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1705941000
Electronics Part Number
1705941000-WXManufacturer
Analog Devices, Inc.
1705941000
Description
Connector SAI 8 MB M12 UT with 4 PositionsInventory
240 Pcs New Original In Stock
Compact sensors/transducers with stable output; reliable detection and signal conversion for industrial automation, OEM, and monitoring.
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Freight
Basic cost: USD 70.00
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Technical Specifications
Category
Specialized Sensors
Manufacturer
Analog Devices, Inc.
Packaging
-
Operating Temperature
-40°C ~ 85°C
Series
-
Base Product Number
MAX86150
Sensor Type
Oximeter/Heart Rate
Product Status
Obsolete
Output Type
I2C
Data Sheet Document (D)
Datasheets
Download MAX86150EFF+ Product Specification (PDF)
HTML Datasheet
MAX86150EFF+-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
-4941-MAX86150EFF+
Standard Package
5,000
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Frequently Asked Questions (FAQ)
Can the MAX86150EFF+ still be used in new wearable medical device designs despite being marked as ob
While the MAX86150EFF+ is listed as obsolete, it may still be considered for non-safety-critical or short-lifecycle consumer wearables if inventory is available and long-term supply is secured. However, for FDA-cleared or Class II medical devices, using an obsolete component introduces significant regulatory and lifecycle risks—alternate sourcing, last-time buy commitments, and validation overhead increase. We recommend transitioning to a pin-compatible or software-compatible successor like the MAX30102 or MAX86141, which offer improved power efficiency and are actively supported with full documentation and longevity guarantees.
What are the key reliability risks when replacing the MAX86150EFF+ with the MAX30102 in a fitness tr
The MAX30102 has a different LED drive architecture and internal timing logic compared to the MAX86150EFF+, which can cause signal saturation or motion artifact sensitivity if firmware and optical stack aren’t retuned. Specifically, the MAX30102 uses a higher default LED pulse amplitude and narrower sampling window, requiring recalibration of ambient light cancellation algorithms and dynamic range settings. To mitigate risk, conduct side-by-side bench testing under motion conditions (e.g., walking, jogging) and validate SpO₂ accuracy against a clinical reference. Also verify I²C timing compatibility, as the MAX30102 has stricter rise-time requirements on SDA/SCL lines.
How does the MAX86150EFF+’s MSL 3 rating impact PCB assembly and storage in high-volume manufacturin
The MAX86150EFF+’s Moisture Sensitivity Level 3 (MSL 3) means it can be exposed to ambient conditions for up to 168 hours before reflow without requiring dry packing. However, in humid environments (>60% RH), this window shrinks significantly—exceeding it risks popcorning during reflow. For high-volume production, implement strict FIFO inventory rotation, store trays in dry cabinets (<5% RH), and bake parts at 125°C for 24 hours if exposure exceeds 72 hours. Failure to manage this can lead to latent failures manifesting as I²C communication drops or photodiode leakage currents post-assembly.
Is the MAX86150EFF+ suitable for continuous SpO₂ monitoring in a patch-based patient monitor operati
Operating the MAX86150EFF+ at its upper limit of 85°C introduces thermal drift in the photodiode responsivity and LED wavelength shift (~0.3 nm/°C), which degrades SpO₂ accuracy over time. While the part is rated for -40°C to 85°C, sustained operation near the ceiling reduces signal-to-noise ratio and increases dark current, especially in low-perfusion scenarios. For reliable continuous monitoring, derate the operating temperature to ≤70°C using thermal vias, heatsinking, or airflow. Alternatively, consider the MAX86140, which includes on-chip temperature compensation and is optimized for extended high-temperature operation in clinical patches.
What design constraints should be considered when integrating the MAX86150EFF+ into a flexible PCB w
The MAX86150EFF+ is housed in a 2x2 mm WLP (wafer-level package), which is brittle under repeated mechanical stress. In flexible PCBs with tight bend radii (<5 mm), cyclic flexing can cause microcracks in the solder joints or delamination of the die attach, leading to intermittent I²C failures or increased dark current. To mitigate this, avoid placing the sensor directly over bend zones, use strain relief with adhesive underfill (e.g., Henkel Hysol FP4550), and route traces perpendicular to the bend axis. Additionally, ensure the flexible substrate has a matched CTE to minimize thermomechanical fatigue during thermal cycling.
Can the MAX86150EFF+ still be used in new wearable medical device designs despite being marked as ob
While the MAX86150EFF+ is listed as obsolete, it may still be considered for non-safety-critical or short-lifecycle consumer wearables if inventory is available and long-term supply is secured. However, for FDA-cleared or Class II medical devices, using an obsolete component introduces significant regulatory and lifecycle risks—alternate sourcing, last-time buy commitments, and validation overhead increase. We recommend transitioning to a pin-compatible or software-compatible successor like the MAX30102 or MAX86141, which offer improved power efficiency and are actively supported with full documentation and longevity guarantees.
What are the key reliability risks when replacing the MAX86150EFF+ with the MAX30102 in a fitness tr
The MAX30102 has a different LED drive architecture and internal timing logic compared to the MAX86150EFF+, which can cause signal saturation or motion artifact sensitivity if firmware and optical stack aren’t retuned. Specifically, the MAX30102 uses a higher default LED pulse amplitude and narrower sampling window, requiring recalibration of ambient light cancellation algorithms and dynamic range settings. To mitigate risk, conduct side-by-side bench testing under motion conditions (e.g., walking, jogging) and validate SpO₂ accuracy against a clinical reference. Also verify I²C timing compatibility, as the MAX30102 has stricter rise-time requirements on SDA/SCL lines.
How does the MAX86150EFF+’s MSL 3 rating impact PCB assembly and storage in high-volume manufacturin
The MAX86150EFF+’s Moisture Sensitivity Level 3 (MSL 3) means it can be exposed to ambient conditions for up to 168 hours before reflow without requiring dry packing. However, in humid environments (>60% RH), this window shrinks significantly—exceeding it risks popcorning during reflow. For high-volume production, implement strict FIFO inventory rotation, store trays in dry cabinets (<5% RH), and bake parts at 125°C for 24 hours if exposure exceeds 72 hours. Failure to manage this can lead to latent failures manifesting as I²C communication drops or photodiode leakage currents post-assembly.
Is the MAX86150EFF+ suitable for continuous SpO₂ monitoring in a patch-based patient monitor operati
Operating the MAX86150EFF+ at its upper limit of 85°C introduces thermal drift in the photodiode responsivity and LED wavelength shift (~0.3 nm/°C), which degrades SpO₂ accuracy over time. While the part is rated for -40°C to 85°C, sustained operation near the ceiling reduces signal-to-noise ratio and increases dark current, especially in low-perfusion scenarios. For reliable continuous monitoring, derate the operating temperature to ≤70°C using thermal vias, heatsinking, or airflow. Alternatively, consider the MAX86140, which includes on-chip temperature compensation and is optimized for extended high-temperature operation in clinical patches.
What design constraints should be considered when integrating the MAX86150EFF+ into a flexible PCB w
The MAX86150EFF+ is housed in a 2x2 mm WLP (wafer-level package), which is brittle under repeated mechanical stress. In flexible PCBs with tight bend radii (<5 mm), cyclic flexing can cause microcracks in the solder joints or delamination of the die attach, leading to intermittent I²C failures or increased dark current. To mitigate this, avoid placing the sensor directly over bend zones, use strain relief with adhesive underfill (e.g., Henkel Hysol FP4550), and route traces perpendicular to the bend axis. Additionally, ensure the flexible substrate has a matched CTE to minimize thermomechanical fatigue during thermal cycling.
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Sep 15 2026
