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5-583616-2
Electronics Part Number
5-583616-2-WXManufacturer
TE Connectivity AMP Connectors
5-583616-2
Description
Twin-leaf LF edge terminal, 24-28 AWG, crimp type.Inventory
401 Pcs New Original In Stock
Gold edge terminal, 24-28 AWG, crimp, non-gendered. Oxidation-resistant, low-resistance contact for card-edge PCBs.
Quantity
Minimum 1
Minimum 1
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Freight
Basic cost: USD 70.00
Actual cost may vary depending on weight and destination
Shipping method
Shipped from Hong Kong via FedEx/DHL/UPS/TNT
Delivery Time
In-stock items: Ready to ship in 1-2 days
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Technical Specifications
Category
Card Edge Connectors, Card Edge Connector Contacts
Manufacturer
TE Connectivity AMP Connectors
Packaging
-
Series
TWIN LEAF
Base Product Number
583616
Product Status
Active
Contact Termination
Crimp
Wire Gauge
24-28 AWG
Contact Finish
Gold
Contact Material
Phosphor Bronze
Contact Finish Thickness
30.0µin (0.76µm)
Pin or Socket
Non-Gendered
Data Sheet Document (D)
Datasheets
Download 5-583616-2 Product Specification (PDF)
Product Drawings
583616 Drawing
HTML Datasheet
5-583616-2-DG
Environmental & Export Classification
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8536.90.4000
Additional Information
Other Names
-5-583616-2-SI 5-583616-2-DG -2-42930-4452-SI-DG 2-42930-4452 -2-42930-4452-SI A111321CT A111321TR
Standard Package
28,000
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Frequently Asked Questions (FAQ)
What are the key design-in risks when using the 5-583616-2 in a high-vibration industrial applicatio
When designing the 5-583616-2 into high-vibration environments, the primary risk is potential loosening of the crimp connection or intermittent contact due to mechanical stress on the phosphor bronze contacts. Although the connector is rated for 24–28 AWG crimp termination and features gold plating (0.76µm), its twin leaf contact design may require additional strain relief on the wire harness. To mitigate risks, use overmolding or adhesive-backed strain reliefs near the crimp point and ensure consistent crimp force during assembly. Consider periodic field inspection for wear, especially if used in repetitive flexing or shock-prone conditions typical in automation or transportation systems.
Can the 5-583616-2 be reliably used as a direct replacement for Molex 50-58-9214 in a legacy PCB edg
The 5-583616-2 can serve as a potential drop-in replacement for the Molex 50-58-9214 in card edge applications, but critical mechanical tolerances must be validated. Verify the PCB thickness compatibility—both are designed for 0.062 inch (1.57 mm) boards—but check the mating height and insertion force profile, as TE Connectivity’s TWIN LEAF design may exhibit slightly different spring characteristics than Molex’s design. Additionally, confirm lead-in chamfers and alignment features to prevent PCB damage during insertion. Always perform a mechanical fit test with a prototype PCB before full deployment.
How does the 30µin gold plating on the 5-583616-2 contacts affect long-term reliability in low-volta
The 30µin (0.76µm) gold plating on the phosphor bronze contacts of the 5-583616-2 provides excellent corrosion resistance and stable contact resistance for low-voltage analog or digital signals, especially in environments with temperature cycling or moderate humidity. Since the connector is non-gendered and intended for crimp termination, this plating thickness ensures reliable performance over hundreds of mating cycles. For infrequent mating (e.g., field service or configuration changes), the gold layer prevents fretting corrosion. However, avoid use in high-current or high-arc environments, as the thin plating and crimp-only termination are not designed for power load switching.
What crimp tooling is recommended for the 5-583616-2 to avoid wire pull-out or contact damage during
To ensure reliable crimps with the 5-583616-2, use TE Connectivity-approved crimp tools such as the AMPMODU MOD IV or compatible precision ratcheting crimpers calibrated for 24–28 AWG wires on phosphor bronze terminals. Incorrect tool selection, like using standard hand tools without force control, can result in under-crimping (leading to wire pull-out) or over-crimping (cracking the barrel or deforming contact geometry). Always validate crimp quality with pull testing (per IPC/WHMA-A-620) and monitor cross-sectional integrity in sampling. Use insulated crimp contacts if environmental exposure is expected.
What are the limitations of the 5-583616-2 when integrating into a mixed-signal PCB stack-up with ad
The 5-583616-2 lacks integrated shielding and controlled impedance characteristics, making it unsuitable for direct use in high-speed signal paths (e.g., USB, Ethernet, or >100 MHz digital signals). When used in mixed-signal designs, crosstalk and EMI coupling can occur if analog signal lines routed near the 5-583616-2 terminals run parallel to noisy digital traces. To reduce interference, maintain a minimum 3W spacing rule between connector pins and high-speed routes, use ground stitching vias around the connector footprint, and limit its use to low-frequency signals (<10 MHz) or power/IO lines. Always consider signal integrity simulations if the board operates in noisy RF environments.
What are the key design-in risks when using the 5-583616-2 in a high-vibration industrial applicatio
When designing the 5-583616-2 into high-vibration environments, the primary risk is potential loosening of the crimp connection or intermittent contact due to mechanical stress on the phosphor bronze contacts. Although the connector is rated for 24–28 AWG crimp termination and features gold plating (0.76µm), its twin leaf contact design may require additional strain relief on the wire harness. To mitigate risks, use overmolding or adhesive-backed strain reliefs near the crimp point and ensure consistent crimp force during assembly. Consider periodic field inspection for wear, especially if used in repetitive flexing or shock-prone conditions typical in automation or transportation systems.
Can the 5-583616-2 be reliably used as a direct replacement for Molex 50-58-9214 in a legacy PCB edg
The 5-583616-2 can serve as a potential drop-in replacement for the Molex 50-58-9214 in card edge applications, but critical mechanical tolerances must be validated. Verify the PCB thickness compatibility—both are designed for 0.062 inch (1.57 mm) boards—but check the mating height and insertion force profile, as TE Connectivity’s TWIN LEAF design may exhibit slightly different spring characteristics than Molex’s design. Additionally, confirm lead-in chamfers and alignment features to prevent PCB damage during insertion. Always perform a mechanical fit test with a prototype PCB before full deployment.
How does the 30µin gold plating on the 5-583616-2 contacts affect long-term reliability in low-volta
The 30µin (0.76µm) gold plating on the phosphor bronze contacts of the 5-583616-2 provides excellent corrosion resistance and stable contact resistance for low-voltage analog or digital signals, especially in environments with temperature cycling or moderate humidity. Since the connector is non-gendered and intended for crimp termination, this plating thickness ensures reliable performance over hundreds of mating cycles. For infrequent mating (e.g., field service or configuration changes), the gold layer prevents fretting corrosion. However, avoid use in high-current or high-arc environments, as the thin plating and crimp-only termination are not designed for power load switching.
What crimp tooling is recommended for the 5-583616-2 to avoid wire pull-out or contact damage during
To ensure reliable crimps with the 5-583616-2, use TE Connectivity-approved crimp tools such as the AMPMODU MOD IV or compatible precision ratcheting crimpers calibrated for 24–28 AWG wires on phosphor bronze terminals. Incorrect tool selection, like using standard hand tools without force control, can result in under-crimping (leading to wire pull-out) or over-crimping (cracking the barrel or deforming contact geometry). Always validate crimp quality with pull testing (per IPC/WHMA-A-620) and monitor cross-sectional integrity in sampling. Use insulated crimp contacts if environmental exposure is expected.
What are the limitations of the 5-583616-2 when integrating into a mixed-signal PCB stack-up with ad
The 5-583616-2 lacks integrated shielding and controlled impedance characteristics, making it unsuitable for direct use in high-speed signal paths (e.g., USB, Ethernet, or >100 MHz digital signals). When used in mixed-signal designs, crosstalk and EMI coupling can occur if analog signal lines routed near the 5-583616-2 terminals run parallel to noisy digital traces. To reduce interference, maintain a minimum 3W spacing rule between connector pins and high-speed routes, use ground stitching vias around the connector footprint, and limit its use to low-frequency signals (<10 MHz) or power/IO lines. Always consider signal integrity simulations if the board operates in noisy RF environments.
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Sep 15 2026
