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53A-CBSA-1.75X2.5X0.5
Electronics Part Number
53A-CBSA-1.75X2.5X0.5-WXManufacturer
Analog Devices, Inc.
53A-CBSA-1.75X2.5X0.5
Description
Through-Hole RF Shield 1.75 x 2.5 Inches, Effective EMI Shielding for Modular SystemsInventory
742 Pcs New Original In Stock
RF shield, 2-piece, non-vented, 1.750x2.500 inches, through-hole.
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Technical Specifications
Category
RF Mixers
Manufacturer
Analog Devices, Inc.
Packaging
Tube
Mounting Type
Surface Mount
Package / Case
16-WQFN Exposed Pad
Series
LT5557
Base Product Number
LT5557
Product Status
Active
Gain
2.9dB
Current - Supply
92mA
Frequency
400MHz ~ 3.8GHz
Voltage - Supply
2.9V ~ 3.9V
Supplier Device Package
16-QFN (4x4)
RF Type
Cellular, CDMA, TD-SCDMA, UMTS, WCDMA
Secondary Attributes
Down Converter
Number of Mixers
1
Noise Figure
11.7dB
Data Sheet Document (D)
Datasheets
Download LT5557EUF#PBF Product Specification (PDF)
HTML Datasheet
LT5557EUF#PBF-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
LT5557EUFPBF
Standard Package
91
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Frequently Asked Questions (FAQ)
How does the LT5557EUF#PBF perform in low-voltage down-conversion designs when operating near the 2.
The LT5557EUF#PBF maintains functional performance at the 2.9V supply minimum, but gain can drop by up to 0.8dB compared to operation at 3.3V, especially above 2.5GHz. To stabilize conversion gain in low-voltage applications, use a low-noise LDO with <10mV ripple and minimize trace impedance on the VCC line. Bypass the VCC pin with a parallel 100pF and 10nF ceramic capacitor array placed within 1mm of the pin. Also ensure the LO drive level remains at +5dBm to avoid LO swing reduction due to insufficient headroom, which would further degrade gain and IP3 performance.
Can the LT5557EUF#PBF replace the HMC554ALC5 in a UMTS femtocell design, and what are the key RF per
The LT5557EUF#PBF can replace the HMC554ALC5 in UMTS band II/IV femtocell down-conversion paths, but with caveats. While the LT5557 offers better power efficiency (92mA vs. 120mA) and smaller 4x4mm footprint, its 11.7dB noise figure is approximately 1.5dB higher than the HMC554ALC5, potentially impacting weak-signal sensitivity. However, the LT5557's IIP3 of +15.5dBm (at 1900MHz) is comparable. To mitigate NF impact, use a low-loss SAW filter before the LNA stage and ensure LO phase noise is <-110dBc/Hz at 100kHz offset. This substitution works best in low-interference urban environments where power and size are prioritized over maximum dynamic range.
What are the PCB layout risks when integrating the LT5557EUF#PBF in a high-density 3G small cell, es
Improper layout with the LT5557EUF#PBF can cause excessive LO-to-RF leakage, degrading receiver blocking performance. Key risks include inadequate RF, LO, and IF line isolation, poor ground stitching, and insufficient thermal pad connection. To minimize leakage: route LO using a grounded coplanar waveguide with <50μm gaps to vias, keep RF and IF traces perpendicular to LO, and connect the exposed pad with at least 9 evenly spaced 0.3mm vias filled with conductive epoxy to the inner ground plane. Also maintain a continuous ground under the entire QFN footprint and avoid cutting the ground plane beneath input/output matching networks.
How does the LT5557EUF#PBF's 11.7dB noise figure affect cascaded noise analysis in a CDMA2000 receiv
With an 11.7dB noise figure, the LT5557EUF#PBF significantly influences total receiver noise when not preceded by sufficient LNA gain. For CDMA2000 base stations requiring <-110dBm sensitivity, place an LNA like the SGA-8343 with 18dB gain and 0.8dB NF before the LT5557. This reduces the mixer's effective contribution in the cascade. Using Friis' equation, the total first-stage NF drops to ~0.93dB, making the mixer's noise impact negligible. Ensure the LNA output P1dB is >+10dBm to prevent compression from strong off-channel signals before down-conversion.
What reliability issues arise with the LT5557EUF#PBF in outdoor wireless units exposed to thermal cy
In outdoor deployments, the LT5557EUF#PBF may face thermal cycling from -40°C to +85°C ambient, risking solder joint fatigue on the 16-QFN package. Properly anchoring the exposed pad to a large copper thermal zone with multiple vias reduces thermal resistance (ΘJA) from 65°C/W to ~40°C/W, minimizing junction temperature swings. This improves long-term reliability and extends MTBF by reducing thermomechanical stress. Use a 4x4mm copper pad connected to internal ground layers via at least 4x 0.33mm thermal vias with a daisy-chain routing pattern to avoid tombstoning during reflow. Confirm MSL1 status allows for indefinite floor life, but bake if exposed to >30% RH for >168 hours pre-assembly.
How does the LT5557EUF#PBF perform in low-voltage down-conversion designs when operating near the 2.
The LT5557EUF#PBF maintains functional performance at the 2.9V supply minimum, but gain can drop by up to 0.8dB compared to operation at 3.3V, especially above 2.5GHz. To stabilize conversion gain in low-voltage applications, use a low-noise LDO with <10mV ripple and minimize trace impedance on the VCC line. Bypass the VCC pin with a parallel 100pF and 10nF ceramic capacitor array placed within 1mm of the pin. Also ensure the LO drive level remains at +5dBm to avoid LO swing reduction due to insufficient headroom, which would further degrade gain and IP3 performance.
Can the LT5557EUF#PBF replace the HMC554ALC5 in a UMTS femtocell design, and what are the key RF per
The LT5557EUF#PBF can replace the HMC554ALC5 in UMTS band II/IV femtocell down-conversion paths, but with caveats. While the LT5557 offers better power efficiency (92mA vs. 120mA) and smaller 4x4mm footprint, its 11.7dB noise figure is approximately 1.5dB higher than the HMC554ALC5, potentially impacting weak-signal sensitivity. However, the LT5557's IIP3 of +15.5dBm (at 1900MHz) is comparable. To mitigate NF impact, use a low-loss SAW filter before the LNA stage and ensure LO phase noise is <-110dBc/Hz at 100kHz offset. This substitution works best in low-interference urban environments where power and size are prioritized over maximum dynamic range.
What are the PCB layout risks when integrating the LT5557EUF#PBF in a high-density 3G small cell, es
Improper layout with the LT5557EUF#PBF can cause excessive LO-to-RF leakage, degrading receiver blocking performance. Key risks include inadequate RF, LO, and IF line isolation, poor ground stitching, and insufficient thermal pad connection. To minimize leakage: route LO using a grounded coplanar waveguide with <50μm gaps to vias, keep RF and IF traces perpendicular to LO, and connect the exposed pad with at least 9 evenly spaced 0.3mm vias filled with conductive epoxy to the inner ground plane. Also maintain a continuous ground under the entire QFN footprint and avoid cutting the ground plane beneath input/output matching networks.
How does the LT5557EUF#PBF's 11.7dB noise figure affect cascaded noise analysis in a CDMA2000 receiv
With an 11.7dB noise figure, the LT5557EUF#PBF significantly influences total receiver noise when not preceded by sufficient LNA gain. For CDMA2000 base stations requiring <-110dBm sensitivity, place an LNA like the SGA-8343 with 18dB gain and 0.8dB NF before the LT5557. This reduces the mixer's effective contribution in the cascade. Using Friis' equation, the total first-stage NF drops to ~0.93dB, making the mixer's noise impact negligible. Ensure the LNA output P1dB is >+10dBm to prevent compression from strong off-channel signals before down-conversion.
What reliability issues arise with the LT5557EUF#PBF in outdoor wireless units exposed to thermal cy
In outdoor deployments, the LT5557EUF#PBF may face thermal cycling from -40°C to +85°C ambient, risking solder joint fatigue on the 16-QFN package. Properly anchoring the exposed pad to a large copper thermal zone with multiple vias reduces thermal resistance (ΘJA) from 65°C/W to ~40°C/W, minimizing junction temperature swings. This improves long-term reliability and extends MTBF by reducing thermomechanical stress. Use a 4x4mm copper pad connected to internal ground layers via at least 4x 0.33mm thermal vias with a daisy-chain routing pattern to avoid tombstoning during reflow. Confirm MSL1 status allows for indefinite floor life, but bake if exposed to >30% RH for >168 hours pre-assembly.
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Sep 15 2026
