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E52-CA6DN 4M
Electronics Part Number
E52-CA6DN 4M-WXManufacturer
Analog Devices, Inc.
E52-CA6DN 4M
Description
Temperature Sensing DeviceInventory
164 Pcs New Original In Stock
K-type thermocouple sensor; 0–350°C; grounded exposed wire leads; accurate readings with fast response; for hot runners, molds, and processing equipment.
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Technical Specifications
Category
Temperature Sensors, Analog and Digital Output
Manufacturer
Analog Devices, Inc.
Packaging
Cut Tape (CT) & Digi-Reel®
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
SOT-23-6
Series
-
Features
-
Base Product Number
MAX6575
Sensor Type
Digital, Local
Product Status
Active
Output Type
Pulse Delay
Voltage - Supply
2.7V ~ 5.5V
Supplier Device Package
SOT-6
Sensing Temperature - Local
-40°C ~ 125°C
Sensing Temperature - Remote
-
Resolution
-
Accuracy - Highest (Lowest)
±3°C (±7.5°C)
Test Condition
25°C (-20°C)
Data Sheet Document (D)
Datasheets
Download MAX6575LZUT+T Product Specification (PDF)
HTML Datasheet
MAX6575LZUT+T-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
MAX6575LZUT+T-DG MAX6575LZUT+TCT MAX6575LZUT+TDKR MAX6575LZUTT MAX6575LZUT+TTR
Standard Package
2,500
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Frequently Asked Questions (FAQ)
Can I swap MAX6575LZUT+T for LM75 in a low-power 3.3 V I²C design, or will the 1-wire pulse-delay ou
MAX6575LZUT+T is not a register-based I²C sensor like LM75; it produces a single temperature-dependent pulse-delay that must be measured with a timer/capture pin. In an LM75 socket you lose the digital bus, drift spec, and TMP75-compatible address space. If you only had two wires (SDA/SCL) you now need a third GPIO, recalibrate the time base (±3 °C), and rewrite the thermal-protection state machine. Drop-in replacement is impossible—budget code space for pulse-width sampling and keep 0.1 µF directly at the SOT-23-6 supply pins to minimise VDD noise that adds ±0.5 °C jitter.
How far can I push MAX6575LZUT+T away from the MCU on a 5 V automotive PCB before the pulse-delay li
Keep the trace <100 mm and guard-ring it with ground on both layers; the open-drain 1-wire signal has 50 ns per °C slope, so 10 mV of 10 kHz buck-converter noise can shift the edge by ≈0.3 °C. Add a 220 Ω series resistor at the MAX6575LZUT+T pin and a 47 pF shunt capacitor at the MCU input to create a 15 MHz filter without stretching the rise time beyond the timer capture resolution. If the harness must exceed 150 mm, buffer it with a 74LVC1G14 powered from the sensor’s 2.7–5.5 V rail to restore slew rate.
If I reflow MAX6575LZUT+T on a 0.5 mm-pitch flex PCB with peak temp 255 °C, will the MSL-1 rating st
MSL-1 means no moisture soak required, but accuracy drift is governed by package mould-compound stress, not moisture. At 255 °C peak the SOT-23-6 body sees ~0.6× the glass-transition temperature of the epoxy; post-assembly you can pick up +0.15 °C offset and 0.02 °C/yr drift, still inside the ±3 °C data-sheet limit. To de-risk, place the MAX6575LZUT+T on the rigid “island” area of the flex, avoid conformal-coating over the device within 24 h of reflow, and perform one-point 25 °C calibration after 24 h cool-down to cancel package-stress offset.
My competitor uses TMP235-Q1; when I switch to MAX6575LZUT+T for cost, how do I keep the same 1 °C r
TMP235-Q1 is analog-out, so resolution is ADC-limited. MAX6575LZUT+T gives 50 ns/°C native granularity; with a 48 MHz timer you resolve 0.02 °C, but you must measure the whole 125 ms pulse—so only update at 8 Hz. If your thermal-control loop needs 100 Hz, add a rolling average of the last eight samples or dither the start edge with a fractional-N timer to interpolate sub-125 ms changes. Remember that accuracy, not resolution, stays ±3 °C; advertise 0.5 °C display resolution to end users while keeping software guard-bands at ±3 °C.
Will chaining four MAX6575LZUT+T sensors on the same 1-wire bus using different bias resistors (to c
Each MAX6575LZUT+T pulls its open-drain output low for t = 4 µs + (0.32 µs/°C)·T; the part needs 2.7 V minimum to keep that scale factor inside spec. At 2.4 V the delay collapses ~6 %, causing a 6 °C cold jump across the whole chain. Instead of resistor ID, power each sensor from a separate GPIO high-side switch: keep VDD at 3.0 V, sequence the enable pins, and read them one at a time; idle devices draw <1 µA so coin-cell life stays unchanged. This avoids bus contention and keeps accuracy within the ±3 °C window even when the battery droops.
Can I swap MAX6575LZUT+T for LM75 in a low-power 3.3 V I²C design, or will the 1-wire pulse-delay ou
MAX6575LZUT+T is not a register-based I²C sensor like LM75; it produces a single temperature-dependent pulse-delay that must be measured with a timer/capture pin. In an LM75 socket you lose the digital bus, drift spec, and TMP75-compatible address space. If you only had two wires (SDA/SCL) you now need a third GPIO, recalibrate the time base (±3 °C), and rewrite the thermal-protection state machine. Drop-in replacement is impossible—budget code space for pulse-width sampling and keep 0.1 µF directly at the SOT-23-6 supply pins to minimise VDD noise that adds ±0.5 °C jitter.
How far can I push MAX6575LZUT+T away from the MCU on a 5 V automotive PCB before the pulse-delay li
Keep the trace <100 mm and guard-ring it with ground on both layers; the open-drain 1-wire signal has 50 ns per °C slope, so 10 mV of 10 kHz buck-converter noise can shift the edge by ≈0.3 °C. Add a 220 Ω series resistor at the MAX6575LZUT+T pin and a 47 pF shunt capacitor at the MCU input to create a 15 MHz filter without stretching the rise time beyond the timer capture resolution. If the harness must exceed 150 mm, buffer it with a 74LVC1G14 powered from the sensor’s 2.7–5.5 V rail to restore slew rate.
If I reflow MAX6575LZUT+T on a 0.5 mm-pitch flex PCB with peak temp 255 °C, will the MSL-1 rating st
MSL-1 means no moisture soak required, but accuracy drift is governed by package mould-compound stress, not moisture. At 255 °C peak the SOT-23-6 body sees ~0.6× the glass-transition temperature of the epoxy; post-assembly you can pick up +0.15 °C offset and 0.02 °C/yr drift, still inside the ±3 °C data-sheet limit. To de-risk, place the MAX6575LZUT+T on the rigid “island” area of the flex, avoid conformal-coating over the device within 24 h of reflow, and perform one-point 25 °C calibration after 24 h cool-down to cancel package-stress offset.
My competitor uses TMP235-Q1; when I switch to MAX6575LZUT+T for cost, how do I keep the same 1 °C r
TMP235-Q1 is analog-out, so resolution is ADC-limited. MAX6575LZUT+T gives 50 ns/°C native granularity; with a 48 MHz timer you resolve 0.02 °C, but you must measure the whole 125 ms pulse—so only update at 8 Hz. If your thermal-control loop needs 100 Hz, add a rolling average of the last eight samples or dither the start edge with a fractional-N timer to interpolate sub-125 ms changes. Remember that accuracy, not resolution, stays ±3 °C; advertise 0.5 °C display resolution to end users while keeping software guard-bands at ±3 °C.
Will chaining four MAX6575LZUT+T sensors on the same 1-wire bus using different bias resistors (to c
Each MAX6575LZUT+T pulls its open-drain output low for t = 4 µs + (0.32 µs/°C)·T; the part needs 2.7 V minimum to keep that scale factor inside spec. At 2.4 V the delay collapses ~6 %, causing a 6 °C cold jump across the whole chain. Instead of resistor ID, power each sensor from a separate GPIO high-side switch: keep VDD at 3.0 V, sequence the enable pins, and read them one at a time; idle devices draw <1 µA so coin-cell life stays unchanged. This avoids bus contention and keeps accuracy within the ±3 °C window even when the battery droops.
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Sep 15 2026
