®
Part Status
Obsolete
Base Product Number
FSBF1
Product Status
Obsolete
Type
-
Voltage - Isolation
-
Configuration
-
Data Sheet Document (D)
Datasheets
Download FSBF15CH60CT Product Specification (PDF)
HTML Datasheet
FSBF15CH60CT-DG
Environmental & Export Classification
RoHS Status
Not applicable
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
2156-FSBF15CH60CT-FS ONSFSCFSBF15CH60CT
Standard Package
13
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Frequently Asked Questions (FAQ)
Can FSBF15CH60CT be used as a direct replacement for FNA41560T2 in a motor control design, and what
The FSBF15CH60CT is not a direct pin-to-pin replacement for the FNA41560T2 despite both being SPM® modules for motor control. Key differences include gate drive logic levels, fault reporting circuitry, and thermal performance under high switching loads. When integrating the FSBF15CH60CT as a substitute, verify compatibility with your MCU's PWM timing and ensure fault protection circuitry (e.g., desaturation response) is recalibrated. Always cross-check timing diagrams in the respective application notes to avoid shoot-through or false overcurrent tripping, especially at higher bus voltages above 450VDC.
What are the critical design-in considerations when using the FSBF15CH60CT in a high-temperature ind
When deploying the FSBF15CH60CT in elevated ambient temperatures (>70°C), thermal management becomes critical due to its through-hole mounting and limited heat-spreading capability. Use thick copper pours (≥2 oz) and multiple vias under the thermal pad to improve heat transfer. Derate the output current by at least 20% at 85°C ambient, and monitor junction temperature via external NTC if possible. Avoid placing heat-sensitive components near the module’s center pins, where IGBT switching losses are highest.
How does the obsolete status of FSBF15CH60CT impact long-term reliability and production design plan
The FSBF15CH60CT’s 'Obsolete' status means onsemi no longer manufactures it, increasing supply chain risk for volume production. While current inventory is available, long-term designs should plan for redesign using active parts like FNA41560T2 or newer SPM®-12 modules. For legacy system repairs, inspect lot dates and store modules in controlled environments to prevent moisture ingress (despite MSL1 rating). Consider full lifetime testing if sourcing from third-party suppliers to mitigate counterfeit risk.
What PCB layout practices minimize EMI and gate noise when driving the FSBF15CH60CT in a variable sp
To reduce EMI and gate ringing with the FSBF15CH60CT, keep high-di/dt gate loops extremely short: place 10Ω series gate resistors close to the module’s input pins and use twisted-pair or stripline routing for gate signals. Implement a dedicated ground plane underneath control signals and separate power and signal grounds tied at a single point near the DC bus capacitor. Add a 100nF ceramic capacitor between each gate drive supply (VDD) and its local ground to suppress transient coupling.
What are the failure modes of FSBF15CH60CT under overcurrent or short-circuit conditions, and how ca
The FSBF15CH60CT includes built-in desaturation detection, but improper external circuit design can still lead to IGBT failure during short circuits. Key risks include delayed fault response due to long desat detection traces or insufficient TVS clamping on gate inputs. To harden reliability, route desaturation sense lines symmetrically with Kelvin connections to the emitter, use a fast-acting 18V Zener at the gate, and validate the protection delay (typically 3–5µs) under worst-case temperature and load conditions. Simulate short-circuit scenarios before deployment.
Can FSBF15CH60CT be used as a direct replacement for FNA41560T2 in a motor control design, and what
The FSBF15CH60CT is not a direct pin-to-pin replacement for the FNA41560T2 despite both being SPM® modules for motor control. Key differences include gate drive logic levels, fault reporting circuitry, and thermal performance under high switching loads. When integrating the FSBF15CH60CT as a substitute, verify compatibility with your MCU's PWM timing and ensure fault protection circuitry (e.g., desaturation response) is recalibrated. Always cross-check timing diagrams in the respective application notes to avoid shoot-through or false overcurrent tripping, especially at higher bus voltages above 450VDC.
What are the critical design-in considerations when using the FSBF15CH60CT in a high-temperature ind
When deploying the FSBF15CH60CT in elevated ambient temperatures (>70°C), thermal management becomes critical due to its through-hole mounting and limited heat-spreading capability. Use thick copper pours (≥2 oz) and multiple vias under the thermal pad to improve heat transfer. Derate the output current by at least 20% at 85°C ambient, and monitor junction temperature via external NTC if possible. Avoid placing heat-sensitive components near the module’s center pins, where IGBT switching losses are highest.
How does the obsolete status of FSBF15CH60CT impact long-term reliability and production design plan
The FSBF15CH60CT’s 'Obsolete' status means onsemi no longer manufactures it, increasing supply chain risk for volume production. While current inventory is available, long-term designs should plan for redesign using active parts like FNA41560T2 or newer SPM®-12 modules. For legacy system repairs, inspect lot dates and store modules in controlled environments to prevent moisture ingress (despite MSL1 rating). Consider full lifetime testing if sourcing from third-party suppliers to mitigate counterfeit risk.
What PCB layout practices minimize EMI and gate noise when driving the FSBF15CH60CT in a variable sp
To reduce EMI and gate ringing with the FSBF15CH60CT, keep high-di/dt gate loops extremely short: place 10Ω series gate resistors close to the module’s input pins and use twisted-pair or stripline routing for gate signals. Implement a dedicated ground plane underneath control signals and separate power and signal grounds tied at a single point near the DC bus capacitor. Add a 100nF ceramic capacitor between each gate drive supply (VDD) and its local ground to suppress transient coupling.
What are the failure modes of FSBF15CH60CT under overcurrent or short-circuit conditions, and how ca
The FSBF15CH60CT includes built-in desaturation detection, but improper external circuit design can still lead to IGBT failure during short circuits. Key risks include delayed fault response due to long desat detection traces or insufficient TVS clamping on gate inputs. To harden reliability, route desaturation sense lines symmetrically with Kelvin connections to the emitter, use a fast-acting 18V Zener at the gate, and validate the protection delay (typically 3–5µs) under worst-case temperature and load conditions. Simulate short-circuit scenarios before deployment.
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Sep 15 2026
