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5646446-1

Electronics Part Number

5646446-1-WX
5646446-1

Description

88-Position 2mm Press-Fit Receptacle

Inventory

202 Pcs New Original In Stock
88-way 2.00mm board-edge receptacle; right-angle female sockets offer a compact footprint, stable signal coupling, and reliable operation for space-constrained electronics.
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Minimum 1

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Freight

Basic cost: USD 70.00

Actual cost may vary depending on weight and destination

Shipping method

Shipped from Hong Kong via FedEx/DHL/UPS/TNT

Delivery Time

In-stock items: Ready to ship in 1-2 days

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Technical Specifications

Category Backplane Connectors, Hard Metric, Standard

Manufacturer TE Connectivity AMP Connectors

Packaging Bulk

Number of Rows 8

Pitch 0.079" (2.00mm)

Operating Temperature -55°C ~ 125°C

Mounting Type Board Edge, Through Hole, Right Angle

Series Z-PACK

Features -

Base Product Number 5646446

Product Status Active

Connector Type Receptacle, Female Sockets

Number of Positions 88

Voltage Rating 750Vrms

Termination Press-Fit

Contact Finish Gold

Connector Usage -

Connector Style F 11

Number of Positions Loaded All

Contact Finish Thickness 30.0µin (0.76µm)

Current Rating (Amps) 1.5 A

Data Sheet Document (D)

Datasheets Download 5646446-1 Product Specification (PDF)

Product Drawings 5646446-1

HTML Datasheet 5646446-1-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant

Moisture Sensitivity Level (MSL) 1 (Unlimited)

REACH Status REACH Unaffected

ECCN EAR99

HTSUS 8536.69.4040

Additional Information

Other Names A97867 -5646446-1-SI 2266-5646446-1 5646446-1-DG

Standard Package 20

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Frequently Asked Questions (FAQ)

FAQ Icon

What are the critical design considerations when replacing a legacy 88-position 2mm pitch backplane

When replacing legacy connectors with the 5646446-1, ensure mechanical compatibility with existing mating headers and verify press-fit hole tolerances (typically ±0.05mm) to avoid board damage during installation. The 5646446-1’s press-fit termination provides superior vibration resistance compared to soldered alternatives, but improper PCB plating thickness or annular ring design can lead to cold joints or barrel cracking under sustained shock. Always validate insertion force (typically 80–120 N total) against your assembly equipment limits and consider using TE’s Z-PACK family alignment guides to reduce misalignment stress during mating cycles.
FAQ Icon

Can the 5646446-1 safely carry 1.5A per contact in a densely populated backplane where adjacent pins

While the 5646446-1 is rated for 1.5A per contact, simultaneous full-load operation across multiple adjacent pins can cause localized heating due to thermal coupling, potentially exceeding the 125°C operating limit. In practice, derating to 1.0–1.2A per contact is recommended for >50% loaded connectors in enclosed environments. Use thermal simulation or empirical testing to validate temperature rise, especially if airflow is restricted. Consider spacing high-current signals with ground pins to improve heat dissipation and maintain signal integrity.
FAQ Icon

How does the 5646446-1 compare to the Molex 0906321100 for right-angle 88-position backplane applica

The 5646446-1 uses TE’s proprietary press-fit contact technology with 30µin gold plating, offering excellent resistance to fretting corrosion and consistent contact resistance over 500+ mating cycles. In contrast, the Molex 0906321100 relies on traditional solder tails and may suffer from solder joint fatigue in high-vibration settings. While both meet 750Vrms isolation, the 5646446-1’s press-fit design eliminates solder-related defects (e.g., voids, tombstoning) and simplifies rework. However, Molex offers lower insertion force per pin, which may benefit high-density manual assemblies—evaluate based on your production method and environmental stress profile.
FAQ Icon

What PCB layout precautions are necessary to prevent delamination or pad lifting when installing the

To avoid delamination during press-fit installation of the 5646446-1, ensure your PCB uses high-Tg FR4 (≥170°C) or polyimide substrates with reinforced plating in vias (minimum 25µm copper thickness). Maintain annular rings ≥0.15mm and avoid placing press-fit holes near board edges or internal cutouts where mechanical stress concentrates. Pre-baking PCBs before assembly (per IPC-1601) mitigates moisture-induced outgassing that can weaken interlayer adhesion. TE recommends hole diameters of 1.02±0.03mm for optimal retention without excessive force—verify with a sample run before full production.
FAQ Icon

Is the 5646446-1 suitable for use in automotive under-hood applications where temperature cycling fr

Yes, the 5646446-1’s operating range (-55°C to 125°C) and RoHS3 compliance make it technically suitable for automotive under-hood use, but long-term reliability depends on system-level design. The gold-plated contacts resist oxidation, but thermal cycling can induce stress at the press-fit interface due to CTE mismatch between copper-plated holes and the connector housing. Mitigate this by using symmetrical PCB layouts to balance stress and incorporating strain relief features. Additionally, validate performance under ISO 16750-3 vibration profiles—while the connector itself is robust, repeated thermal expansion may loosen improperly toleranced press-fit joints over time.
FAQ Icon

What are the critical design considerations when replacing a legacy 88-position 2mm pitch backplane

When replacing legacy connectors with the 5646446-1, ensure mechanical compatibility with existing mating headers and verify press-fit hole tolerances (typically ±0.05mm) to avoid board damage during installation. The 5646446-1’s press-fit termination provides superior vibration resistance compared to soldered alternatives, but improper PCB plating thickness or annular ring design can lead to cold joints or barrel cracking under sustained shock. Always validate insertion force (typically 80–120 N total) against your assembly equipment limits and consider using TE’s Z-PACK family alignment guides to reduce misalignment stress during mating cycles.
FAQ Icon

Can the 5646446-1 safely carry 1.5A per contact in a densely populated backplane where adjacent pins

While the 5646446-1 is rated for 1.5A per contact, simultaneous full-load operation across multiple adjacent pins can cause localized heating due to thermal coupling, potentially exceeding the 125°C operating limit. In practice, derating to 1.0–1.2A per contact is recommended for >50% loaded connectors in enclosed environments. Use thermal simulation or empirical testing to validate temperature rise, especially if airflow is restricted. Consider spacing high-current signals with ground pins to improve heat dissipation and maintain signal integrity.
FAQ Icon

How does the 5646446-1 compare to the Molex 0906321100 for right-angle 88-position backplane applica

The 5646446-1 uses TE’s proprietary press-fit contact technology with 30µin gold plating, offering excellent resistance to fretting corrosion and consistent contact resistance over 500+ mating cycles. In contrast, the Molex 0906321100 relies on traditional solder tails and may suffer from solder joint fatigue in high-vibration settings. While both meet 750Vrms isolation, the 5646446-1’s press-fit design eliminates solder-related defects (e.g., voids, tombstoning) and simplifies rework. However, Molex offers lower insertion force per pin, which may benefit high-density manual assemblies—evaluate based on your production method and environmental stress profile.
FAQ Icon

What PCB layout precautions are necessary to prevent delamination or pad lifting when installing the

To avoid delamination during press-fit installation of the 5646446-1, ensure your PCB uses high-Tg FR4 (≥170°C) or polyimide substrates with reinforced plating in vias (minimum 25µm copper thickness). Maintain annular rings ≥0.15mm and avoid placing press-fit holes near board edges or internal cutouts where mechanical stress concentrates. Pre-baking PCBs before assembly (per IPC-1601) mitigates moisture-induced outgassing that can weaken interlayer adhesion. TE recommends hole diameters of 1.02±0.03mm for optimal retention without excessive force—verify with a sample run before full production.
FAQ Icon

Is the 5646446-1 suitable for use in automotive under-hood applications where temperature cycling fr

Yes, the 5646446-1’s operating range (-55°C to 125°C) and RoHS3 compliance make it technically suitable for automotive under-hood use, but long-term reliability depends on system-level design. The gold-plated contacts resist oxidation, but thermal cycling can induce stress at the press-fit interface due to CTE mismatch between copper-plated holes and the connector housing. Mitigate this by using symmetrical PCB layouts to balance stress and incorporating strain relief features. Additionally, validate performance under ISO 16750-3 vibration profiles—while the connector itself is robust, repeated thermal expansion may loosen improperly toleranced press-fit joints over time.

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