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5646445-1
Electronics Part Number
5646445-1-WXManufacturer
TE Connectivity AMP Connectors
5646445-1
Description
2mm Press-Fit Receptacle, 200 ContactsInventory
549 Pcs New Original In Stock
200-contact 2.00mm board-edge receptacle; right-angle female sockets enable efficient high-density wiring, excellent signal integrity, and durable industrial operation.
Quantity
Minimum 1
Minimum 1
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Freight
Basic cost: USD 70.00
Actual cost may vary depending on weight and destination
Shipping method
Shipped from Hong Kong via FedEx/DHL/UPS/TNT
Delivery Time
In-stock items: Ready to ship in 1-2 days
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Technical Specifications
Category
Backplane Connectors, Hard Metric, Standard
Manufacturer
TE Connectivity AMP Connectors
Packaging
Tube
Number of Rows
8
Pitch
0.079" (2.00mm)
Operating Temperature
-55°C ~ 125°C
Mounting Type
Board Edge, Through Hole, Right Angle
Series
Z-PACK
Features
-
Base Product Number
5646445
Product Status
Active
Connector Type
Receptacle, Female Sockets
Number of Positions
200
Voltage Rating
750Vrms
Termination
Press-Fit
Contact Finish
Gold
Connector Usage
-
Connector Style
E 25
Number of Positions Loaded
All
Contact Finish Thickness
30.0µin (0.76µm)
Current Rating (Amps)
1.5 A
Data Sheet Document (D)
Datasheets
Download 5646445-1 Product Specification (PDF)
Product Drawings
5646445-1
HTML Datasheet
5646445-1-DG
Environmental & Export Classification
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8536.69.4040
Additional Information
Other Names
-5646445-1-SI A97866 56464451 2266-5646445-1 5646445-1-DG
Standard Package
10
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Frequently Asked Questions (FAQ)
When designing a high-density backplane system with the 5646445-1, what are the critical mechanical
The 5646445-1’s press-fit termination requires precise PCB hole size (typically 0.039–0.041" per TE specs) and plating thickness to ensure reliable cold welds without damaging plated-through holes during insertion. In right-angle, board-edge mounting, mechanical stress from mating cycles or vibration can concentrate at the lead-to-board interface—especially under thermal cycling from -55°C to 125°C. To mitigate risk, use strain relief brackets, avoid adjacent high-stress components, and validate insertion force (<150 N per contact) with your specific PCB stack-up. Also, ensure adequate clearance on the component side for tool access during assembly.
Can the 5646445-1 be safely replaced with a similar 200-position 2mm pitch right-angle backplane con
Direct replacement of the 5646445-1 with the Samtec LSHM-150-01-L-DV-A-N is not recommended without re-evaluation. While both are 200-position, 2mm pitch, right-angle backplane receptacles, the Samtec uses a surface-mount design versus the 5646445-1’s press-fit through-hole termination. This changes board layout, thermal management, and mechanical robustness. Additionally, the Samtec has a lower current rating (1.0 A vs. 1.5 A) and different mating force characteristics. If redesigning, verify impedance matching, insertion/withdrawal cycle ratings, and long-term reliability under your operating environment—especially if the application demands high vibration resistance or frequent mating.
What are the hidden reliability risks when using the 5646445-1 in industrial environments with high
Although the 5646445-1 is rated for -55°C to 125°C and is RoHS compliant with MSL 1 (unlimited floor life), long-term exposure to high humidity combined with thermal cycling can accelerate fretting corrosion at the press-fit interface—even with gold plating (30 µin). Condensation during cooldown phases may lead to micro-corrosion if conformal coating is not applied. To reduce risk, implement a hydrophobic conformal coating (e.g., silicone or parylene), ensure proper grounding across the backplane, and avoid rapid thermal transients. Regular inspection of contact resistance during maintenance cycles is advised for mission-critical systems.
How does the 8-row configuration of the 5646445-1 impact signal integrity and crosstalk in high-spee
The 8-row layout of the 5646445-1 increases susceptibility to crosstalk and impedance discontinuities in high-speed applications (e.g., >1 Gbps) due to tighter vertical spacing and longer parallel trace runs. Adjacent differential pairs in different rows can couple capacitively, especially without ground shielding between rows. To mitigate this, assign ground pins strategically between signal rows (leveraging unused positions if possible), maintain consistent impedance by controlling trace width and dielectric spacing, and use simulation tools to model via stubs introduced by the through-hole press-fit leads. Avoid routing high-speed signals on outer rows where edge effects are more pronounced.
Is the 5646445-1 suitable for high-current power distribution applications, or should it be limited
The 5646445-1 should not be used for primary power distribution despite its 750Vrms rating. With only 1.5 A per contact, paralleling multiple pins for higher current introduces significant risk of uneven current sharing due to contact resistance variation—especially after thermal cycling or vibration. This can lead to localized overheating and premature failure. For power delivery, use dedicated power connectors (e.g., TE’s AMPMODU Mod IV or similar). Reserve the 5646445-1 for signal and low-power control lines. If mixed-signal design is unavoidable, isolate power and ground planes, monitor temperature rise during validation, and derate current by at least 20% for safety margins in production units.
When designing a high-density backplane system with the 5646445-1, what are the critical mechanical
The 5646445-1’s press-fit termination requires precise PCB hole size (typically 0.039–0.041" per TE specs) and plating thickness to ensure reliable cold welds without damaging plated-through holes during insertion. In right-angle, board-edge mounting, mechanical stress from mating cycles or vibration can concentrate at the lead-to-board interface—especially under thermal cycling from -55°C to 125°C. To mitigate risk, use strain relief brackets, avoid adjacent high-stress components, and validate insertion force (<150 N per contact) with your specific PCB stack-up. Also, ensure adequate clearance on the component side for tool access during assembly.
Can the 5646445-1 be safely replaced with a similar 200-position 2mm pitch right-angle backplane con
Direct replacement of the 5646445-1 with the Samtec LSHM-150-01-L-DV-A-N is not recommended without re-evaluation. While both are 200-position, 2mm pitch, right-angle backplane receptacles, the Samtec uses a surface-mount design versus the 5646445-1’s press-fit through-hole termination. This changes board layout, thermal management, and mechanical robustness. Additionally, the Samtec has a lower current rating (1.0 A vs. 1.5 A) and different mating force characteristics. If redesigning, verify impedance matching, insertion/withdrawal cycle ratings, and long-term reliability under your operating environment—especially if the application demands high vibration resistance or frequent mating.
What are the hidden reliability risks when using the 5646445-1 in industrial environments with high
Although the 5646445-1 is rated for -55°C to 125°C and is RoHS compliant with MSL 1 (unlimited floor life), long-term exposure to high humidity combined with thermal cycling can accelerate fretting corrosion at the press-fit interface—even with gold plating (30 µin). Condensation during cooldown phases may lead to micro-corrosion if conformal coating is not applied. To reduce risk, implement a hydrophobic conformal coating (e.g., silicone or parylene), ensure proper grounding across the backplane, and avoid rapid thermal transients. Regular inspection of contact resistance during maintenance cycles is advised for mission-critical systems.
How does the 8-row configuration of the 5646445-1 impact signal integrity and crosstalk in high-spee
The 8-row layout of the 5646445-1 increases susceptibility to crosstalk and impedance discontinuities in high-speed applications (e.g., >1 Gbps) due to tighter vertical spacing and longer parallel trace runs. Adjacent differential pairs in different rows can couple capacitively, especially without ground shielding between rows. To mitigate this, assign ground pins strategically between signal rows (leveraging unused positions if possible), maintain consistent impedance by controlling trace width and dielectric spacing, and use simulation tools to model via stubs introduced by the through-hole press-fit leads. Avoid routing high-speed signals on outer rows where edge effects are more pronounced.
Is the 5646445-1 suitable for high-current power distribution applications, or should it be limited
The 5646445-1 should not be used for primary power distribution despite its 750Vrms rating. With only 1.5 A per contact, paralleling multiple pins for higher current introduces significant risk of uneven current sharing due to contact resistance variation—especially after thermal cycling or vibration. This can lead to localized overheating and premature failure. For power delivery, use dedicated power connectors (e.g., TE’s AMPMODU Mod IV or similar). Reserve the 5646445-1 for signal and low-power control lines. If mixed-signal design is unavoidable, isolate power and ground planes, monitor temperature rise during validation, and derate current by at least 20% for safety margins in production units.
Quality Assurance (QC)
WINSURE ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
Sep 15 2026
