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OSD32MP153A-512M-BAA
Electronics Part Number
OSD32MP153A-512M-BAA-WXManufacturer
Analog Devices, Inc.
OSD32MP153A-512M-BAA
Description
SIP, 153A Package, 512MB, BAAInventory
299 Pcs New Original In Stock
Embedded module; dual Cortex-A7 + M4; 650MHz; 512MB RAM.
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Minimum 1
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Basic cost: USD 70.00
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Technical Specifications
Category
Interface, Serializers, Deserializers
Manufacturer
Analog Devices, Inc.
Packaging
-
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
56-WFQFN Exposed Pad
Series
-
Base Product Number
MAX9275
Product Status
Active
Output Type
CML
Number of Outputs
1
Voltage - Supply
1.7V ~ 1.9V
Function
Serializer
Input Type
LVCMOS
Supplier Device Package
56-TQFN (8x8)
Data Rate
3.12Gbps
Number of Inputs
28
Data Sheet Document (D)
Datasheets
Download MAX9275GTN/V+T Product Specification (PDF)
HTML Datasheet
MAX9275GTN/V+T-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Standard Package
2,500
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Frequently Asked Questions (FAQ)
How does the MAX9275GTN/V+T handle signal integrity when driving high-speed CML outputs over long PC
The MAX9275GTN/V+T outputs 3.12Gbps CML signals that are sensitive to impedance mismatches and parasitic discontinuities. To maintain signal integrity, use controlled-impedance traces (typically 100Ω differential), minimize vias and stubs, and terminate within 2–3mm of the receiver input. Avoid sharp bends and cross splits in the reference plane. For longer traces beyond 10cm, consider adding AC coupling capacitors close to the receiver and validate with SI simulation or TDR measurements to prevent jitter and EMI issues in safety-critical ADAS systems.
Can the MAX9275GTN/V+T be used as a drop-in replacement for the MAX9273 in existing GMSL1 designs, a
While the MAX9275GTN/V+T and MAX9273 are both GMSL serializers, they are not drop-in compatible. The MAX9275GTN/V+T supports higher data rates (3.12Gbps) and has 28 LVCMOS inputs vs. 24 on the MAX9273, requiring redesign of input routing and timing setup. Additionally, power supply sequencing and lock detect behavior differ. Migrating requires revalidation of link stability, especially in multiplexed sensor interfaces, and may need adjustments in FPGA GPIO mapping and firmware initialization routines.
What thermal management considerations are critical when using the MAX9275GTN/V+T in a sealed automo
The MAX9275GTN/V+T operates at up to 105°C ambient, but its 56-TQFN (8x8) package requires adequate PCB thermal dissipation. Use a minimum 4-layer board with a solid thermal via array (≥9 vias, 0.3mm diameter) under the exposed pad connected to an internal ground plane. Avoid placing heat-generating components nearby. For sealed enclosures, ensure the total power dissipation (including 1.8V supply and CML load) keeps the junction temperature below 125°C, especially under sustained 3.12Gbps operation, to prevent thermal throttling or long-term reliability degradation.
How does input timing skew across the 28 LVCMOS channels affect serialization performance in the MAX
Excessive skew across the 28 LVCMOS inputs of the MAX9275GTN/V+T can cause data misalignment and CRC errors at 3.12Gbps. Maintain skew within ±150ps across all data lines by matching trace lengths within 2mm and using identical routing topology (e.g., serpentine tuning if needed). Synchronize clock and data paths by following source-synchronous design rules. Use series termination near the source to damp reflections, and verify timing margins with a high-bandwidth oscilloscope during prototype testing to ensure robust performance in multi-sensor fusion systems.
What are the reliability risks of not following the MSL 3 handling requirements for the MAX9275GTN/V
The MAX9275GTN/V+T has a Moisture Sensitivity Level 3 (168-hour floor life), meaning exposure to ambient humidity beyond this risks 'popcorning' during reflow. To mitigate, store in dry bags with desiccant below 30°C/60% RH. If floor life is exceeded, bake at 125°C for 24 hours before assembly. Use a controlled reflow profile with preheat ramp ≤3°C/sec to prevent thermal shock. Skipping these steps increases risk of internal delamination and early field failures in automotive environments where long-term reliability is critical.
How does the MAX9275GTN/V+T handle signal integrity when driving high-speed CML outputs over long PC
The MAX9275GTN/V+T outputs 3.12Gbps CML signals that are sensitive to impedance mismatches and parasitic discontinuities. To maintain signal integrity, use controlled-impedance traces (typically 100Ω differential), minimize vias and stubs, and terminate within 2–3mm of the receiver input. Avoid sharp bends and cross splits in the reference plane. For longer traces beyond 10cm, consider adding AC coupling capacitors close to the receiver and validate with SI simulation or TDR measurements to prevent jitter and EMI issues in safety-critical ADAS systems.
Can the MAX9275GTN/V+T be used as a drop-in replacement for the MAX9273 in existing GMSL1 designs, a
While the MAX9275GTN/V+T and MAX9273 are both GMSL serializers, they are not drop-in compatible. The MAX9275GTN/V+T supports higher data rates (3.12Gbps) and has 28 LVCMOS inputs vs. 24 on the MAX9273, requiring redesign of input routing and timing setup. Additionally, power supply sequencing and lock detect behavior differ. Migrating requires revalidation of link stability, especially in multiplexed sensor interfaces, and may need adjustments in FPGA GPIO mapping and firmware initialization routines.
What thermal management considerations are critical when using the MAX9275GTN/V+T in a sealed automo
The MAX9275GTN/V+T operates at up to 105°C ambient, but its 56-TQFN (8x8) package requires adequate PCB thermal dissipation. Use a minimum 4-layer board with a solid thermal via array (≥9 vias, 0.3mm diameter) under the exposed pad connected to an internal ground plane. Avoid placing heat-generating components nearby. For sealed enclosures, ensure the total power dissipation (including 1.8V supply and CML load) keeps the junction temperature below 125°C, especially under sustained 3.12Gbps operation, to prevent thermal throttling or long-term reliability degradation.
How does input timing skew across the 28 LVCMOS channels affect serialization performance in the MAX
Excessive skew across the 28 LVCMOS inputs of the MAX9275GTN/V+T can cause data misalignment and CRC errors at 3.12Gbps. Maintain skew within ±150ps across all data lines by matching trace lengths within 2mm and using identical routing topology (e.g., serpentine tuning if needed). Synchronize clock and data paths by following source-synchronous design rules. Use series termination near the source to damp reflections, and verify timing margins with a high-bandwidth oscilloscope during prototype testing to ensure robust performance in multi-sensor fusion systems.
What are the reliability risks of not following the MSL 3 handling requirements for the MAX9275GTN/V
The MAX9275GTN/V+T has a Moisture Sensitivity Level 3 (168-hour floor life), meaning exposure to ambient humidity beyond this risks 'popcorning' during reflow. To mitigate, store in dry bags with desiccant below 30°C/60% RH. If floor life is exceeded, bake at 125°C for 24 hours before assembly. Use a controlled reflow profile with preheat ramp ≤3°C/sec to prevent thermal shock. Skipping these steps increases risk of internal delamination and early field failures in automotive environments where long-term reliability is critical.
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Sep 15 2026
