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KSC3123YMTF
Electronics Part Number
KSC3123YMTF-WXManufacturer
Analog Devices, Inc.
KSC3123YMTF
Description
20V 1.4GHz NPN RF Transistor SOT-23-3Inventory
92 Pcs New Original In Stock
SOT-23-3 RF NPN; 20V, 50mA, 1.4GHz, 150mW; high transition frequency; for oscillators and wideband amplifiers.
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Technical Specifications
Category
RF Detectors
Manufacturer
Analog Devices, Inc.
Packaging
-
Mounting Type
Surface Mount
Package / Case
8-WFDFN Exposed Pad
Series
-
Product Status
Obsolete
Current - Supply
30 mA
Frequency
100MHz ~ 40GHz
Voltage - Supply
3.3V
Supplier Device Package
8-DFN (2x2) Flip Chip
Accuracy
±1dB
RF Type
Cellular, WLAN
Input Range
-40.8dBm ~ 6.3dBm
Data Sheet Document (D)
Datasheets
Download LTC5596IDC Product Specification (PDF)
HTML Datasheet
LTC5596IDC-DG
Environmental & Export Classification
Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN
OBSOLETE
HTSUS
0000.00.0000
Additional Information
Standard Package
1
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Frequently Asked Questions (FAQ)
Can the LTC5596IDC be used for precise RF power measurement in 5G mmWave applications above 28GHz, a
Yes, the LTC5596IDC supports frequencies up to 40GHz, making it suitable for 5G mmWave design-in scenarios. However, above 28GHz, trace losses, impedance mismatches, and PCB dielectric absorption can degrade the effective accuracy of its ±1dB specification. To maintain measurement integrity, use controlled-impedance microstrip lines with tight tolerance materials (e.g., Rogers RO4000), minimize trace length between antenna/feed and LTC5596IDC, and perform system-level calibration at target frequencies. Also consider temperature drift effects on output voltage, especially in uncontrolled environments.
Is the LTC5596IDC a viable replacement for the ADL5906 in a wideband WLAN 6E power detection circuit
The LTC5596IDC can serve as a functional alternative to the ADL5906 in WLAN 6E (5.925–7.125GHz) applications, but with trade-offs. The LTC5596IDC has a wider frequency range (up to 40GHz) and similar ±1dB accuracy, but its input range of -40.8dBm to 6.3dBm is narrower than the ADL5906’s -50dBm to +8dBm. In high-dynamic-range systems, this limits headroom for strong interferers. For dense RF environments, ensure signal conditioning (e.g., external attenuation or switching) protects the LTC5596IDC from overload. Also note that the LTC5596IDC is marked as obsolete, so long-term supply requires lifecycle planning.
What layout considerations are critical when integrating the LTC5596IDC in a compact 8-DFN flip-chip
Due to its 8-DFN (2x2) flip-chip construction, the LTC5596IDC demands careful PCB layout to manage thermal dissipation and RF integrity. Use a solid ground plane under the exposed pad, thermally connect it via multiple vias, and avoid routing high-speed signals beneath the device. The flip-chip design has limited thermal mass, so power routing should minimize voltage drop and control current surges above 30mA. Keep RF input traces short and isolated from digital lines to prevent coupling; include guard rings if needed. Avoid placing heat-generating components adjacent to the LTC5596IDC to prevent drift in detection output.
How does the 3.3V supply requirement of the LTC5596IDC impact its compatibility with low-voltage IoT
The LTC5596IDC requires a stable 3.3V supply, which may necessitate a voltage regulator in 1.8V or 2.5V IoT systems, adding BOM cost and complexity. Any noise on the 3.3V rail—especially from switching regulators—can modulate the detector output and degrade RMS accuracy. Use a low-noise LDO with at least 40dB PSRR, decouple the VCC pin with a 100nF ceramic capacitor close to the package, and consider a ferrite bead if shared with noisy peripherals. Ensure the supply can source 30mA during transient response to avoid droop-induced measurement lag.
Given that the LTC5596IDC is listed as obsolete, what are the risks of designing it into a new produ
Designing the LTC5596IDC into new production carries lifecycle risks due to its obsolete status, including potential long-term unavailability and increased counterfeit exposure from non-franchised sources. For high-volume or long-lifecycle projects, consider last-time-buy planning and secure extended stock early. Alternatives include the LTC5596IDC#TRPBF (pin- and function-compatible), or redesign with newer detectors like the ADL5513 or MAX2016, which offer similar bandwidth but verify accuracy and supply compatibility. Assess future serviceability and consider obsolescence mitigation in your supply chain strategy.
Can the LTC5596IDC be used for precise RF power measurement in 5G mmWave applications above 28GHz, a
Yes, the LTC5596IDC supports frequencies up to 40GHz, making it suitable for 5G mmWave design-in scenarios. However, above 28GHz, trace losses, impedance mismatches, and PCB dielectric absorption can degrade the effective accuracy of its ±1dB specification. To maintain measurement integrity, use controlled-impedance microstrip lines with tight tolerance materials (e.g., Rogers RO4000), minimize trace length between antenna/feed and LTC5596IDC, and perform system-level calibration at target frequencies. Also consider temperature drift effects on output voltage, especially in uncontrolled environments.
Is the LTC5596IDC a viable replacement for the ADL5906 in a wideband WLAN 6E power detection circuit
The LTC5596IDC can serve as a functional alternative to the ADL5906 in WLAN 6E (5.925–7.125GHz) applications, but with trade-offs. The LTC5596IDC has a wider frequency range (up to 40GHz) and similar ±1dB accuracy, but its input range of -40.8dBm to 6.3dBm is narrower than the ADL5906’s -50dBm to +8dBm. In high-dynamic-range systems, this limits headroom for strong interferers. For dense RF environments, ensure signal conditioning (e.g., external attenuation or switching) protects the LTC5596IDC from overload. Also note that the LTC5596IDC is marked as obsolete, so long-term supply requires lifecycle planning.
What layout considerations are critical when integrating the LTC5596IDC in a compact 8-DFN flip-chip
Due to its 8-DFN (2x2) flip-chip construction, the LTC5596IDC demands careful PCB layout to manage thermal dissipation and RF integrity. Use a solid ground plane under the exposed pad, thermally connect it via multiple vias, and avoid routing high-speed signals beneath the device. The flip-chip design has limited thermal mass, so power routing should minimize voltage drop and control current surges above 30mA. Keep RF input traces short and isolated from digital lines to prevent coupling; include guard rings if needed. Avoid placing heat-generating components adjacent to the LTC5596IDC to prevent drift in detection output.
How does the 3.3V supply requirement of the LTC5596IDC impact its compatibility with low-voltage IoT
The LTC5596IDC requires a stable 3.3V supply, which may necessitate a voltage regulator in 1.8V or 2.5V IoT systems, adding BOM cost and complexity. Any noise on the 3.3V rail—especially from switching regulators—can modulate the detector output and degrade RMS accuracy. Use a low-noise LDO with at least 40dB PSRR, decouple the VCC pin with a 100nF ceramic capacitor close to the package, and consider a ferrite bead if shared with noisy peripherals. Ensure the supply can source 30mA during transient response to avoid droop-induced measurement lag.
Given that the LTC5596IDC is listed as obsolete, what are the risks of designing it into a new produ
Designing the LTC5596IDC into new production carries lifecycle risks due to its obsolete status, including potential long-term unavailability and increased counterfeit exposure from non-franchised sources. For high-volume or long-lifecycle projects, consider last-time-buy planning and secure extended stock early. Alternatives include the LTC5596IDC#TRPBF (pin- and function-compatible), or redesign with newer detectors like the ADL5513 or MAX2016, which offer similar bandwidth but verify accuracy and supply compatibility. Assess future serviceability and consider obsolescence mitigation in your supply chain strategy.
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Sep 15 2026
