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1473006-1
Electronics Part Number
1473006-1-WXManufacturer
TE Connectivity AMP Connectors
1473006-1
Description
SODIMM Connector, 200POS, Right Angle, SMDInventory
689 Pcs New Original In Stock
200-pin SODIMM DDR socket, SMD. Low-profile, secure lock. Consistent memory performance, space-saving. For laptops, ultrabooks, embedded systems.
Quantity
Minimum 1
Minimum 1
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Freight
Basic cost: USD 70.00
Actual cost may vary depending on weight and destination
Shipping method
Shipped from Hong Kong via FedEx/DHL/UPS/TNT
Delivery Time
In-stock items: Ready to ship in 1-2 days
Transit time: 3-5 business days (FedEx/DHL/UPS)
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Technical Specifications
Category
Memory Connectors, Inline Module Sockets
Manufacturer
TE Connectivity AMP Connectors
Packaging
Tray
Color
-
Mounting Type
Surface Mount
Series
-
Features
Board Guide, Latches
Base Product Number
1473005
Product Status
Active
Number of Positions
200
Contact Finish
Gold
Connector Style
SODIMM
Contact Finish Thickness
Flash
Mounting Feature
Normal, Standard - Top
Card Thickness
0.039" (1.00mm)
Height
0.205" (5.20mm)
Memory Type
DDR2 SDRAM
Standards
-
Insertion Angle
25° Angle
Data Sheet Document (D)
Datasheets
Download 1473005-4 Product Specification (PDF)
Product Drawings
1473005 Drawing
HTML Datasheet
1473005-4-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.8000
Additional Information
Other Names
-1473005-4-CSI 1473005-4-DG -1473005-4-LSI A114851 -1473005-4-SI
Standard Package
20
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Frequently Asked Questions (FAQ)
What are the main design risks when using the 1473005-4 SODIMM socket in a high-vibration environmen
When using the 1473005-4 SODIMM socket in high-vibration applications, reliance solely on solder joints for retention increases the risk of fatigue failure. Although the connector includes latches and board guides, long-term mechanical stress can still compromise the SMD joints. To mitigate this, ensure full reflow profiling per IPC standards, consider supplemental mechanical support like localized potting or retention clips near the socket ends, and avoid cantilevered PCB layouts. Additionally, validate mounting integrity through thermal cycling and mechanical shock testing during design validation for mission-critical systems.
Can the 1473005-4 replace the Molex 47103-0001 in a DDR2 SODIMM design, and what integration issues
While both the 1473005-4 and Molex 47103-0001 support 200-position DDR2 SODIMM modules, direct replacement requires careful mechanical and layout verification. Key integration risks include differences in latch mechanism geometry, footprint pad spacing, and insertion angle (25° for the 1473005-4). Confirm keep-out zones for the latch swing and ensure the board cutout matches the new housing. Also verify that the contact wipe and insertion force curves match expected field service life, especially if frequent module swaps are anticipated. Always review 3D STEP models and conduct a prototype fit-check before committing to redesign.
How does the flash gold plating on the 1473005-4 contacts affect long-term reliability in industrial
The flash gold plating on the 1473005-4 provides sufficient corrosion resistance for typical commercial and light industrial environments, but may be marginal under sustained high-temperature cycling (e.g., >50,000 mating cycles or operation above 70°C with humidity). In such cases, the thin gold layer can wear through, exposing the underlying nickel and increasing contact resistance. For harsh environments, consider conformal coating to reduce oxidation or evaluate higher-end variants with thicker gold finishes. Monitor contact resistance during HALT testing, and ensure strict control of assembly handling to avoid contamination that accelerates wear.
What PCB layout guidelines should be followed for the 1473005-4 to ensure reliable reflow soldering
To ensure reliable SMD reflow for the 1473005-4, follow TE Connectivity’s recommended footprint with balanced thermal pads and avoid asymmetric copper pours that cause uneven heating. Use solder mask-defined (SMD) pads with controlled stencil thickness (typically 0.10–0.12mm) to prevent excessive solder paste volume. Ensure tight tolerance on fiducials and use vacuum pick-and-place alignment due to the long 200-position body. Include thermal reliefs on ground-connected pads to prevent solder starvation, and perform AOI post-reflow to detect skew or tombstoning, especially near the latch mounting areas which are critical for mechanical strength.
Is the 1473005-4 suitable for use with DDR3 SODIMM modules in backward-compatible designs, and what
The 1473005-4 is designed specifically for DDR2 SODIMM modules and is not recommended for DDR3 modules, even though physical insertion may appear possible. Key risks include mismatched voltage levels (DDR2: 1.8V vs DDR3: 1.5V), different keying notches, and contact force variations that may lead to intermittent connections or contact damage. Using the 1473005-4 with DDR3 modules violates JEDEC specifications and can result in data corruption or premature wear. Always match the connector memory type rating exactly—replace with a DDR3-rated socket like the TE 1473006-4 if upgrading the memory standard.
What are the main design risks when using the 1473005-4 SODIMM socket in a high-vibration environmen
When using the 1473005-4 SODIMM socket in high-vibration applications, reliance solely on solder joints for retention increases the risk of fatigue failure. Although the connector includes latches and board guides, long-term mechanical stress can still compromise the SMD joints. To mitigate this, ensure full reflow profiling per IPC standards, consider supplemental mechanical support like localized potting or retention clips near the socket ends, and avoid cantilevered PCB layouts. Additionally, validate mounting integrity through thermal cycling and mechanical shock testing during design validation for mission-critical systems.
Can the 1473005-4 replace the Molex 47103-0001 in a DDR2 SODIMM design, and what integration issues
While both the 1473005-4 and Molex 47103-0001 support 200-position DDR2 SODIMM modules, direct replacement requires careful mechanical and layout verification. Key integration risks include differences in latch mechanism geometry, footprint pad spacing, and insertion angle (25° for the 1473005-4). Confirm keep-out zones for the latch swing and ensure the board cutout matches the new housing. Also verify that the contact wipe and insertion force curves match expected field service life, especially if frequent module swaps are anticipated. Always review 3D STEP models and conduct a prototype fit-check before committing to redesign.
How does the flash gold plating on the 1473005-4 contacts affect long-term reliability in industrial
The flash gold plating on the 1473005-4 provides sufficient corrosion resistance for typical commercial and light industrial environments, but may be marginal under sustained high-temperature cycling (e.g., >50,000 mating cycles or operation above 70°C with humidity). In such cases, the thin gold layer can wear through, exposing the underlying nickel and increasing contact resistance. For harsh environments, consider conformal coating to reduce oxidation or evaluate higher-end variants with thicker gold finishes. Monitor contact resistance during HALT testing, and ensure strict control of assembly handling to avoid contamination that accelerates wear.
What PCB layout guidelines should be followed for the 1473005-4 to ensure reliable reflow soldering
To ensure reliable SMD reflow for the 1473005-4, follow TE Connectivity’s recommended footprint with balanced thermal pads and avoid asymmetric copper pours that cause uneven heating. Use solder mask-defined (SMD) pads with controlled stencil thickness (typically 0.10–0.12mm) to prevent excessive solder paste volume. Ensure tight tolerance on fiducials and use vacuum pick-and-place alignment due to the long 200-position body. Include thermal reliefs on ground-connected pads to prevent solder starvation, and perform AOI post-reflow to detect skew or tombstoning, especially near the latch mounting areas which are critical for mechanical strength.
Is the 1473005-4 suitable for use with DDR3 SODIMM modules in backward-compatible designs, and what
The 1473005-4 is designed specifically for DDR2 SODIMM modules and is not recommended for DDR3 modules, even though physical insertion may appear possible. Key risks include mismatched voltage levels (DDR2: 1.8V vs DDR3: 1.5V), different keying notches, and contact force variations that may lead to intermittent connections or contact damage. Using the 1473005-4 with DDR3 modules violates JEDEC specifications and can result in data corruption or premature wear. Always match the connector memory type rating exactly—replace with a DDR3-rated socket like the TE 1473006-4 if upgrading the memory standard.
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Sep 15 2026
